Patents by Inventor Naoyuki Akita

Naoyuki Akita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic-component mounting structure
    Patent number: 6330166
    Abstract: In an electronic-component mounting structure, an electronic component (2) has a surface. First electrodes (1) provided on the surface of the electronic component (2) are arranged in a first array. Second electrodes (3) provided on a base board (4) are arranged in a second array corresponding to the first array. The second electrodes (3) correspond to the first electrodes (1) respectively. Solder bumps (9) connect the first electrodes (1) and the second electrodes (3) respectively. The first electrodes (1) include first outermost electrodes (1b) located in an outer area of the first array. The second electrodes (3) include second outermost electrodes (3b, 3c) located in an outer area of the second array. The second outermost electrodes (3b, 3c) correspond to the first outermost electrodes (1b) respectively.
    Type: Grant
    Filed: September 20, 1999
    Date of Patent: December 11, 2001
    Assignee: Denso Corporation
    Inventors: Masayuki Aoyama, Yasuaki Matsunaga, Tomoyuki Hiramatsu, Naoyuki Akita, Koji Kondo