Patents by Inventor Naoyuki Omura
Naoyuki Omura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11560640Abstract: The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.Type: GrantFiled: December 26, 2017Date of Patent: January 24, 2023Assignee: C. Uyemura & Co., Ltd.Inventors: Takuya Okamachi, Naoyuki Omura, Kanako Matsuda
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Patent number: 11248305Abstract: The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.Type: GrantFiled: April 18, 2018Date of Patent: February 15, 2022Assignee: C. UYEMURA & CO., LTD.Inventors: Naoyuki Omura, Yuki Itakura, Kazunari Kato, Raihei Ikumoto
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Publication number: 20180305833Abstract: The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.Type: ApplicationFiled: April 18, 2018Publication date: October 25, 2018Applicant: C. Uyemura & Co., Ltd.Inventors: Naoyuki OMURA, Yuki ITAKURA, Kazunari KATO, Raihei IKUMOTO
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Publication number: 20180195193Abstract: The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.Type: ApplicationFiled: December 26, 2017Publication date: July 12, 2018Inventors: Takuya Okamachi, Naoyuki Omura, Kanako Matsuda
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Patent number: 9730337Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.Type: GrantFiled: May 22, 2012Date of Patent: August 8, 2017Assignee: C. UYEMURA & CO., LTD.Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Kanako Matsuda
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Patent number: 9028668Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ?-caprolactam, is contained in the bath as a leveler.Type: GrantFiled: July 21, 2010Date of Patent: May 12, 2015Assignee: C. Uyemura & Co., LtdInventors: Toshihisa Isono, Naoyuki Omura, Koji Shimizu, Shinji Tachibana
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Patent number: 8801912Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel.Type: GrantFiled: March 10, 2009Date of Patent: August 12, 2014Assignee: C. Uyemura & Co., Ltd.Inventors: Naoyuki Omura, Toshihisa Isono, Koji Shimizu, Shinji Tachibana, Tomohiro Kawase, Shunsaku Hoshi
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Publication number: 20140120245Abstract: The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.Type: ApplicationFiled: May 22, 2012Publication date: May 1, 2014Applicant: C. UYEMURA & CO., LTD.Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Kanako Matsuda
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Patent number: 8679317Abstract: A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes.Type: GrantFiled: May 21, 2007Date of Patent: March 25, 2014Assignee: C. Uyemura & Co., Ltd.Inventors: Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura
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Publication number: 20110214994Abstract: A pretreating agent for electroplating includes an aqueous solution containing, as essential ingredient, (A) at least one anti-adsorption agent selected from among a triazole compound, a pyrazole compound, an imidazole compound, a cationic surfactant, and an amphoteric surfactant, and (B) chloride ion. The pretreating agent does not impair adhesion between substrate copper and a photoresist, and does not damage adhesion between the substrate copper and an electrolytic copper plating film.Type: ApplicationFiled: March 1, 2011Publication date: September 8, 2011Applicant: C. UYEMURA & CO., LTDInventors: Masayuki Utsumi, Naoyuki Omura, Takuya Okamachi
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Patent number: 7988842Abstract: A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed to air bubbling, so that decomposed/degenerated organic products formed by decomposition or degeneration produced during the copper electroplating can be oxidatively decomposed.Type: GrantFiled: July 24, 2008Date of Patent: August 2, 2011Assignee: C. Uyemura & Co., Ltd.Inventors: Shinji Tachibana, Koji Shimizu, Tomohiro Kawase, Naoyuki Omura, Toshihisa Isono, Kazuyoshi Nishimoto
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Publication number: 20110089044Abstract: Disclosed herein is a copper electrolytic plating bath including copper sulfate used in an amount of 50 to 250 g/liter calculated as copper sulfate pentahydrate, 20 to 200 g/liter of sulfuric acid, and 20 to 150 mg/liter of a chloride ion, and a sulfur atom-containing organic compound and a nitrogen atom-containing organic compound serving as organic additives. The nitrogen atom-containing organic compound includes a nitrogen atom-containing polymer compound obtained by a two-stage reaction including reacting one mole of morpholine with two moles of epichlorohydrin in an acidic aqueous solution to obtain a reaction product and further reacting one to two moles, relative to one mole of the morpholine, of imidazole with the reaction product.Type: ApplicationFiled: October 13, 2010Publication date: April 21, 2011Applicant: C. UYEMURA & CO., LTD.Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Shunsaku Hoshi
