Patents by Inventor Naoya Katsumata

Naoya Katsumata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8372577
    Abstract: It is disclosed a photosensitive resin composition comprising (a) a binder polymer based on a copolymer containing benzyl (meth)acrylate as a building block, (b) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule and (c) a photopolymerization initiator based on a hexarylbisimidazole compound, with a light-initiated color former being optionally contained as component (d). The composition has long-term keeping quality, exhibits particularly high resistance to plating and dry etching, as well as assuring improvement in resolution and adhesion; the composition may be used to form a photosensitive dry film.
    Type: Grant
    Filed: June 9, 2010
    Date of Patent: February 12, 2013
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Yukihiko Tanaka, Shinkichi Asahi, Naoya Katsumata
  • Patent number: 8052828
    Abstract: A photosensitive laminate film for forming a top plate portion, which is suitably used for efficiently and inexpensively forming various precision fine spaces, particularly the precision fine spaces formed in an electronic part such as inkjet head, and a method of forming the precision fine space using the photosensitive laminate film are provided. As the photosensitive laminate film for forming the top plate portion of the precision fine space, which constitutes the top plate portion of the precision fine space by being placed on the precision minute concave portion so as to cover an upper opening followed by being cured, a laminate film providing at least the photosensitive composition layer and the transparent support film is used. The transparent support film supports the photosensitive composition layer as well as prevents the photosensitive composition layer from being deformed upon curing.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: November 8, 2011
    Assignee: Tokyo Okha Kogyo Co., Ltd.
    Inventors: Toru Takahashi, Atsushi Yamanouchi, Naoya Katsumata, Hiroki Maeda
  • Publication number: 20110065046
    Abstract: It is disclosed a photosensitive resin composition comprising (a) a binder polymer based on a copolymer containing benzyl (meth)acrylate as a building block, (b) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule and (c) a photopolymerization initiator based on a hexarylbisimidazole compound, with a light-initiated color former being optionally contained as component (d). The composition has long-term keeping quality, exhibits particularly high resistance to plating and dry etching, as well as assuring improvement in resolution and adhesion; the composition may be used to form a photosensitive dry film.
    Type: Application
    Filed: June 9, 2010
    Publication date: March 17, 2011
    Inventors: Yukihiko Tanaka, Shinkichi Asahi, Naoya Katsumata
  • Patent number: 7871756
    Abstract: There is provided a photosensitive thermosetting resin composition used for producing a permanent film, capable of forming a resin layer which is excellent in fluidity upon heat bonding after pattern, formation and also has excellent adhesion as well as bonding properties and/or sealing properties. This composition contains a reaction product of (A) an alkali soluble resin and (C) a 10 crosslinking polyvinyl ether compound, (B) a compound generating an acid under irradiation with radiation, and (D) an epoxy resin.
    Type: Grant
    Filed: November 18, 2004
    Date of Patent: January 18, 2011
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Toru Takahashi, Naoya Katsumata, Hiroki Maeda
  • Patent number: 7662541
    Abstract: A photosensitive resin composition and a photosensitive dry film which are excellent in both sensitivity and stability and are well-balanced in tent strength, resolution and plating non-staining are provided. The photosensitive resin composition comprises an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), and the polymerization initiator (C) comprises a hexaarylbisimidazole based compound (C1) and a multifunctional thiol compound (C2) as essential components. The photosensitive dry film has at least a photosensitive resin layer formed from the photosensitive resin composition on a support film.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: February 16, 2010
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Teruhiro Uematsu, Naoya Katsumata
  • Publication number: 20080213596
    Abstract: A photosensitive laminate film for forming a top plate portion, which is suitably used for efficiently and inexpensively forming various precision fine spaces, particularly the precision fine spaces formed in an electronic part such as inkjet head, and a method of forming the precision fine space using the photosensitive laminate film are provided. As the photosensitive laminate film for forming the top plate portion of the precision fine space, which constitutes the top plate portion of the precision fine space by being placed on the precision minute concave portion so as to cover an upper opening followed by being cured, a laminate film providing at least the photosensitive composition layer and the transparent support film is used. The transparent support film supports the photosensitive composition layer as well as prevents the photosensitive composition layer from being deformed upon curing.
    Type: Application
    Filed: January 23, 2006
    Publication date: September 4, 2008
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Toru Takahashi, Atsushi Yamanouchi, Naoya Katsumata, Hiroki Maeda
  • Publication number: 20080044764
    Abstract: There is provided a photosensitive thermosetting resin composition used for producing a permanent film, capable of forming a resin layer which is excellent in fluidity upon heat bonding after pattern, formation and also has excellent adhesion as well as bonding properties and/or sealing properties. This composition contains a reaction product of (A) an alkali soluble resin and (C) a 10 crosslinking polyvinyl ether compound, (B) a compound generating an acid under irradiation with radiation, and (D) an epoxy resin.
    Type: Application
    Filed: November 18, 2004
    Publication date: February 21, 2008
    Inventors: Toru Takahashi, Naoya Katsumata, Hiroki Maeda
  • Publication number: 20070292804
    Abstract: A photosensitive resin composition and a photosensitive dry film which are excellent in both sensitivity and stability and are well-balanced in tent strength, resolution and plating non-staining are provided. The photosensitive resin composition comprises an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), and the polymerization initiator (C) comprises a hexaarylbisimidazole based compound (C1) and a multifunctional thiol compound (C2) as essential components. The photosensitive dry film has at least a photosensitive resin layer formed from the photosensitive resin composition on a support film.
    Type: Application
    Filed: November 22, 2005
    Publication date: December 20, 2007
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Teruhiro Uematsu, Naoya Katsumata
  • Publication number: 20070264601
    Abstract: A photosensitive resin composition for h-ray exposure which has high sensitivity for h-ray and is excellent in resolution of a resist pattern, and a photosensitive dry film by the use thereof are provided. The photosensitive resin composition is composed of an alkali-soluble resin (A) having an alicyclic epoxy group-containing unsaturated compound in a part of a carboxyl group of a carboxyl group-containing acryl copolymer as well as having a weight-average molecular weight of 1,000 to 100,000, an ethylenically unsaturated compound (B) and a photopolymerization initiator (C) including at least a photopolymerization initiator (C1) whose absorption coefficient for light with a wavelength of 405 nm is 1 or more as an essential component.
    Type: Application
    Filed: October 19, 2005
    Publication date: November 15, 2007
    Applicant: Tokyo Ohka Kogyo Co., Ltd
    Inventors: Teruhiro Uematsu, Naoya Katsumata
  • Patent number: 4933260
    Abstract: A water-based photopolymerizable resin composition is disclosed which is suitable for the preparation of a relief printing plate by the photolithographic techniques. The inventive composition, which basically comprises a water-soluble polymer, e.g., poly(vinyl alcohol), a photopolymerizable monomer and a photopolymerization initiator, is characterized in that at least a part of the photopolymerizable monomer is N-tetrahydrofurfuryloxymethyl acrylamide or N-tetrahydrofurfuryloxymethyl methacrylamide. By virtue of this unique ingredient in the composition, the printing plate prepared from the inventive composition is imparted with improved fidelity of pattern reproduction and durability in printing as a consequence of increased hardness and pliability to be freed from the drawback of crack formation in printing even on a cylinder of small diameter under a cold and low-humidity condition.
    Type: Grant
    Filed: August 31, 1989
    Date of Patent: June 12, 1990
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Naoya Katsumata, Syunzi Nakazato, Katsuyuki Ohta, Toshimi Aoyama