Abstract: A method for manufacturing a liquid ejection head including an element substrate having an ejection port forming member including an ejection port and an energy generating element for supplying energy for ejecting liquid to the ejection port includes preparing a wafer having the energy generating element and the ejection port forming member on a first surface, forming a recessed portion in a second surface, and cutting the wafer. The wafer is cut along cutting lines provided on the first surface to form element substrates and including a first cutting line and a second cutting line intersecting the first cutting line. The recessed portion is formed at a position overlapping the cutting lines except in an intersection portion of the first and second cutting lines. In the intersection portion, the recessed portion is formed corresponding to only one of the first cutting line and the second cutting line.

Abstract: A method of manufacturing a liquid discharging head includes preparing a wafer provided with an element and a discharge port formation member on a front surface of the wafer, forming a recessed portion in a rear surface of the wafer, attaching the rear surface of the wafer and a dicing tape, cutting the wafer along cutting lines to form an element board, and connecting an electric wiring board and a terminal of the element board. The element board includes a discharge port formation member having a discharge port for discharging liquid and includes the element to supply energy to the discharge port for liquid discharge. The recessed portion is formed at a location corresponding to the cutting lines, and an area of a region where the terminal overlaps the recessed portion is smaller than an area of a region where the terminal does not overlap the recessed portion.