Patents by Inventor Naoyuki Tani
Naoyuki Tani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11474423Abstract: A wavelength conversion device includes a matrix containing inorganic material, a phosphor embedded in the matrix, and filler particles embedded in the matrix and containing resin material. This wavelength conversion device prevents the phosphor from falling.Type: GrantFiled: October 4, 2019Date of Patent: October 18, 2022Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Takahiro Hamada, Naoyuki Tani, Takashi Ohbayashi, Yoshihisa Nagasaki
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Publication number: 20220100068Abstract: Provided is a technique for suppressing a temperature rise of a wavelength conversion member. The present disclosure is provided with: phosphor layer containing a phosphor; substrate that supports phosphor layer; and heat sink bonded to substrate, wherein the thermal conductivity of substrate is greater than the thermal conductivity of phosphor layer, and the thermal conductivity of heat sink is greater than the thermal conductivity of substrate, or the thermal conductivity of heat sink is smaller than the thermal conductivity of substrate.Type: ApplicationFiled: October 17, 2019Publication date: March 31, 2022Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Yoshihisa NAGASAKI, Takashi OHBAYASHI, Naoyuki TANI, Nobuyasu SUZUKI, Takahiro HAMADA, Yukihiko SUGIO
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Patent number: 11268003Abstract: Provided is a heat storage device (10) of the present disclosure comprises a heat storage material (12) containing sodium acetate trihydrate; a first electrode having a surface which is in contact with the heat storage material and formed of at least one selected from the group consisting of silver, a silver alloy, and a silver compound; a second electrode in contact with the heat storage material; an inorganic porous material contained in the heat storage material; and a power supply (14) for applying a voltage to the first electrode and the second electrode. The inorganic porous material has an average pore diameter of not more than 50 nanometers. The present invention provides a heat storage device capable of releasing heat by releasing a supercooled state by voltage application. The heat storage device can be used repeatedly.Type: GrantFiled: October 30, 2019Date of Patent: March 8, 2022Assignee: PANASONIC CORPORATIONInventors: Takashi Kubo, Motohiro Suzuki, Hironobu Machida, Shinsuke Takeguchi, Kentaro Shii, Naoyuki Tani, Tatsuya Nakamura
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Publication number: 20220057702Abstract: A wavelength conversion device includes a matrix containing inorganic material, a phosphor embedded in the matrix, and filler particles embedded in the matrix and containing resin material. This wavelength conversion device prevents the phosphor from falling.Type: ApplicationFiled: October 4, 2019Publication date: February 24, 2022Inventors: Takahiro HAMADA, Naoyuki TANI, Takashi OHBAYASHI, Yoshihisa NAGASAKI
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Publication number: 20200063012Abstract: Provided is a heat storage device (10) of the present disclosure comprises a heat storage material (12) containing sodium acetate trihydrate; a first electrode having a surface which is in contact with the heat storage material and formed of at least one selected from the group consisting of silver, a silver alloy, and a silver compound; a second electrode in contact with the heat storage material; an inorganic porous material contained in the heat storage material; and a power supply (14) for applying a voltage to the first electrode and the second electrode. The inorganic porous material has an average pore diameter of not more than 50 nanometers. The present invention provides a heat storage device capable of releasing heat by releasing a supercooled state by voltage application. The heat storage device can be used repeatedly.Type: ApplicationFiled: October 30, 2019Publication date: February 27, 2020Inventors: TAKASHI KUBO, MOTOHIRO SUZUKI, HIRONOBU MACHIDA, SHINSUKE TAKEGUCHI, KENTARO SHII, NAOYUKI TANI, TATSUYA NAKAMURA
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Patent number: 10571202Abstract: The heat storage apparatus of the present disclosure includes a casing, a heat storage material that is located in the casing, a stirrer that is located in the casing, that is in contact with the heat storage material, and that rotates to stir the heat storage material, and a projection that is in contact with the heat storage material, that projects from the stirrer, and that rotates with rotation of the stirrer. The projection is continuously in contact with an inner face of the casing while the stirrer rotates.Type: GrantFiled: October 3, 2017Date of Patent: February 25, 2020Assignee: PANASONIC CORPORATIONInventors: Hironobu Machida, Motohiro Suzuki, Shinsuke Takeguchi, Takashi Kubo, Kentaro Shii, Naoyuki Tani, Tatsuya Nakamura
