Patents by Inventor Naoyuki Kuroe

Naoyuki Kuroe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for reducing thermal stress in an encapsulated integrated circuit package
    Patent number: 5300459
    Abstract: A method wherein a circuit substrate device is provided having a semiconductor element and a circuit substrate between which a protective resin is placed.The protective resin has a smaller coefficient of linear expansion than that of the circuit substrate and a greater coefficient of linear expansion than that of the semiconductor element. Therefore, the protective resin may mitigate the influences of thermal stress due to differential in the thermal coefficients of expansion between the semiconductor element and circuit substrate to prevent warpage of the circuit substrate.
    Type: Grant
    Filed: November 4, 1992
    Date of Patent: April 5, 1994
    Assignee: Sanken Electric Co., Ltd.
    Inventors: Takao Ushikubo, Naoyuki Kuroe