Abstract: A monitoring system includes an arithmetic processor. The arithmetic processor receives captured image information representing a captured image obtained by capturing an image of a subject and generates notification information representing a particular notification content depending on a condition of the subject. The arithmetic processor includes a first arithmetic processor and a second arithmetic processor. The first arithmetic processor obtains a condition quantity by quantifying the condition of the subject by reference to the captured image information and based on a parameter about a human activity status. The second arithmetic processor selects, according to the condition quantity, the particular notification content from contents of notification classified into N stages, where N is an integer equal to or greater than three.

Abstract: A monitoring system includes an arithmetic processor. The arithmetic processor receives captured image information representing a captured image obtained by capturing an image of a subject and generates notification information representing a particular notification content depending on a condition of the subject. The arithmetic processor includes a first arithmetic processor and a second arithmetic processor. The first arithmetic processor obtains a condition quantity by quantifying the condition of the subject by reference to the captured image information and based on a parameter about a human activity status. The second arithmetic processor selects, according to the condition quantity, the particular notification content from contents of notification classified into N stages, where N is an integer equal to or greater than three.

Abstract: A protective element includes a semiconductor substrate, connecting electrodes, bottom electrodes, and a protection circuit. The connecting electrodes are provided on a mount surface of the semiconductor substrate on which a light-emitting element for flip-chip mounting is mounted so as to be each connected to an electrode of the light-emitting element. The protection circuit is provided in the semiconductor substrate so as to be connected through the connecting electrodes to the light-emitting element. The bottom electrodes are provided on a surface of the semiconductor substrate opposite to the mount surface, are each connected to a corresponding one of the connecting electrodes, and are configured so as to be each connected to an electrode on the mounting base.