Patents by Inventor Naoyuki Tasaka
Naoyuki Tasaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10972067Abstract: A filter includes: a substrate; input and output terminals located on the substrate; a resonant circuit located in a series pathway between the input and output terminals; a first component including a first inductor, which is electrically connected between a first node in the series pathway and a ground, and mounted in a first region on the substrate; a second component including a second inductor, which is electrically connected between a second node different from the first node in the series pathway and a ground, and mounted in a second region different from the first region on the substrate; and a third component including an acoustic wave resonator, which is electrically connected between a third node between the first and second nodes in the series pathway and a ground, and mounted in a third region between the first and second regions on the substrate.Type: GrantFiled: December 18, 2019Date of Patent: April 6, 2021Assignee: TAIYO YUDEN CO., LTD.Inventors: Jaeho Jeong, Shuei Hashimoto, Naoyuki Tasaka, Sachiko Tanaka, Makoto Inoue
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Publication number: 20200235714Abstract: A filter includes: a substrate; input and output terminals located on the substrate; a resonant circuit located in a series pathway between the input and output terminals; a first component including a first inductor, which is electrically connected between a first node in the series pathway and a ground, and mounted in a first region on the substrate; a second component including a second inductor, which is electrically connected between a second node different from the first node in the series pathway and a ground, and mounted in a second region different from the first region on the substrate; and a third component including an acoustic wave resonator, which is electrically connected between a third node between the first and second nodes in the series pathway and a ground, and mounted in a third region between the first and second regions on the substrate.Type: ApplicationFiled: December 18, 2019Publication date: July 23, 2020Applicant: TAIYO YUDEN CO., LTD.Inventors: Jaeho JEONG, Shuei HASHIMOTO, Naoyuki TASAKA, Sachiko TANAKA, Makoto INOUE
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Patent number: 10700666Abstract: A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.Type: GrantFiled: January 11, 2018Date of Patent: June 30, 2020Assignee: TAIYO YUDEN CO., LTD.Inventors: Sachiko Tanaka, Makoto Inoue, Naoyuki Tasaka
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Publication number: 20180226952Abstract: A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.Type: ApplicationFiled: January 11, 2018Publication date: August 9, 2018Applicant: TAIYO YUDEN CO., LTD.Inventors: Sachiko TANAKA, Makoto INOUE, Naoyuki TASAKA
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Patent number: 9634641Abstract: An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.Type: GrantFiled: October 27, 2014Date of Patent: April 25, 2017Assignee: TAIYO YUDEN CO., LTD.Inventors: Gohki Nishimura, Takuma Kuroyanagi, Naoyuki Tasaka, Sachiko Tanaka
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Patent number: 9252739Abstract: A module substrate includes: a multilayered wiring substrate that includes wiring layers; and embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8.Type: GrantFiled: December 10, 2013Date of Patent: February 2, 2016Assignee: TAIYO YUDEN CO., LTD.Inventors: Naoyuki Tasaka, Tooru Takezaki, Ken Sasaki
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Patent number: 9107305Abstract: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.Type: GrantFiled: December 13, 2013Date of Patent: August 11, 2015Assignee: TAIYO YUDEN CO., LTD.Inventors: Tetsuo Saji, Gohki Nishimura, Naoyuki Tasaka
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Patent number: 9093981Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and an active component that is provided on a surface of the laminate substrate and is connected with the filter chip, at least a part of the active component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.Type: GrantFiled: October 29, 2012Date of Patent: July 28, 2015Assignee: TAIYO YUDEN CO., LTD.Inventors: Sachiko Tanaka, Naoyuki Tasaka, Gohki Nishimura
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Publication number: 20150123744Abstract: An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.Type: ApplicationFiled: October 27, 2014Publication date: May 7, 2015Applicant: TAIYO YUDEN CO., LTD.Inventors: Gohki NISHIMURA, Takuma KUROYANAGI, Naoyuki TASAKA, Sachiko TANAKA
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Patent number: 8917520Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.Type: GrantFiled: March 26, 2014Date of Patent: December 23, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Sachiko Tanaka, Naoyuki Tasaka, Gohki Nishimura
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Publication number: 20140210569Abstract: A module substrate includes: a multilayered wiring substrate that includes wiring layers; and embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8.Type: ApplicationFiled: December 10, 2013Publication date: July 31, 2014Applicant: TAYO YUDEN CO., LTD.Inventors: Naoyuki TASAKA, Tooru TAKEZAKI, Ken SASAKI
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Publication number: 20140204549Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.Type: ApplicationFiled: March 26, 2014Publication date: July 24, 2014Applicant: TAIYO YUDEN CO., LTD.Inventors: Sachiko TANAKA, Naoyuki TASAKA, Gohki NISHIMURA
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Patent number: 8735732Abstract: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.Type: GrantFiled: December 20, 2011Date of Patent: May 27, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Tetsuo Saji, Gohki Nishimura, Naoyuki Tasaka
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Publication number: 20140104801Abstract: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.Type: ApplicationFiled: December 13, 2013Publication date: April 17, 2014Applicant: TAIYO YUDEN CO., LTD.Inventors: Tetsuo SAJI, Gohki NISHIMURA, Naoyuki TASAKA
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Publication number: 20120300416Abstract: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.Type: ApplicationFiled: December 20, 2011Publication date: November 29, 2012Applicant: TAIYO YUDEN CO., LTD.Inventors: Tetsuo SAJI, Gohki NISHIMURA, Naoyuki TASAKA
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Patent number: 7328041Abstract: A high-frequency switch module is less power consumable, and is able to be small-sized and thinner in thickness. The high-frequency switch module is also able to obtain an amount of attenuation in a stopband and proper characteristics. The high-frequency switch module includes a gallium arsenide (GaAs) switch made of gallium arsenide that is less power consumable and low pass filters for respective transmission systems. A low pass filter is composed of a first inductor and a capacitor connected in series, and second and third inductors respectively connected to input and output terminals, and the second and third inductors having inductances greater than that of the first inductor.Type: GrantFiled: October 14, 2004Date of Patent: February 5, 2008Assignee: Fujitsu Media Devices LimitedInventor: Naoyuki Tasaka
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Publication number: 20050079828Abstract: A high-frequency switch module is less power consumable, and is able to be small-sized and thinner in thickness. The high-frequency switch module is also able to obtain an amount of attenuation in a stopband and proper characteristics. The high-frequency switch module includes a gallium arsenide (GaAs) switch made of gallium arsenide that is less power consumable and low pass filters for respective transmission systems. A low pass filter is composed of a first inductor and a capacitor connected in series, and second and third inductors respectively connected to input and output terminals, and the second and third inductors having inductances greater than that of the first inductor.Type: ApplicationFiled: October 14, 2004Publication date: April 14, 2005Inventor: Naoyuki Tasaka