Patents by Inventor Naoya Hamada

Naoya Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119475
    Abstract: An information processing device includes a processor configured to provide an incentive to a first user who sells or returns a first vehicle in which a part of a first coating film including an easily peelable layer is not peeled off.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yukinori II, Kenji YAMAGUCHI, Junya OGAWA, Yuki NAGANUMA, Junya YAMAMOTO, Yuta TONE, Naoki ISHIZUKA, Tadayuki TANAKA, Keisuke ITO, Yuka YOKOI, Takashi HAYASHI, Naoya OKA, Yu HAMADA
  • Patent number: 11267204
    Abstract: The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: March 8, 2022
    Assignee: TAISEI LAMICK CO., LTD.
    Inventors: Naoki Yokoyama, Naoya Hamada, Tomohiro Shibasaki
  • Publication number: 20200223151
    Abstract: The present invention relates to a band-like joint tape for covering a butting portion formed by butting an end portion of a one packing film to an end portion of another packing film and connecting the respective end portions of these packing films to each other. The joint tape is comprised of a laminate film formed by adhering a joint layer to a support layer at a peelable state, and covered so as to face the joint portion. to the butting portion and heat-sealed so that the joint layer is fused to the butting portion and the fused portion of the joint layer is peeled off from the support layer.
    Type: Application
    Filed: September 24, 2019
    Publication date: July 16, 2020
    Applicant: TAISEI LAMICK CO., LTD.
    Inventors: Naoki YOKOYAMA, Naoya HAMADA, Tomohiro SHIBASAKI
  • Patent number: 8525045
    Abstract: A Faraday cage includes a casing structured by a first housing having a first outer cover made of a conductive material, and a first inner cover made of a conductive material, which is accommodated in the first outer cover and is electrically insulated from the first outer cover, and a second housing having a second outer cover made of a conductive material, which fits the first outer cover, and a second inner cover made of a conductive material, which is accommodated in the second outer cover and is electrically insulated from the second outer cover, the first and second housings being separable from each other; and a filter cartridge disposed inside the casing configured to be separable into two pieces, which accommodates therein a first filter for collecting fine particles sucked in from the outside the casing.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: September 3, 2013
    Assignee: U-TEC Corporation
    Inventors: Chiseki Yamaguchi, Naoya Hamada, Shunsuke Umezawa, Takuo Wariishi, Tomohiro Kamitani, Naoki Moribe
  • Publication number: 20110100701
    Abstract: A Faraday cage includes a casing structured by a first housing having a first outer cover made of a conductive material, and a first inner cover made of a conductive material, which is accommodated in the first outer cover and is electrically insulated from the first outer cover, and a second housing having a second outer cover made of a conductive material, which fits the first outer cover, and a second inner cover made of a conductive material, which is accommodated in the second outer cover and is electrically insulated from the second outer cover, the first and second housings being separable from each other; and a filter cartridge disposed inside the casing configured to be separable into two pieces, which accommodates therein a first filter for collecting fine particles sucked in from the outside the casing.
    Type: Application
    Filed: June 24, 2009
    Publication date: May 5, 2011
    Applicant: U-TEC CORPORATION
    Inventors: Chiseki Yamaguchi, Naoya Hamada, Shunsuke Umezawa, Takuo Wariishi, Tomohiro Kamitani, Naoki Moribe
  • Patent number: 7653115
    Abstract: A semiconductor laser device with the energy density increased at the focal point and a LD pumped solid-state laser device configured of the particular semiconductor laser device are provided. A stack array laser element for radiating a two-dimensional array of laser beams includes a plurality of parallel laser beam columns each aligned in the form of dotted lines. In front of the stack array laser element, each laser beam column collimated by being refracted in the direction substantially perpendicular to the direction of the dotted line is received, and radiated by turning at right angles to the direction of the laser beams from each emitter or emitter group. In this way, the laser beams are converted into a plurality of substantially ladder-shaped parallel laser beam columns. These parallel laser beam columns are compressed to form parallel laser beam columns in alignment. Each compressed one of parallel laser beam columns is turned at right angles and radiated.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: January 26, 2010
