Abstract: The present invention provides a method for manufacturing an LED display including a wiring board and LEDs arranged at a constant distance from the wiring board. The method includes: aligning an LED substrate 1 having LEDs 11 with a wiring board 2, and pressing and joining the LED substrate onto the wiring board. Each LED has a bonding surface. The wiring board includes bonding layers. The aligning step is performed so that the bonding surfaces are joined on the bonding layers in the pressing and joining step. The method further includes: temporarily bonding the LEDs onto the wiring board by curing the bonding layers through irradiation with ultraviolet light UV; peeling off the LEDs from the LED substrate through irradiation with laser light L; and permanently bonding the LEDs onto the wiring board by heating the bonding layers of the LEDs so as to further cure the bonding layers.

Abstract: The present invention provides a laser lift-off processing method performed on a laminate 1 including a sapphire substrate 11 and micro LEDs 12 formed on a first surface of the sapphire substrate, by irradiating the laminate with pulse-oscillated laser light from a second surface of the sapphire substrate and thereby separating the micro LEDs therefrom. The method includes: flattening the sapphire substrate by pressing it with an external force to correct its warpage; and separating the micro LEDs from the flattened sapphire substrate by irradiating the laminate with the laser light from the second surface while moving the laminate placed on a stage 91 relative to an optical system 6 such that the laser focal point sequentially coincides with boundary portions between the sapphire substrate and the micro LEDs. The method allows for satisfactorily separating the micro LEDs from the sapphire substrate even if it is warped.