Abstract: When a material of an organic substrate is glass epoxy and a material of a semiconductor chip is silicon or gallium arsenide, a substrate warp sometimes occurs because of a difference between thermal expansion coefficients of the materials. The shape of the antenna formed on the organic substrate due to such a substrate warp, so that the characteristics of the antenna are sometimes shifted from desired values. An antenna is provided on the substrate on which a semiconductor chip is mounted, and is covered with a resin. The resin has enough hardness to suppress the warp caused by joining the semiconductor chip and the substrate and a transformation of the antenna. By changing a connection relation of adjustment vias after the manufacture of the semiconductor device, the characteristic of the antenna can be changed.

Abstract: The characteristics of an object are measured using an electrical characteristics measurement device in which a probe includes a signal terminal, a ground terminal, and a variable resistance element is connected via a coaxial cable to a measuring instrument. The calibration of the probe entails adjusting the resistance value of the variable resistance element, setting the impedance of the distal end vicinity of the probe essentially to zero, and establishing a match with the coaxial cable and measuring instrument. When the electrical characteristics of the object are measured, the resistance value of the variable resistance element is varied in accordance with the impedance created by the side of the circuit containing the measurement object as viewed from the contact between the object and the signal terminal and ground terminal, and the input impedance of the probe is set to a value that does not affect the operation of the object.

Abstract: The electrical characteristics of a measurement object 8 are measured using an electrical characteristics measurement device in which a probe 1 comprising a signal terminal 2, a ground terminal 3, and a variable resistance element 4 is connected via a coaxial cable 5 to a measuring instrument 6. The calibration of the probe 1 in such a configuration entails adjusting the resistance value of the variable resistance element, setting the impedance of the distal end vicinity of the probe 1 essentially to 0, and establishing a match with the coaxial cable 5 and measuring instrument 6.

Abstract: An electronic apparatus comprises a function module having a multilayer wiring unit including a first signal wiring corresponding to an internal layer wiring, a first signal via, a first reference potential wiring, a first signal pad to which the first signal wiring is connected through the first signal via, a first reference potential pad that surrounds the periphery of the first signal pad and to which the first reference potential wiring is connected, and a first reference potential connected to the first reference potential pad; a inultilayer circuit board; a first conductor; and a second conductor.

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: The present invention provides a device for detecting a magnetic field comprising: a dielectric body; an electrically conductive pattern; and an electrically conductive ground region. The electrically conductive pattern so extends in the dielectric body as to form a dielectric looped face at least partially surrounded by the electrically conductive pattern, and the electrically conductive pattern having a first end electrically connected to an external electrically conductive line and a second end. The electrically conductive ground region is formed in the dielectric body. The electrically conductive ground region is electrically connected to the second end of the electrically conductive pattern and is electrically isolated from other parts of the electrically conductive pattern than the second end, so that the electrically conductive ground region serves as a ground to the electrically conductive pattern.

Abstract: An electronic apparatus comprises a function module having a multilayer wiring unit including a first signal wiring corresponding to an internal layer wiring, a first signal via, a first reference potential wiring, a first signal pad to which the first signal wiring is connected through the first signal via, a first reference potential pad that surrounds the periphery of the first signal pad and to which the first reference potential wiring is connected, and a first reference potential via connected to the first reference potential pad; a multilayer circuit board including a second signal wiring corresponding to an internal layer wiring, a second signal via, a second reference potential wiring, a second signal pad to which one end of the second signal wiring is connected through the second signal via, a second reference potential pad that surrounds the periphery of the second signal pad and to which one end of the second reference potential wiring is connected, a second reference potential via connected to th

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: A semiconductor device evaluation apparatus for correctly measuring emission noise of a semiconductor device includes: an electromagnetic field measurement unit for measuring a two-dimensional electromagnetic field distribution in a plane parallel to an upper surface of a semiconductor device; a distribution image generation unit for not only extracting a distribution of an electromagnetic field higher than a threshold value determined in advance from the electromagnetic field distribution of the semiconductor device measured by the electromagnetic field measurement unit but converting the extracted electromagnetic field distribution to a distribution image in a two-dimensional plane; an image collation unit for collating the distribution image generated by the distribution image generation unit with a projected image, generated in advance, of an interconnect and a lead frame of the semiconductor device; and an emission source specifying unit for specifying an interconnect or a lead frame whose images are sup

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: A triplate stripline on a multilayer circuit board includes an inner conductor sandwiched between two ground patterns having a finite pattern width that is 10 times the pattern width of said inner conductor or less. The two ground patterns are short-circuited on opposite transverse ends thereof by a plurality of vias disposed in a longitudinal direction which is a signal transmitting direction of the stripline. An adjacent stripline is of the same structure as the triplate stripline. Each of the striplines has a cross-sectional shape in which one inner conductor is surrounded by the two ground patterns and the vias on the opposite sides. The inner conductor is thus prevented from suffering ambient electromagnetic noise and electromagnetic interference such as crosstalk or the like.

Abstract: A semiconductor device evaluation apparatus for correctly measuring emission noise of a semiconductor device includes: an electromagnetic field measurement unit for measuring a two-dimensional electromagnetic field distribution in a plane parallel to an upper surface of a semiconductor device; a distribution image generation unit for not only extracting a distribution of an electromagnetic field higher than a threshold value determined in advance from the electromagnetic field distribution of the semiconductor device measured by the electromagnetic field measurement unit but converting the extracted electromagnetic field distribution to a distribution image in a two-dimensional plane; an image collation unit for collating the distribution image generated by the distribution image generation unit with a projected image, generated in advance, of an interconnect and a lead frame of the semiconductor device; and an emission source specifying unit for specifying an interconnect or a lead frame whose images are sup

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Abstract: A magnetic field sensor has a first conductor, a first insulating film, a second conductor, a second insulating film and a third conductor. The first conductor is composed of a “C-shaped” portion, which is formed in a C-like shape, and a linear portion, which is connected to one side of the “C-shaped” portion which is opposite to a gap of the “C-shaped” portion. The first insulating film is formed on the first conductor and has a hole in a predetermined position. The second conductor is formed in a ladle-like shape, and is formed on the first insulating film such that its one side corresponding to the front end of the ladle overlaps with a straight line, through which an outer edge of one end and an outer edge of the other end of the “C-shaped” portion.

Abstract: A semiconductor device evaluation apparatus for correctly measuring emission noise of a semiconductor device includes: an electromagnetic field measurement unit for measuring a two-dimensional electromagnetic field distribution in a plane parallel to an upper surface of a semiconductor device; a distribution image generation unit for not only extracting a distribution of an electromagnetic field higher than a threshold value determined in advance from the electromagnetic field distribution of the semiconductor device measured by the electromagnetic field measurement unit but converting the extracted electromagnetic field distribution to a distribution image in a two-dimensional plane; an image collation unit for collating the distribution image generated by the distribution image generation unit with a projected image, generated in advance, of an interconnect and a lead frame of the semiconductor device; and an emission source specifying unit for specifying an interconnect or a lead frame whose images are sup

Abstract: A semiconductor device evaluation apparatus is provided with a test board. A print wiring is provided at a first surface of the test board on which a semiconductor device is mounted. A terminal of the semiconductor device is connected to the print wiring. A power circuit is provided at a second surface opposite to the first surface of the test board. The power circuit is connected to the print wiring and actuates the semiconductor device. The apparatus is also provided with a magnetic field detector arranged above the print wiring and detects a magnetic field generated from the print wiring. Further, the apparatus is provided with a current detector detecting a value of current carried through the print wiring based on the magnitude of the magnetic field detected by the magnetic field detector.

Abstract: A magnetic field sensor is provided which can be easily downsized and has a capability to detect a magnetic field in the Ghz band with a high space resolution and to reduce a voltage induced by an electric field. The magnetic field sensor is composed of a first layer, a second layer and a third layer. The first layer is provided with a straight-lined conductor pattern disposed in a perpendicular manner to a mid-point of another straight-lined conductor pattern being the longest among J-shaped conductor patterns. The third layer has the same conductor pattern as the first layer. The second layer has a ladle-shaped conductor pattern disposed along the center of the width of the conductor pattern of the first layer and third layer and an L-shaped conductor pattern disposed so as to form a loop face to face with the bending section of the J-shaped conductor pattern.

Abstract: A magnetic measuring apparatus measures, at a high spatial resolution, a magnetic field generated by a current flowing in one of a plurality of highly packed parallel wires on a printed-circuit board. The magnetic measuring apparatus includes a magnetic field detector for detecting a magnetic field generated by a current flowing in one of a plurality of parallel wires, a measuring unit for measuring a magnetic field intensity based on an output signal from the magnetic field detector, an input unit for entering a pitch of the parallel wires and a spatial resolution characteristic of the magnetic field detector, a processor for calculating a height of the magnetic field detector from the one of the parallel wires based on the pitch of the parallel wires and the spatial resolution characteristic, and a scanning device for scanning the magnetic field detector into a position determined by the processor.