    Assignees: Nippon Steel Corporation, Nippon Bunri University School of Engineering
    Inventors: Satoshi Yamaguchi, Naoya Hamada
  • Patent number: 7442260
    Abstract: The present invention provides a grain-oriented electrical steel sheet with an extremely low core loss by scanning by a small focused laser beam spot and a method of production of the same, that is, a grain-oriented electrical steel sheet improved in electrical characteristics by scanning by a continuous wave fiber laser of the TEM00 mode with a wavelength ? of 1.07???2.10 ?m substantially perpendicular to the steel sheet rolling direction and at substantially constant spacing and a method of production of the same, wherein a rolling direction focused spot diameter d (mm) of the irradiated beam, a linear scan rate V (mm/s) of the laser beam, an average output P (W) of the laser, a width of the formed laser scribing traces or with of the electrical domains Wl (mm), and a rolling direction Pl (mm) of the laser scribing traces are in the following ranges: 0<d?0.20 0.001?P/V?0.012 0<Wl?0.20 1.5?Pl?11.0.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: October 28, 2008
    Assignee: Nippon Steel Corooration
    Inventors: Tatsuhiko Sakai, Hideyuki Hamamura, Naoya Hamada
  • Patent number: 7230968
    Abstract: A semiconductor laser device including a laser element stack array emitting a two-dimensional array shaped group of laser beams consisting of rows of laser beams arranged linearly in parallel in a broken line configuration and optical elements arranged in front of the array, receiving rows of laser beams bent and collimated in a direction substantially perpendicular to the orientation of the broken line configuration. Laser beams are emitted from emitters or groups of emitters and are rotated by right angles so as to convert the laser beams to a plurality of rows aligned in parallel in an approximate ladder rung configuration and the distance between center axes of the rows of laser beams is shortened to condense the laser beams by converting them to a group of laser beams emitted from a common object and thereby making all laser beams converge to a single image.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: June 12, 2007
    Assignee: Nippon Steel Corporation
    Inventors: Hirofumi Imai, Naoya Hamada, Motoi Kido, Tatsuhiko Sakai, Atsushi Sugihashi, Hideyuki Hamamura, Satoshi Yamaguchi
  • Patent number: 7159641
    Abstract: A cooling drum for metal cast strip by continuous casting has dimples 40 to 200 ?m in average depth and 0.5 to 3 mm in diameter of circle equivalent formed on a plated peripheral surface of the cooling drum, adjacent to each other at rims of the dimples; and a film, containing oxides of at least one member selected from the group consisting of Ni—W, Ni—Co—W, Cr, Ni—Fe and Ni—Al, is formed on the peripheral surface.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: January 9, 2007
    Assignee: Nippon Steel Corporation
    Inventors: Hideaki Yamamura, Naoya Hamada, Tadahiro Izu, Yasushi Kurisu, Isao Suichi, Masafumi Miyazaki, Kazumi Seki, Eiichi Takeuchi, Mamoru Yamada, Hideki Oka, Yasuo Maruki, Eiichiro Ishimaru, Mitsuru Nakayama
  • Publication number: 20060169362
    Abstract: The present invention provides a grain-oriented electrical steel sheet with an extremely low core loss by scanning by a small focused laser beam spot and a method of production of the same, that is, a grain-oriented electrical steel sheet improved in electrical characteristics by scanning by a continuous wave fiber laser of the TEM00 mode with a wavelength ? of 1.07???2.10 ?m substantially perpendicular to the steel sheet rolling direction and at substantially constant spacing and a method of production of the same, wherein a rolling direction focused spot diameter d (mm) of the irradiated beam, a linear scan rate V (mm/s) of the laser beam, an average output P (W) of the laser, a width of the formed laser scribing traces or with of the electrical domains Wl (mm), and a rolling direction Pl (mm) of the laser scribing traces are in the following ranges: 0<d?0.20 0.001?P/V?0.012 0<Wl?0.20 1.5?Pl?11.
