Patents by Inventor Naoyuki Horigome

Naoyuki Horigome has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6446331
    Abstract: An electronic component mounting apparatus and an electronic component mounting method are provided which improve the productivity by reducing the cycle time. The electronic component mounting method includes the steps of a) picking up an electronic component from a first supplying section or a second supplying section respectively disposed on each side of a substrate, b) recognizing the electronic component by a recognition section, and c) moving and mounting the electronic component on the substrate. Frequently used electronic components are stored in both of the first and second supplying sections. The electronic components are picked up from the first supplying section and mounted on the substrate in the normal operating conditions. When the electronic components stored in the first supplying section run out, the same kind of components are provided by the second supplying section to continue the mounting operation.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: September 10, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Naoyuki Horigome
  • Publication number: 20010037566
    Abstract: An electronic component mounting apparatus and an electronic component mounting method are provided which improve the productivity by reducing the cycle time. The electronic component mounting method includes the steps of a) picking up an electronic component from a first supplying section or a second supplying section respectively disposed on each side of a substrate, b) recognizing the electronic component by a recognition section, and c) moving and mounting the electronic component on the substrate. Frequently used electronic components are stored in both of the first and second supplying sections. The electronic components are picked up from the first supplying section and mounted on the substrate in the normal operating conditions. When the electronic components stored in the first supplying section run out, the same kind of components are provided by the second supplying section to continue the mounting operation.
    Type: Application
    Filed: June 29, 2001
    Publication date: November 8, 2001
    Inventor: Naoyuki Horigome
  • Patent number: 5179819
    Abstract: A method of preparation of packaging bags for bottles, wherein a scrap piece formed at the closed end of the bag is discharged by mechanical methods. In one method, a long cylindrical film sheet is fed to the apparatus so as to place the portion of the film sheet forming the open end of the bag at the top and both sides of scrap pieces are cut and separated simultaneously. In another method, a long cylindrical film sheet is fed to the apparatus so as to place the portion of the film sheet forming a scrap piece at the top, and the scrap piece and the periphery of a closed end of the bag are cut simultaneously.
    Type: Grant
    Filed: July 15, 1991
    Date of Patent: January 19, 1993
    Assignees: Sumitomo Bakelite Company, Ltd., Sumitomo Heavy Industries, Ltd.
    Inventors: Ryuzo Sukeyasu, Yoshiyuki Kishina, Masao Okawa, Naoyuki Horigome, Yasuhito Ito