Abstract: A semiconductor relay device includes a conversion circuit configured to receive an input signal from outside and pass a first current to a first node based on the input signal. A zener diode has an anode coupled to a second node and a cathode coupled to the first node. A resistor is coupled between the second node and a third node. A number n of diodes are serially coupled. A thyristor has an anode coupled to the first node, a cathode coupled to the second node, and a control terminal coupled to the third node. A transistor has a gate coupled to the first node. An anode of a diode at a first end of the n diodes is coupled to the first node, and a cathode of a diode at a second end of the n diodes is coupled to a third node.

Abstract: A semiconductor device includes an input-side lead, a light-emitting element on the input-side lead, an output-side lead, a switching element on the output-side lead, and a light-receiving element on the switching element. The switching element is provided between the light-emitting element and the output-side lead. The switching element includes a front-side electrode and a control pad arranged along a front surface side thereof. The light-receiving element is provided on the front-side electrode of the switching element via an insulative connection member. The light-receiving element is positioned between the first switching element and the light-emitting element. The light-receiving element includes first and second bonding pads; the first bonding pad is electrically connected to the control pad of the switching element via a first conductive member; and the second bonding pad is electrically connected to the front-side electrode of the switching element via a second conductive member.

Abstract: A semiconductor relay device includes a conversion circuit configured to receive an input signal from outside and pass a first current to a first node based on the input signal. A zener diode has an anode coupled to a second node and a cathode coupled to the first node. A resistor is coupled between the second node and a third node. A number n of diodes are serially coupled. A thyristor has an anode coupled to the first node, a cathode coupled to the second node, and a control terminal coupled to the third node. A transistor has a gate coupled to the first node. An anode of a diode at a first end of the n diodes is coupled to the first node, and a cathode of a diode at a second end of the n diodes is coupled to a third node.

Abstract: A photocoupler of an embodiment includes an input terminal, an output terminal, a first MOSFET, a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, and a resin layer. The first MOSFET is joined onto the third lead. The second MOSFET is joined onto the fourth lead. The semiconductor light receiving element is joined to each of the first junction region and the second junction region. The semiconductor light receiving element includes a light receiving region provided in a central part of a surface on opposite side from a surface joined to the first and second MOSFET. The resin layer seals the first and second MOSFETs, the semiconductor light receiving element, the semiconductor light emitting element, an upper surface and a side surface of the input terminal, and an upper surface and a side surface of the output terminal.

Abstract: An optical coupling device includes a light receiving element including a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element includes a first main terminal connected to the first output terminal, a first control terminal connected to the second output terminal, and a second main terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element. A lower surface of the first electrode plate is exposed on a lower surface of the sealing member. The lower surface of the first electrode plate and the lower surface of the sealing member form the same plane.

Abstract: A semiconductor relay device includes a conversion circuit configured to receive an input signal from outside and pass a first current to a first node based on the input signal. A zener diode has an anode coupled to a second node and a cathode coupled to the first node. A resistor is coupled between the second node and a third node. A number n of diodes are serially coupled. A thyristor has an anode coupled to the first node, a cathode coupled to the second node, and a control terminal coupled to the third node. A transistor has a gate coupled to the first node. An anode of a diode at a first end of the n diodes is coupled to the first node, and a cathode of a diode at a second end of the n diodes is coupled to a third node.

Abstract: A semiconductor relay device includes a conversion circuit configured to receive an input signal from outside and pass a first current to a first node based on the input signal. A zener diode has an anode coupled to a second node and a cathode coupled to the first node. A resistor is coupled between the second node and a third node. A number n of diodes are serially coupled. A thyristor has an anode coupled to the first node, a cathode coupled to the second node, and a control terminal coupled to the third node. A transistor has a gate coupled to the first node. An anode of a diode at a first end of the n diodes is coupled to the first node, and a cathode of a diode at a second end of the n diodes is coupled to a third node.

Abstract: An optical coupling device includes a light receiving element provided with a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element is provided side by side on the light receiving element. A first main terminal and a control terminal are provided on an upper surface of the first switching element. A second main terminal is provided on a lower surface of the first switching element. The first main terminal is connected to the first output terminal. The control terminal is connected to the second output terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element.

