Abstract: A cutting device includes a platen, a mounting portion, a movement mechanism, a processor, and a memory. The memory is configured to store computer-readable instructions that, when executed by the processor, instruct the processor to perform processes including acquiring a hardness-correspondence value corresponding to a hardness of a cutting object placed on the platen, acquiring cutting data for cutting a pattern from the cutting object, setting, based on the hardness-correspondence value, an offset amount used for a rotation correction to a greater value when the hardness of the cutting object is hard than when the hardness of the cutting object is soft, correcting, using the set offset amount, data, of the cutting data, corresponding to a direction change section, and performing cutting processing to cut the cutting object using a cutting blade, by controlling the movement mechanism in accordance with the corrected cutting data.

Abstract: A lead frame includes: a resin portion including an upper surface and a lower surface opposite to the upper surface; and a first terminal formed to penetrate the resin portion. The first terminal includes: a first upper terminal portion disposed to protrude from the upper surface; a first lower terminal portion disposed on the first upper terminal portion to protrude from the lower surface; a first through hole formed in one of the first upper terminal portion and the first lower terminal portion; a first recess defined by an inner wall surface of the first through hole and a surface of the other of the first upper terminal portion and the first lower terminal portion; and a first metal layer formed on an inner surface of the first recess.

Abstract: A lead frame includes a first lead frame including a first lead; a second lead frame including a second lead, the second lead frame being stacked on the first lead frame so that a space is formed between the first lead frame and the second lead frame, and the second lead being bonded to the first lead; and a resin portion provided in the space formed between the first lead frame and the second lead frame, wherein each of the first lead and the second lead includes an embedded portion embedded in the resin portion, and a protruding portion protruded from the resin portion, and wherein the embedded portion of the first lead and the embedded portion of the second lead are bonded in the resin portion.

Abstract: A lead frame includes: a resin portion including an upper surface and a lower surface opposite to the upper surface; and a first terminal formed to penetrate the resin portion. The first terminal includes: a first upper terminal portion disposed to protrude from the upper surface; a first lower terminal portion disposed on the first upper terminal portion to protrude from the lower surface; a first through hole formed in one of the first upper terminal portion and the first lower terminal portion; a first recess defined by an inner wall surface of the first through hole and a surface of the other of the first upper terminal portion and the first lower terminal portion; and a first metal layer formed on an inner surface of the first recess.

Abstract: A lead frame includes a dam bar and leads connected by the dam bar. Each lead includes an inner lead, which is located at one side of the dam bar, and an outer lead, which is located at the other side of the dam bar and formed integrally with the inner lead. Each inner lead includes a basal portion located at a side closer to the dam bar, a distal portion located at the opposite side of the basal portion, and an intermediate portion connecting the distal and basal portions and having a width that differs from the distal portion. A plating layer covers an upper surface and a side surface of the distal portion and at least part of a side surface of the intermediate portion. Side surfaces of the basal portion and the dam bar are entirely located outside the plating layer.

Abstract: A lead frame includes a first lead frame including a first lead; a second lead frame including a second lead, the second lead frame being stacked on the first lead frame so that a space is formed between the first lead frame and the second lead frame, and the second lead being bonded to the first lead; and a resin portion provided in the space formed between the first lead frame and the second lead frame, wherein each of the first lead and the second lead includes an embedded portion embedded in the resin portion, and a protruding portion protruded from the resin portion, and wherein the embedded portion of the first lead and the embedded portion of the second lead are bonded in the resin portion.

Abstract: A semiconductor device includes a lead frame having terminals, a semiconductor chip electrically coupled to the terminals, and a resin part configured to encapsulate the semiconductor chip such as to expose part of the terminals, wherein a given one of the terminals includes a first lead and a second lead welded together such that an upper face of the first lead is placed against a lower face of the second lead, wherein the lower face of the second lead extends further than the upper face of the first lead toward the semiconductor chip in a longitudinal direction of the terminal, and also extends further sideways than the upper face of the first lead in a transverse direction of the terminal, and wherein an area of the lower face of the second lead is covered with the resin part, the area extending further than the upper face of the first lead.

Abstract: A lead frame includes a dam bar and leads connected by the dam bar. Each lead includes an inner lead, which is located at one side of the dam bar, and an outer lead, which is located at the other side of the dam bar and formed integrally with the inner lead. Each inner lead includes a basal portion located at a side closer to the dam bar, a distal portion located at the opposite side of the basal portion, and an intermediate portion connecting the distal and basal portions and having a width that differs from the distal portion. A plating layer covers an upper surface and a side surface of the distal portion and at least part of a side surface of the intermediate portion. Side surfaces of the basal portion and the dam bar are entirely located outside the plating layer.

Abstract: A semiconductor device includes a lead frame having terminals, a semiconductor chip electrically coupled to the terminals, and a resin part configured to encapsulate the semiconductor chip such as to expose part of the terminals, wherein a given one of the terminals includes a first lead and a second lead welded together such that an upper face of the first lead is placed against a lower face of the second lead, wherein the lower face of the second lead extends further than the upper face of the first lead toward the semiconductor chip in a longitudinal direction of the terminal, and also extends further sideways than the upper face of the first lead in a transverse direction of the terminal, and wherein an area of the lower face of the second lead is covered with the resin part, the area extending further than the upper face of the first lead.

Abstract: A method for displaying advertisements on browsers (especially, tab browsers) that are effective and occupies smaller spaces of the screen is disclosed. When a user clicks a link on the screen and a new tab is displayed, the clicked link is replaced with another advertisement link, or another advertisement link is inserted near the clicked link, getting more attention from the user.

Abstract: To obtain a colored metallic paint with which a colored metallic paint film which has excellent features and with which a change in color is produced according to differences in the viewing angle can be formed using the usual cheap pigments without compounding special glitter materials. The present invention provides a paint composition which contains, per 100 parts by weight of a film forming binder (A), from 0.1 to 15 parts by weight of metallic powder (B), from 0.1 to 10 parts by weight of a first colored pigment (C) of primary particle size from 0.01 to 0.2 .mu.m which is selected from among the group comprising the phthalocyanine, perylene, indanthrone, azomethine, benzimidazolone, quinacridone, anthraquinone, diketopyrolopyrrole and dioxazine based pigments, and from 0.5 to 50 parts by weight of a second colored pigment (D) of primary particle size from 0.1 to 2 .mu.

Abstract: A composite paint film coating formed on a steel sheet of an automotive vehicle body. The composite paint film coating is comprised of an electrodeposition paint film (I) coated on the steel sheet, and an intermediate paint film (II) coated on the first paint film. The electrodeposition paint film has a minimum melt viscosity not less than 0.2 during hardening. The electrodepositon paint film is formed of cathodic electrodeposition paint composition which includes a cationic thermosetting resin (1), and an already cross-linked particulate resin (2). The particlate resin is an addition-polymer formed between a fist compound (A) having at least two primary amino groups in a molecule, and a second compound (B) having at least two .alpha.,.beta.-ethylenic unsaturated groups. The particulate resin has an average particle size ranging from 0.01 to 1 .mu.m. The weight ratio ((2)/(1)) in solid content between the particulate resin (2) cationic thermosetting resin (1) is within a range from 0.03 to 0.15.