Patents by Inventor Naoya Saeki

Naoya Saeki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dicing sheet with protective film forming layer and method for producing chip
    Patent number: 9754811
    Abstract: [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: September 5, 2017
    Assignee: LINTEC CORPORATION
    Inventors: Naoya Saeki, Tomonori Shinoda, Ken Takano
  • DICING SHEET WITH PROTECTIVE FILM FORMING LAYER AND METHOD FOR PRODUCING CHIP
    Publication number: 20150228526
    Abstract: [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.
    Type: Application
    Filed: August 22, 2013
    Publication date: August 13, 2015
    Applicant: LINTEC CORPORATION
    Inventors: Naoya Saeki, Tomonori Shinoda, Ken Takano