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Publication number: 20180112931Abstract: The heat storage apparatus of the present disclosure includes a casing, a heat storage material that is located in the casing, a stirrer that is located in the casing, that is in contact with the heat storage material, and that rotates to stir the heat storage material, and a projection that is in contact with the heat storage material, that projects from the stirrer, and that rotates with rotation of the stirrer. The projection is continuously in contact with an inner face of the casing while the stirrer rotates.Type: ApplicationFiled: October 3, 2017Publication date: April 26, 2018Inventors: HIRONOBU MACHIDA, MOTOHIRO SUZUKI, SHINSUKE TAKEGUCHI, TAKASHI KUBO, KENTARO SHII, NAOYUKI TANI, TATSUYA NAKAMURA
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Patent number: 9730320Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 ?m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.Type: GrantFiled: October 27, 2011Date of Patent: August 8, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Naoyuki Tani, Yoshito Kitagawa
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Patent number: 8866022Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor.Type: GrantFiled: September 2, 2010Date of Patent: October 21, 2014Assignee: Panasonic CorporationInventors: Yoshito Kitagawa, Naoyuki Tani, Toshiyuki Asahi
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Publication number: 20140225152Abstract: A wiring board includes a base in which plate wirings formed of a metal plate are integrally formed with an insulating portion made of resin or a resin composition and surface wirings electrically connected to the plate wirings. The base has first and second surfaces on which the surface wirings are formed. The surface wirings are thinner than the plate wirings, and the minimum wiring gap between the surface wirings is smaller than the minimum wiring gap between the plate wirings. One of the plate wirings has substantially the same shape as that of a region where the first top-surface wiring on the first surface and the first bottom-surface wiring on the second surface overlap with each other in the normal direction of the first surface. The first top-surface wiring and the first bottom-surface wiring are connected to each other through the above-mentioned one of the plate wirings.Type: ApplicationFiled: April 21, 2014Publication date: August 14, 2014Applicant: Panasonic CorporationInventors: Toshiyuki ASAHI, Naoyuki TANI, Yoshito KITAGAWA, Yuta OKAZAKI
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Patent number: 8603624Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.Type: GrantFiled: October 29, 2010Date of Patent: December 10, 2013Assignee: Panasonic CorporationInventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Yoshito Kitagawa, Naoyuki Tani
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Publication number: 20130215628Abstract: A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 ?m, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.Type: ApplicationFiled: October 27, 2011Publication date: August 22, 2013Applicant: PANASONIC CORPORATIONInventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Naoyuki Tani, Yoshito Kitagawa
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Publication number: 20120228010Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.Type: ApplicationFiled: October 29, 2010Publication date: September 13, 2012Inventors: Takashi Matsuda, Kiyotaka Komori, Akiyoshi Nozue, Takayuki Suzue, Mitsuyoshi Nishino, Toshiyuki Asahi, Yoshito Kitagawa, Naoyuki Tani
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Publication number: 20120152599Abstract: A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor.Type: ApplicationFiled: September 2, 2010Publication date: June 21, 2012Applicant: PANASONIC CORPORATIONInventors: Yoshito Kitagawa, Naoyuki Tani, Toshiyuki Asahi
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Publication number: 20050179385Abstract: In a plasma display panel containing a front plate having an dielectric glass layer for covering display electrodes formed on a transparent substrate, the glass composition forming the dielectric layer contains titanium. The glass composition should preferably contain 0.9-6.7 wt % of TiO2 on the basis of the weight of an oxide, further preferably, contain 2.6-5.5 wt % of TiO2 on the basis of the weight of an oxide.Type: ApplicationFiled: February 11, 2005Publication date: August 18, 2005Inventors: Osamu Morita, Naoyuki Tani, Tatsuo Mifune