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Publication number: 20110062029Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ?-caprolactam, is contained in the bath as a leveler.Type: ApplicationFiled: July 21, 2010Publication date: March 17, 2011Applicant: C. UYEMURA & CO., LTD.Inventors: Toshihisa Isono, Naoyuki Omura, Koji Shimizu, Shinji Tachibana
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Publication number: 20110056840Abstract: An electrolytic plating equipment includes: a plating tank for holding plating solution; and a separate tank apart from the plating tank, for holding the plating solution circulating between the plating tank and the separate tank. The separate tank contains a first space and a second space located downstream from the first space. The plating solution in the first space in an amount exceeding a specific height flows from the first space into the second space, and the plating solution falls through air in the second space.Type: ApplicationFiled: September 7, 2010Publication date: March 10, 2011Applicant: C. UYEMURA & CO., Ltd.Inventors: Toshihisa Isono, Shinji Tachibana, Naoyuki Omura, Shunsaku Hoshi, Kanako Matsuda, Koji Shimizu
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Patent number: 7892411Abstract: Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm2·min based on the immersed area.Type: GrantFiled: August 7, 2008Date of Patent: February 22, 2011Assignee: C. Uyemura & Co., Ltd.Inventors: Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura, Toshihisa Isono, Koji Shimizu
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Publication number: 20100219081Abstract: A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes.Type: ApplicationFiled: May 21, 2007Publication date: September 2, 2010Applicant: C. UYEMURA & CO., LTD.Inventors: Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura
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Publication number: 20090229986Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel.Type: ApplicationFiled: March 10, 2009Publication date: September 17, 2009Applicant: C. Uyemura & Co., Ltd.Inventors: Naoyuki OMURA, Toshihisa ISONO, Koji SHIMIZU, Shinji TACHIBANA, Tomohiro KAWASE, Shunsaku HOSHI
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Publication number: 20090092749Abstract: A manufacturing method of a buildup circuit board includes forming a wiring layer on an organic polymer insulating layer by copper electroplating and building up other organic polymer insulating layer on the wiring layer, wherein in a final step of the copper electroplating, a surface of the wiring layer is roughened by copper electroplating and the organic polymer insulating layer is formed directly on the roughened surface of the wiring layer. According to the invention, a specific etching step that is essential for enhancing adhesion between the organic polymer insulating layer and the wiring layer can be omitted and no expensive etching apparatus is necessary, thus being good in economy. In addition, if various types of copper sulfate plating baths containing different types of additives used for via fill plating are used as they are, irregularities on the surface can be made in various forms and roughnesses.Type: ApplicationFiled: September 18, 2008Publication date: April 9, 2009Applicant: C. Uyemura & Co., Ltd.Inventors: Shinji TACHIBANA, Naoyuki OMURA, Tomohiro KAWASE, Toshihisa ISONO, Teruyuki HOTTA
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Publication number: 20090038952Abstract: Disclosed herein is an electrolytic copper plating process for electroplating copper on workpieces in a copper sulfate plating bath filled in a plating tank and containing an organic additive while using a soluble anode or insoluble anode as an anode and the workpieces as cathodes, including the steps of, setting a bath current density at not higher than 5 A/L, immersing metal copper in a region of the copper sulfate plating bath, the region being apart from a region between the anode and the cathode and also from regions adjacent the anode and cathode, respectively, such that a neighborhood of the thus-immersed metal copper can be used as an oxidative decomposition region, setting an immersed area of the metal copper at not smaller than 0.001 dm2/L based on the plating bath, and applying air bubbling to the oxidative decomposition region at not lower than 0.01 L/dm2·min based on the immersed area.Type: ApplicationFiled: August 7, 2008Publication date: February 12, 2009Inventors: Shinji TACHIBANA, Tomohiro KAWASE, Naoyuki OMURA, Toshihisa ISONO, Koji SHIMIZU
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Publication number: 20090026083Abstract: A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an lo overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed to air bubbling, so that decomposed/degenerated organic products formed by decomposition or degeneration produced during the copper electroplating can be oxidatively decomposed.Type: ApplicationFiled: July 24, 2008Publication date: January 29, 2009Inventors: Shinji TACHIBANA, Koji Shimizu, Tomohiro Kawase, Naoyuki Omura, Toshihisa Isono, Kazuyoshi Nishimoto