    Type: Application
    Filed: March 5, 2004
    Publication date: August 3, 2006
    Inventors: Tatsuhiko Sakai, Hideyuki Hamamura, Naoya Hamada
  • Patent number: 7079566
    Abstract: A semiconductor laser apparatus according to an exemplary embodiment of the present invention is provided. For example, the apparatus may include a single or a plurality of stacked-array laser diodes, first beam compressors, and a separating optical device separating the group of laser beams into subgroups of laser beams in a first direction, and deflecting the subgroups of laser beams so that the subgroups of laser beams approach in the first direction and recede from one another in a second direction. In addition, a collimating optical device may be provided which is adapted to deflect the subgroups of laser beams in the first and second directions by the same angles. Further, a beam converter may be included which divides each subgroup of laser beams and turning the axis thereof, and second beam compressors and a group of cylindrical lenses can be provided that can make the angle of divergence in the first direction close to the angle of divergence in the second direction.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: July 18, 2006
    Assignee: Nippon Steel Corporation
    Inventors: Motoi Kido, Hirofumi Imai, Naoya Hamada
  • Publication number: 20060126690
    Abstract: A semiconductor laser apparatus according to an exemplary embodiment of the present invention is provided. For example, the apparatus may include a single or a plurality of stacked-array laser diodes, first beam compressors, and a separating optical device separating the group of laser beams into subgroups of laser beams in a first direction, and deflecting the subgroups of laser beams so that the subgroups of laser beams approach in the first direction and recede from one another in a second direction. In addition, a collimating optical device may be provided which is adapted to deflect the subgroups of laser beams in the first and second directions by the same angles. Further, a beam converter may be included which divides each subgroup of laser beams and turning the axis thereof, and second beam compressors and a group of cylindrical lenses can be provided that can make the angle of divergence in the first direction close to the angle of divergence in the second direction.
    Type: Application
    Filed: November 10, 2005
    Publication date: June 15, 2006
    Inventors: Motoi Kido, Hirofumi Imai, Naoya Hamada
  • Patent number: 7045025
    Abstract: A low core loss grain-oriented electrical steel sheet that does not have a significant deterioration in a magnetic flux density and a decrease of a space factor, and which may withstand stress-relieving annealing is provided. Melted and re-solidified layers can be formed on either or both of the surfaces of the grain-oriented electrical steel sheet that extend in a direction that is perpendicular to the rolling direction (e.g., in the direction of the width thereof), at a cyclic interval of not less than approximately 2 mm to less than approximately 5 mm in the rolling direction. The melted and re-solidified layers may be provided on each surface of the grain-oriented electrical steel sheet, and can have an aspect ratio that is a ratio of the depth to the width of the melted and re-solidified layer of not less than approximately 0.20 and a depth of not less than approximately 15 ?m. In addition, the melted and re-solidified layers can be formed by using a laser.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: May 16, 2006
    Assignee: Nippon Steel Corporation
    Inventors: Hideyuki Hamamura, Tatsuhiko Sakai, Naoya Hamada
  • Publication number: 20050126742
    Abstract: Dimples, preferably 40 to 200 ?m in average depth and 0.5 to 3 mm in diameter of circle equivalent, are formed on the peripheral surface of a cooling drum, adjacent to each other at the rims of the dimples; and fine humps (preferably, fine humps 1 to 50 ?m in height and 5 to 200 ?m in diameter of circle equivalent on the surfaces of the dimples and/or fine humps 1 to 50 ?m in height and 30 to 200 ?m in diameter of circle equivalent at the rims of the dimples), fine holes (preferably, fine holes 5 ?m or more in depth and 10 to 200 ?m in diameter of circle equivalent), or fine unevenness (preferably, fine unevenness 1 to 50 ?m in average depth and 10 to 200 ?m in diameter of circle equivalent) are formed at the rims and/or on the indented surfaces of said dimples.
    Type: Application
    Filed: January 26, 2005
    Publication date: June 16, 2005
    Applicant: Nippon Steel Corporation
    Inventors: Hideaki Yamamura, Naoya Hamada, Tadahiro Izu, Yasushi Kurisu, Isao Suichi, Masafumi Miyazaki, Kazumi Seki, Eiichi Takeuchi, Mamoru Yamada, Hideki Oka, Yasuo Maruki, Eiichiro Ishimaru, Mitsuru Nakayama
  • Patent number: 6896033
    Abstract: Dimples, preferably 40 to 200 ?m in average depth and 0.5 to 3 mm in diameter of circle equivalent, are formed on the peripheral surface of a cooling drum, adjacent to each other at the rims of the dimples; and fine humps (preferably, fine humps 1 to 50 ?m in height and 5 to 200 ?m in diameter of circle equivalent on the surfaces of the dimples and/or fine humps 1 to 50 ?m in height and 30 to 200 ?m in diameter of circle equivalent at the rims of the dimples), fine holes (preferably, fine holes 5 ?m or more in depth and 10 to 200 ?m in diameter of circle equivalent), or fine unevenness (preferably, fine unevenness 1 to 50 ?m in average depth and 10 to 200 ?m in diameter of circle equivalent) are formed at the rims and/or on the indented surfaces of said dimples.
