Abstract: Provided are: a thermosetting resin composition from which a molded body exhibiting little change in optical characteristics when exposed to high temperatures can be obtained, and which can be applied to various packaging processes; an organosilicon compound from which the composition can be achieved; and a molded body and an optical semiconductor device which are obtained using such a thermosetting resin composition. The thermosetting resin composition includes: a compound that is selected from among organosilicon compounds (A) represented by Formula (1-1) or Formula (1-2); an organosilicon compound (B) that has a plurality of crosslinkable groups in its molecule and is other than the organosilicon compounds (A); and a hydrosilylation catalyst (C), in which the organosilicon compound (B) contains a compound that is crosslinkable with the organosilicon compounds (A).

Abstract: A light-emitting device includes: a balloon, a light source disposed outside the balloon; and an optical fiber that connects the balloon and the light source and propagates light emitted by the light source. At least one of the balloon and the optical fiber becomes luminous by the light emitted by the light source.

Abstract: The present invention is to provide a backflow prevention apparatus of a clean room for solving a negative pressure point in the clean room so as to prevent a backflow from underfloor of the clean room. An intake port sucks the air of an underfloor chamber, a fan supplies the air to an upper part in the apparatus, and a blowoff port is installed on a side surface of an upper-floor part of the apparatus for supplying the air into the clean room. By supplying the air of the underfloor chamber into the clean room, the backflow from the underfloor chamber into the clean room is prevented.

Abstract: The present invention is to provide a backflow prevention apparatus of a clean room for solving a negative pressure point in the clean room so as to prevent a backflow from underfloor of the clean room. An intake port for suctioning the air of an underfloor chamber, a fan for supplying the air to an upper part in the apparatus, and a blowoff port installed on a side surface of an upper-floor part of the apparatus for supplying the air into the clean room are provided. By supplying the air of the underfloor chamber into the clean room, the backflow from the underfloor chamber into the clean room is prevented.