Abstract: Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer.

Abstract: Provided are a curable composition for imprinting, which contains a polymerizable compound and a polymerization initiator, in which one of components contained in the composition is a compound which includes a 5-membered ring structure having two or more heteroatoms as ring members; a cured substance of the curable composition for imprinting; an imprint pattern producing method using the curable composition for imprinting; and a method for manufacturing a device, which includes the imprint pattern producing method.

Abstract: Provided are a method for producing a composition for forming an interlayer for nanoimprint, the method including a filtering step of filtering a precursor composition 1 including a resin having a polymerizable group with a filter, a step of adding a solvent to the precursor composition 1 after the step to obtain a precursor composition 2, and a filtering step of filtering the precursor composition 2 with a filter, in which a proportion of a total solid content of the obtained composition is 0.1% to 1.0% by mass; a method for producing a laminate formed of the composition for forming an interlayer; an imprint pattern producing method using the composition for forming an interlayer; and a method for manufacturing a device, which includes the imprint pattern producing method.

Abstract: Provided is a kit including a curable composition for imprinting, and a composition for forming an underlayer film for imprinting, in which the composition for forming an underlayer film for imprinting contains a polymer having a polymerizable functional group, and a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480° C. or higher and ?HSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting, a pattern forming method, and a method for manufacturing a semiconductor device, which are related to the kit.

Abstract: There are provided a curable composition for imprinting, the curable composition including an organopolysiloxane having a radical polymerizable group, a radical generator, and a compound that has a monovalent hydrocarbon group having 4 to 11 carbon atoms and a poly(oxyalkylene) group, in which some or all of hydrogen atoms of the monovalent hydrocarbon group are optionally substituted with halogen atoms, a coating film of the composition, a method for producing the film, a cured product of the composition, a method for producing an imprint pattern using the composition, and a method for producing a device, the method including the method for producing an imprint pattern.

Abstract: There are provided a curable composition for imprinting, the curable composition including a polymerizable compound having two or more radical polymerizable groups, a radical polymerization initiator, and at least one compound selected from the group consisting of an organopolysiloxane having only one radical polymerizable group and an organopolysiloxane having no or one radical polymerizable group and having a poly(oxyalkylene) group, a cured product of the curable composition for imprinting, a method for producing an imprint pattern using the curable composition for imprinting, and a method for producing a device, the method including the method for producing an imprint pattern.

Abstract: Provided are a curable composition used for forming an interlayer existing between a base material and a curable layer, the curable composition including a curable main agent having a polymerizable functional group, a polymerization inhibitor, and a solvent, in which a content of the polymerization inhibitor is 1 part by mass or greater and lower than 1,000 parts by mass with respect to 1,000,000 parts by mass of the curable main agent; a kit including the curable composition; an interlayer formed from the curable composition; a laminate including the interlayer; an imprint pattern producing method using the laminate; and a method for manufacturing a device including the imprint pattern producing method.

Abstract: There are provided a composition for forming an adhesive film for imprinting having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting contains a resin having a polymerizable group; and a solvent, in which the resin has at least one kind of a repeating unit derived from a polymerizable compound having a C log P value less than or equal to 0, and solubility of the resin in water at 25° C. is greater than or equal to 1 mass %, provided that the C log P value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol.

Abstract: The curable composition for imprinting includes: a compound represented by the following Formula (1); a radically polymerizable compound other than the compound represented by Formula (1); and a photoradical polymerization initiator, in Formula (1), R1 and R2 each independently represent a hydrogen atom or an organic group having 1 to 8 carbon atoms and may be bonded to each other to form a ring, R3 represents a monovalent organic group, and R4 and R5 each independently represent a hydrogen atom or a monovalent organic group.

Abstract: Provided are a composition for forming an adhesive film for imprinting, including a resin having a specific aromatic ring and a polymerizable functional group in a side chain, in which the specific aromatic ring is an unsubstituted aromatic ring, or an aromatic ring having one or more substituents, in which a formula weight of each of the one or more substituents is 1000 or less, and a proportion of a polymerizable functional group including a heterocyclic ring in the polymerizable functional group is less than 3 mol %; an adhesive film to which the composition for forming an adhesive film is applied; a laminate; a method for manufacturing a laminate; a pattern producing method; and a method for manufacturing a semiconductor element.

Abstract: There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate.

Abstract: Provided are: a composition for forming an underlayer film in an imprinting method, which includes a high-molecular-weight compound having a polymerizable functional group and a monomer having a plurality of crosslinking functional groups capable of being bonded to the polymerizable functional group, and in which a Hansen solubility parameter distance, which is a difference between a Hansen solubility parameter of the high-molecular-weight compound and a Hansen solubility parameter of the monomer, is 5.

Abstract: Provided are: a composition for forming a pattern, which contains a polymerizable compound, a photopolymerization initiator, and a sensitizer containing two or more of at least one kind of atom selected from the group consisting of a nitrogen atom and a sulfur atom, in which a length of a specific atom chain from one atom to another atom among the two or more atoms is 2 or 3 in terms of the number of atoms; a kit to which the composition for forming a pattern is applied; a cured film; a laminate; a pattern producing method; and a method for manufacturing a semiconductor element.

Abstract: Provided are: a composition for forming a pattern for imprinting, which contains a polymerizable compound, a photopolymerization initiator, and an organic halogen compound containing at least one atom selected from the group consisting of a chlorine atom, a bromine atom, and an iodine atom, in which the organic halogen compound is a compound which is stable to light of a mercury lamp, and a content of the organic halogen compound is 0.001% to 1.0% by mass with respect to a total solid content in the composition for forming a pattern; a kit including the composition for forming a pattern; a pattern producing method; a pattern; and a method for manufacturing a semiconductor element.

Abstract: Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.

Abstract: Provided are: a curable composition for imprinting, which contains a compound C represented by Formula (C1) and a radical polymerization initiator; a kit including the curable composition; a pattern producing method using the curable composition; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.

Abstract: Provided are a curable composition for imprinting including a polymerizable compound, a photopolymerization initiator, and a particulate metal which has a particle diameter of 1 nm or larger, as measured by a single particle ICP-MASS method, and includes at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 100 ppt by mass to 30 ppb by mass with respect to a solid content of the composition; a method for producing the curable composition for imprinting; a cured product using the curable composition for imprinting; a pattern producing method; and a method for manufacturing a semiconductor element.

Abstract: A curable composition for imprinting according to an embodiment of the present invention includes a monofunctional polymerizable compound having the following structure, a photopolymerization initiator, and a release agent represented by the following Formula (I) or Formula (II). The monofunctional polymerizable compound has the following structure: a linear or branched alkyl group, or an alicyclic ring, an aromatic ring, or an aromatic heterocycle that is substituted with a linear or branched alkyl group. The release agent is represented by the following Formula (I) or Formula (II). A1-(B1)x1-(D1)y1-(E1)z1-F1??Formula (I), A2-(B2)x2-(D2)y2-(E2)z2-F2??Formula (II), A1 and A2 represent a linear aliphatic hydrocarbon group having 4 to 11 carbon atoms, D1 and D2 represent an alkylene oxide structure, F1 represents a polar functional group, and F2 represents a hydrogen atom, or a linear, branched, or cyclic aliphatic hydrocarbon group having 4 to 11 carbon atoms.

Abstract: Provided is a kit including a curable composition for imprinting, and a composition for forming an underlayer film for imprinting, in which the composition for forming an underlayer film for imprinting contains a polymer having a polymerizable functional group, and a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480° C. or higher and ?HSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting, a pattern forming method, and a method for manufacturing a semiconductor device, which are related to the kit.

Abstract: Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer.