Patents by Inventor Naoya Tayagaki

Naoya Tayagaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11746205
    Abstract: Heat-expandable microspheres including a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a polymer of a polymerizable component containing a cross-linkable monomer (A) which has at least two (meth)acryloyl groups per molecule and a reactive carbon-carbon double bond in addition to the (meth)acryloyl groups and has a molecular weight of at least 500. Also disclosed are hollow resin particles manufactured by expanding the heat-expandable microspheres; fine-particle-coated hollow resin particles including the hollow resin particles; a composition including a base component and the heat-expandable microspheres, or hollow resin particles, or fine-particle coated hollow resin particles; and a formed article manufactured by forming the composition.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: September 5, 2023
    Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya Tayagaki, Katsushi Miki
  • Publication number: 20210363320
    Abstract: Heat-expandable microspheres including a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a polymer of a polymerizable component containing a cross-linkable monomer (A) which has at least two (meth)acryloyl groups per molecule and a reactive carbon-carbon double bond in addition to the (meth)acryloyl groups and has a molecular weight of at least 500. Also disclosed are hollow resin particles manufactured by expanding the heat-expandable microspheres; fine-particle-coated hollow resin particles including the hollow resin particles; a composition including a base component and the heat-expandable microspheres, or hollow resin particles, or fine-particle coated hollow resin particles; and a formed article manufactured by forming the composition.
    Type: Application
    Filed: January 16, 2019
    Publication date: November 25, 2021
    Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya TAYAGAKI, Katsushi MIKI
  • Patent number: 10774192
    Abstract: Hollow resin particles, a production process for producing the same and application thereof. The hollow resin particles include a thermoplastic resin shell and a hollow part surrounded by the shell. The thermoplastic resin is a polymer produced from a polymerizable component containing 0.6 to 3.0 wt % of a crosslinkable monomer having at least two polymerizable carbon-carbon double bonds per molecule and 97 to 99.4 wt % of an uncrosslinkable monomer having one polymerizable carbon-carbon double bond per molecule. A blowing agent is encapsulated in the hollow resin particles. The blowing agent contains 50 to 100 wt % of an organic compound having a vapor pressure higher than 100 kPa at 25° C. Further, the encapsulation ratio of the blowing agent ranges from 3 to 13 wt % of the hollow resin particles.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: September 15, 2020
    Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya Tayagaki, Katsushi Miki
  • Patent number: 10731020
    Abstract: A rubber composition for vulcanization molding which can be manufactured into a rubber product with good dimensional stability, good appearance and sufficiently light weight, a process for manufacturing the same, and applications thereof. A rubber composition for vulcanization molding containing hollow particles and a base rubber, wherein the hollow particles are composed of a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein and have a specified further expansion ratio, and the base rubber has a Mooney viscosity ML (1+4) ranging from 5 to 90 at 100° C. Also disclosed is a process for manufacturing the rubber composition, hollow particles used for manufacturing the rubber composition, a masterbatch including the hollow particles and a rubber product manufactured from the rubber composition.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: August 4, 2020
    Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya Tayagaki, Katsushi Miki
  • Publication number: 20190194415
    Abstract: Hollow resin particles, a production process for producing the same and application thereof. The hollow resin particles include a thermoplastic resin shell and a hollow part surrounded by the shell. The thermoplastic resin is a polymer produced from a polymerizable component containing 0.6 to 3.0 wt % of a crosslinkable monomer having at least two polymerizable carbon-carbon double bonds per molecule and 97 to 99.4 wt % of an uncrosslinkable monomer having one polymerizable carbon-carbon double bond per molecule. A blowing agent is encapsulated in the hollow resin particles. The blowing agent contains 50 to 100 wt % of an organic compound having a vapor pressure higher than 100 kPa at 25° C. Further, the encapsulation ratio of the blowing agent ranges from 3 to 13 wt % of the hollow resin particles.
