Abstract: A power management system, which has a holding function capable of holding power in the form of storable energy, and a supply function for supplying power procured from a contractor to the holding function, sets a utilizable range of storable energy held by the holding function. In the setting, if an amount of storable energy held by the holding function exceeds a predetermined amount, an excess of the storable energy exceeding the predetermined amount is set as utilizable storable energy.

Abstract: The present invention provides a power management system for managing a power unit, the power management system comprising: an obtaining unit configured to obtain utilization plan information of the power unit pre-registered by a user of the power unit; a creation unit configured to create an operation plan of the power unit based on the utilization plan information obtained by the obtaining unit; and a setting unit configured to set an incentive to the user according to the utilization plan information obtained by the obtaining unit.

Abstract: A management apparatus that manages an electric power device of an electric power consumer, comprises: an obtaining unit configured to obtain characteristic information of the electric power device as information related to an environmental load; and a planning unit configured to plan a priority rank of an operation of the electric power device in utilization of electric power of the electric power device based on the characteristic information obtained by the obtaining unit.

Abstract: A power management system, which has a holding function capable of holding power in the form of storable energy, and a supply function for supplying power procured from a contractor to the holding function, sets a utilizable range of storable energy held by the holding function. In the setting, if an amount of storable energy held by the holding function exceeds a predetermined amount, an excess of the storable energy exceeding the predetermined amount is set as utilizable storable energy.

Abstract: A plurality of inner leads 14 are provided around a die pad 13. A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14. A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21. The semiconductor chip 17 and the GND lead 16 are connected to each other by GND wires 22. The GND wires 22 are disposed between a plurality of wires 21. The distance between ends of each adjacent pair of the inner leads 14 is 0.2 mm or less.

Abstract: A semiconductor device in which memory chips are stacked on the surface of a wiring substrate has a microcomputer chip and an interposer chip arranged on the surface of the memory chip. The pads of the microcomputer chip and the pads of the interposer chip are arranged almost circularly and are connected by bonding wires.

Abstract: A plurality of inner leads 14 are provided around a die pad 13. A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14. A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21. The semiconductor chip 17 and the GND lead 16 are connected to each other by GND wires 22. The GND wires 22 are disposed between a plurality of wires 21. The distance between ends of each adjacent pair of the inner leads 14 is 0.2 mm or less.

Abstract: The semiconductor device with which bonding wires cannot contact easily is offered. In this semiconductor device, memory chips are stacked on the surface of a wiring substrate, a microcomputer chip and an interposer chip are arranged on the surface of the memory chip, and the pad of a microcomputer chip and the pad of an interposer chip arranged almost circularly are connected by a bonding wire. Therefore, since the transfer pressure of liquid resin for sealing can be weakened with a wire, contact of the wires by deformation of a wire can be prevented.

Abstract: The resin sealing apparatus includes a mold that has a main cavity into which a portion of a semiconductor device to be sealed with a resin is disposed. Furthermore, an external-shape regulating member is detachably accommodated in the main cavity of the mold to form a new cavity inside the main cavity.

Abstract: The resin sealing apparatus includes a mold that has a main cavity into which a portion of a semiconductor device to be sealed with a resin is disposed. Furthermore, an external-shape regulating member is detachably accommodated in the main cavity of the mold to form a new cavity inside the main cavity.