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Patent number: 6666752Abstract: A wafer retainer includes: a foam layer capable of adsorbing a wafer on a surface thereof in a detachable manner; a first pressure-sensitive adhesive layer formed on a back face of the foam layer; a support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support for adhering to a base plate of a polishing machine; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-chain crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition.Type: GrantFiled: June 4, 2001Date of Patent: December 23, 2003Assignee: Nitta CorporationInventors: Masayoshi Yamamoto, Toshiaki Kasazaki, Naoyuki Tani, Shinichiro Kawahara, Takashi Ando
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Patent number: 6616520Abstract: A polishing cloth includes: a polishing cloth substrate; a first-pressure adhesive layer formed on a back face of the polishing cloth substrate; as support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-china crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition. The side-chain crystallizable polymer includes as a main component thereof an acrylic acid ester and/or methacrylic acid ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side chain.Type: GrantFiled: June 4, 2001Date of Patent: September 9, 2003Assignee: Nitta CorporationInventors: Shinichiro Kawahara, Toshiaki Kasazaki, Naoyuki Tani, Takashi Ando, Masayoshi Yamamoto
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Patent number: 6592420Abstract: A glass substrate manufacturing method and a color cathode ray tube manufacturing method manufactures a front substrate on which a phosphor layer is formed. In an application process a phosphor slurry of one color is applied onto an inner surface of a glass substrate on which a phosphor pattern in at least one color has already been formed. Then, in a spreading process, the glass substrate is rotated about an axis located at the approximate center of the inner surface to make the phosphor slurry spread out over its inner surface. Following this, in a draining process the glass substrate is tilted to a first tilt angle of more than 90° to drain excess slurry off the inner surface of the glass substrate, a tilt angle being formed between a vertical axis and an axis orthogonal to an outer surface of the glass substrate. In a spinning process the glass substrate is returned to a second tilt angle smaller than the first tilt angle, and rotated.Type: GrantFiled: June 13, 2000Date of Patent: July 15, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ryouji Onishi, Hikaru Nishimori, Hideo Iguchi, Naoyuki Tani
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Patent number: 6103297Abstract: A method of manufacturing a cathode-ray tube comprises a process of forming a phosphor screen. The process comprises an application process, a shake-off process, and a drying process. In the application process, a glass panel is tilted with respect to a vertical axis and is rotated having a tilt axis as a central axis to spread a phosphor slurry over almost the entire area of an inner face of the glass panel. In the shake-off process, by rotating the glass panel, excess phosphor slurry is shaken off, and the excess phosphor slurry is recovered in phosphor-slurry recovery members provided at the four corners of the glass panel. In the drying process, the phosphor slurry is dried. In this method, the tilt angle and rotation speed of the glass panel at least in one process out of the application process, the shake-off process, and the drying process is changed at least in two stages.Type: GrantFiled: December 21, 1998Date of Patent: August 15, 2000Assignee: Matsushita Electronics CorporationInventors: Nobuyuki Aoki, Kenji Nakada, Naoyuki Tani, Hiroshi Deguchi
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Patent number: 5936339Abstract: A color image receiving tube comprising three color (red, green and blue) phosphor screens on an inner surface of a face-plate; wherein at least two of said three color phosphor screens are coated with pigments; and wherein said three color phosphor screens have a total reflective brightness less than 70% that of three color phosphor screens with no pigment coating. According to the above-mentioned constitution, a color image receiving tube having a higher emisson brightness and contrast is achieved as compared to a color image receiving tube having the same reflective brightness, where the reflective brightness is obtained by lowering the light transmittance of its face-plate.Type: GrantFiled: April 22, 1997Date of Patent: August 10, 1999Assignee: Matsushita Electronics CorporationInventors: Hidekazu Hayama, Toshihide Takahashi, Masao Gotoh, Naoyuki Tani