Patents by Inventor Naoya SHIROSHITA

Naoya SHIROSHITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105539
    Abstract: A semiconductor device includes: a wiring substrate; at least one first semiconductor element provided above the wiring substrate; a first resin layer configured to seal the first semiconductor element; and a second resin layer provided on an outer surface of the first resin layer. A Young's modulus of the second resin layer is greater than a Young's modulus of the first resin layer, and/or a linear thermal expansion coefficient of the second resin layer is greater than a linear thermal expansion coefficient of the first resin layer.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 28, 2024
    Applicant: Kioxia Corporation
    Inventors: Naoya SHIROSHITA, Masayuki MIURA