    Type: Application
    Filed: July 7, 2017
    Publication date: June 27, 2019
    Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya TAYAGAKI, Katsushi MIKI
  • Publication number: 20180208733
    Abstract: A rubber composition for vulcanization molding which can be manufactured into a rubber product with good dimensional stability, good appearance and sufficiently light weight, a process for manufacturing the same, and applications thereof. A rubber composition for vulcanization molding containing hollow particles and a base rubber, wherein the hollow particles are composed of a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein and have a specified further expansion ratio, and the base rubber has a Mooney viscosity ML (1+4) ranging from 5 to 90 at 100° C. Also disclosed is a process for manufacturing the rubber composition, hollow particles used for manufacturing the rubber composition, a masterbatch including the hollow particles and a rubber product manufactured from the rubber composition.
    Type: Application
    Filed: July 8, 2016
    Publication date: July 26, 2018
    Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya TAYAGAKI, Katsushi MIKI
  • Patent number: 10030115
    Abstract: Heat-expandable microspheres composed of a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein, and having an average particle size ranging from 1 to 100 ?m. The amount of DMF-insoluble matter (G1) and the amount of DMF-MEK-insoluble matter (G2) constituting the heat-expandable microspheres satisfy 1.05<G2/G1. The expansion of the heat-expandable microspheres satisfy Hmax/Tmax?13 (?m/° C.) where Hmax and Tmax are as defined herein. Also disclosed in a process for producing the heat-expandable microspheres which includes preparing an aqueous suspension comprising oily globules dispersed in an aqueous dispersion medium containing a hydrophilic cross-linking agent, wherein the oily globules are made of an oily mixture comprising the blowing agent and a monomer component; and polymerizing the monomer component.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: July 24, 2018
    Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya Tayagaki, Katsushi Miki
  • Patent number: 9663626
    Abstract: Heat-expandable microspheres with high encapsulation efficiency of a blowing agent and good heat-expansion performance, a process for reproducibly producing the heat-expandable microspheres and application thereof are provided. The heat-expandable microspheres comprise essentially a thermoplastic resin shell and a blowing agent encapsulated therein, and contain not more than 500 ppm of silicon, not more than 350 ppm of aluminum and not more than 600 ppm of the total of the silicon and aluminum. The heat-expandable microspheres retain at least 70% of the blowing agent encapsulated therein at the temperature which is the average of their expansion-initiation temperature and maximum expansion temperature.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: May 30, 2017
    Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya Tayagaki, Yasuyuki Nomura
  • Publication number: 20160237234
    Abstract: Heat-expandable microspheres composed of a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein, and having an average particle size ranging from 1 to 100 ?m. The amount of DMF-insoluble matter (G1) and the amount of DMF-MEK-insoluble matter (G2) constituting the heat-expandable microspheres satisfy 1.05<G2/G1. The expansion of the heat-expandable microspheres satisfy Hmax/Tmax?13 (?m/° C.) where Hmax and Tmax are as defined herein. Also disclosed in a process for producing the heat-expandable microspheres which includes preparing an aqueous suspension comprising oily globules dispersed in an aqueous dispersion medium containing a hydrophilic cross-linking agent, wherein the oily globules are made of an oily mixture comprising the blowing agent and a monomer component; and polymerizing the monomer component.
    Type: Application
    Filed: October 2, 2014
    Publication date: August 18, 2016
    Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
    Inventors: Naoya TAYAGAKI, Katsushi MIKI
  • Publication number: 20140364521
    Abstract: Heat-expandable microspheres with high encapsulation efficiency of a blowing agent and good heat-expansion performance, a process for reproducibly producing the heat-expandable microspheres and application thereof are provided. The heat-expandable microspheres comprise essentially a thermoplastic resin shell and a blowing agent encapsulated therein, and contain not more than 500 ppm of silicon, not more than 350 ppm of aluminum and not more than 600 ppm of the total of the silicon and aluminum. The heat-expandable microspheres retain at least 70% of the blowing agent encapsulated therein at the temperature which is the average of their expansion-initiation temperature and maximum expansion temperature.
    Type: Application
    Filed: January 21, 2013
    Publication date: December 11, 2014
    Inventors: Naoya Tayagaki, Yasuyuki Nomura