Abstract: A semiconductor relay device includes a conversion circuit configured to receive an input signal from outside and pass a first current to a first node based on the input signal. A zener diode has an anode coupled to a second node and a cathode coupled to the first node. A resistor is coupled between the second node and a third node. A number n of diodes are serially coupled. A thyristor has an anode coupled to the first node, a cathode coupled to the second node, and a control terminal coupled to the third node. A transistor has a gate coupled to the first node. An anode of a diode at a first end of the n diodes is coupled to the first node, and a cathode of a diode at a second end of the n diodes is coupled to a third node.

Abstract: A photocoupler of an embodiment includes a packaging member, a first and a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, a first wiring part, and a sealing resin layer. The input terminal includes a first and a second lead. The output terminal includes a third and a fourth lead. The first conductive region includes a signal input part and a bend part. The fourth conductive region includes a signal input part and a bend part. The semiconductor light receiving element is joined to the first and second MOSFETs astride a gap part. The semiconductor light emitting element is joined onto a light receiving region. The first wiring part connects the source electrode of the first MOSFET and the source electrode of the second MOSFET.

Abstract: An optical coupling device includes a light receiving element including a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element includes a first main terminal connected to the first output terminal, a first control terminal connected to the second output terminal, and a second main terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element. A lower surface of the first electrode plate is exposed on a lower surface of the sealing member. The lower surface of the first electrode plate and the lower surface of the sealing member form the same plane.

Abstract: An optical coupling device includes a light receiving element provided with a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element is provided side by side on the light receiving element. A first main terminal and a control terminal are provided on an upper surface of the first switching element. A second main terminal is provided on a lower surface of the first switching element. The first main terminal is connected to the first output terminal. The control terminal is connected to the second output terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.

Abstract: A photocoupler of an embodiment includes a packaging member, a first and a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, a first wiring part, and a sealing resin layer. The input terminal includes a first and a second lead. The output terminal includes a third and a fourth lead. The first conductive region includes a signal input part and a bend part. The fourth conductive region includes a signal input part and a bend part. The semiconductor light receiving element is joined to the first and second MOSFETs astride a gap part. The semiconductor light emitting element is joined onto a light receiving region. The first wiring part connects the source electrode of the first MOSFET and the source electrode of the second MOSFET.

Abstract: A photocoupler of an embodiment includes an input terminal, an output terminal, a first MOSFET, a second MOSFET, a semiconductor light receiving element, a semiconductor light emitting element, and a resin layer. The first MOSFET is joined onto the third lead. The second MOSFET is joined onto the fourth lead. The semiconductor light receiving element is joined to each of the first junction region and the second junction region. The semiconductor light receiving element includes a light receiving region provided in a central part of a surface on opposite side from a surface joined to the first and second MOSFET. The resin layer seals the first and second MOSFETs, the semiconductor light receiving element, the semiconductor light emitting element, an upper surface and a side surface of the input terminal, and an upper surface and a side surface of the output terminal.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.

Abstract: An optical coupler device includes, on a substrate, a first light-receiving element coupled to a first light-emitting element and a second light-receiving element coupled to a second light-emitting element. First, second, and third terminals are disposed on the first substrate. A first transistor pair and a second transistor pair are disposed on the first substrate. The first transistor pair is configured to electrically connect and disconnect the first and second terminals in response to a first light signal received by the first light-receiving element. The second transistor pair is configured to electrically connect and disconnect the second and third terminals in response to a second light signal received by the second light-receiving element.

Abstract: An optical coupler device includes, on a substrate, a first light-receiving element coupled to a first light-emitting element and a second light-receiving element coupled to a second light-emitting element. First, second, and third terminals are disposed on the first substrate. A first transistor pair and a second transistor pair are disposed on the first substrate. The first transistor pair is configured to electrically connect and disconnect the first and second terminals in response to a first light signal received by the first light-receiving element. The second transistor pair is configured to electrically connect and disconnect the second and third terminals in response to a second light signal received by the second light-receiving element.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor element having a first surface, a second semiconductor element having a lower surface bonded to the first surface of the first semiconductor element, a gel-like silicone that covers an upper surface of the second semiconductor element, and a resin portion that covers the gel-like silicone and the first surface of the first semiconductor element.