    Type: Grant
    Filed: May 11, 2001
    Date of Patent: May 24, 2005
    Assignee: Nippon Steel Corporation
    Inventors: Hideaki Yamamura, Naoya Hamada, Tadahiro Izu, Yasushi Kurisu, Isao Suichi, Masafumi Miyazaki, Kazumi Seki, Eiichi Takeuchi, Mamoru Yamada, Hideki Oka, Yasuo Maruki, Eiichiro Ishimaru, Mitsuru Nakayama
  • Publication number: 20050063435
    Abstract: A semiconductor laser device including a laser element stack array emitting a two-dimensional array shaped group of laser beams consisting of rows of laser beams arranged linearly in parallel in a broken line configuration and optical elements arranged in front of the array, receiving rows of laser beams bent and collimated in a direction substantially perpendicular to the orientation of the broken line configuration. Laser beams are emitted from emitters or groups of emitters and are rotated by right angles so as to convert the laser beams to a plurality of rows aligned in parallel in an approximate ladder rung configuration and the distance between center axes of the rows of laser beams is shortened to condense the laser beams by converting them to a group of laser beams emitted from a common object and thereby making all laser beams converge to a single image.
    Type: Application
    Filed: March 15, 2004
    Publication date: March 24, 2005
    Inventors: Hirofumi Imai, Naoya Hamada, Motoi Kido, Tatsuhiko Sakai, Atsushi Sugihashi, Hideyuki Hamamura, Satoshi Yamaguchi
  • Publication number: 20040091013
    Abstract: A semiconductor laser device with the energy density increased at the focal point and a LD pumped solid-state laser device configured of the particular semiconductor laser device are provided. A stack array laser element for radiating a two-dimensional array of laser beams includes a plurality of parallel laser beam columns each aligned in the form of dotted lines. In front of the stack array laser element, each laser beam column collimated by being refracted in the direction substantially perpendicular to the direction of the dotted line is received, and radiated by turning at right angles to the direction of the laser beams from each emitter or emitter group. In this way, the laser beams are converted into a plurality of substantially ladder-shaped parallel laser beam columns. These parallel laser beam columns are compressed to form parallel laser beam columns in alignment. Each compressed one of parallel laser beam columns is turned at right angles and radiated.
    Type: Application
    Filed: September 30, 2003
    Publication date: May 13, 2004
    Inventors: Satoshi Yamaguchi, Naoya Hamada
  • Publication number: 20040040629
    Abstract: A low core loss grain-oriented electrical steel sheet that does not have a significant deterioration in a magnetic flux density and a decrease of a space factor, and which may withstand stress-relieving annealing is provided. Melted and re-solidified layers can be formed on either or both of the surfaces of the grain-oriented electrical steel sheet that extend in a direction that is perpendicular to the rolling direction (e.g., in the direction of the width thereof), at a cyclic interval of not less than approximately 2 mm to less than approximately 5 mm in the rolling direction. The melted and re-solidified layers may be provided on each surface of the grain-oriented electrical steel sheet, and can have an aspect ratio that is a ratio of the depth to the width of the melted and re-solidified layer of not less than approximately 0.20 and a depth of not less than approximately 15 &mgr;m. In addition, the melted and re-solidified layers can be formed by using a laser.
    Type: Application
    Filed: May 30, 2003
    Publication date: March 4, 2004
    Inventors: Hideyuki Hamamura, Tatsuhiko Sakai, Naoya Hamada
  • Patent number: 6482271
    Abstract: The present invention relates to a grain-oriented electrical steel sheet excellent in magnetic properties, which are improved by irradiating laser beams onto the positions paired on the both surfaces of the steel sheet and forming fine closure domains, characterized in that the width of the closure domains in the rolling direction is 0.3 mm or less and the deviation in the rolling direction between the positions of the paired closure domains on the both surfaces is equal to or smaller than the width of said closure domains in the rolling direction. Further, the present invention relates to a grain-oriented electrical steel sheet excellent in magnetic properties, characterized in that the steel sheet has the marks of laser irradiation on its surface. Yet further, the present invention relates to a grain-oriented electrical steel sheet excellent in magnetic properties, characterized in that the substrate steel is not exposed at the portions of laser irradiation on the surface of the steel sheet.
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: November 19, 2002
    Assignee: Nippon Steel Corporation
    Inventors: Tatsuhiko Sakai, Naoya Hamada
  • Patent number: D620075
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: July 20, 2010
    Assignee: U-TEC Corporation
    Inventors: Chiseki Yamaguchi, Naoya Hamada