Patents by Inventor Naoya Etou

Naoya Etou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060265206
    Abstract: A laser emitter projects a planer light beam to form an optical guideline on a work piece extending in a cutting direction of saw blade. The laser emitter is arranged behind, in the cutting direction, a tangential line of the circumference of the saw blade at an intersection of a bottom surface of the base and the circumference at a front side of the base in the cutting direction. The laser emitter forms the optical guideline behind the intersection in the cutting direction. The laser emitter is supported in respect of the saw blade slidingly in a direction defined by a rotation axis of the saw blade. The saw cover may have a window to transmit the laser beam toward the cutting point. A shutter selectively shutting the window may be provided.
    Type: Application
    Filed: July 31, 2006
    Publication date: November 23, 2006
    Applicant: HITACHI KOKI CO., LTD.
    Inventors: Akira Onose, Naoya Etou, Shinji Takano
  • Patent number: 7096587
    Abstract: A laser emitter projects a planer light beam to form an optical guideline on a work piece extending in a cutting direction of saw blade. The laser emitter is arranged behind, in the cutting direction, a tangential line of the circumference of the saw blade at an intersection of a bottom surface of the base and the circumference at a front side of the base in the cutting direction. The laser emitter forms the optical guideline behind the intersection in the cutting direction. The laser emitter is supported in respect of the saw blade slidingly in a direction defined by a rotation axis of the saw blade. The saw cover may have a window to transmit the laser beam toward the cutting point. A shutter selectively shutting the window may be provided.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: August 29, 2006
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Akira Onose, Naoya Etou, Shinji Takano
  • Publication number: 20030047050
    Abstract: A laser emitter projects a planer light beam to form an optical guideline on a work piece extending in a cutting direction of saw blade. The laser emitter is arranged behind, in the cutting direction, a tangential line of the circumference of the saw blade at an intersection of a bottom surface of the base and the circumference at a front side of the base in the cutting direction. The laser emitter forms the optical guideline behind the intersection in the cutting direction. The laser emitter is supported in respect of the saw blade slidingly in a direction defined by a rotation axis of the saw blade. The saw cover may have a window to transmit the laser beam toward the cutting point. A shutter selectively shutting the window may be provided.
    Type: Application
    Filed: August 26, 2002
    Publication date: March 13, 2003
    Applicant: Hitachi Koki Co., Ltd.
    Inventors: Akira Onose, Naoya Etou, Shinji Takano
  • Patent number: D484381
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: December 30, 2003
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Kenichi Yamada, Naoya Etou
  • Patent number: D485147
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: January 13, 2004
    Assignee: Hitachi Koki Co., Ltd.
    Inventors: Kenichi Yamada, Naoya Etou