Patents by Inventor Naoyoshi Kikuchi

Naoyoshi Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Probe card and method for manufacturing probe card
    Publication number: 20070134824
    Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.
    Type: Application
    Filed: January 26, 2007
    Publication date: June 14, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Yoshikazu Arisaka, Kunihiro Itagaki, Shigenobu Ishihara, Tomohiro Giga, Naoyoshi Kikuchi
  • Probe card and method for manufacturing probe card
    Patent number: 7180312
    Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: February 20, 2007
    Assignee: Fujitsu Limited
    Inventors: Yoshikazu Arisaka, Kunihiro Itagaki, Shigenobu Ishihara, Tomohiro Giga, Naoyoshi Kikuchi
  • Probe card and method for manufacturing probe card
    Publication number: 20030184330
    Abstract: A probe card that is manufactured inexpensively. The probe card includes a base plate, a flexible substrate, and a contact probe. The contact probe is a flexible substrate formed from polyimide resin. The contact probe has a plurality of parallel wires. Each wire has a distal end that functions as a contact. The contact probe is produced by cutting a general purpose substrate having a plurality of parallel wires formed at a predetermined pitch. The number of the parallel wires is equal to the number of pads of an LSI chip.
    Type: Application
    Filed: March 25, 2003
    Publication date: October 2, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Yoshikazu Arisaka, Kunihiro Itagaki, Shigenobu Ishihara, Tomohiro Giga, Naoyoshi Kikuchi
  • System and method for testing and evaluating a device
    Patent number: 6407572
    Abstract: A system for testing and evaluating a device, such as a LSI device, by searching for a factor of defect of the device is disclosed, in which terminals are classified into a plurality of terminal types based on information related to various testing conditions, and data concerning the margin of the testing conditions is obtained by altering the testing conditions for every terminal type. Further, a factor of defect of a specific terminal type is searched for in accordance with the data concerning the margin of the testing conditions, and a defective terminal is detected from the specific terminal type. A method for testing and evaluating the device is also disclosed, which is executed by operating the system described above.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: June 18, 2002
    Assignee: Fujitsu Limited
    Inventors: Masahiro Kanase, Takayuki Katayama, Naoyoshi Kikuchi