Patents by Inventor Naoyuki Umehara
Naoyuki Umehara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10615005Abstract: In a method of an embodiment, radio-frequency power is supplied to an electrode via a matching device from a radio-frequency power supply in order to generate plasma within a chamber. During the supply of the radio-frequency power, it is determined whether or not plasma is generated within the chamber from one or more parameters reflecting plasma generation within the chamber. When it is determined that plasma is not generated, a frequency of the radio-frequency power output from the radio-frequency power supply is adjusted to set the load side reactance of the radio-frequency power supply to zero or to bring the load side reactance close to zero.Type: GrantFiled: April 12, 2019Date of Patent: April 7, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Koichi Nagami, Kazunobu Fujiwara, Tadashi Gondai, Norikazu Yamada, Naoyuki Umehara
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Publication number: 20190318912Abstract: A plasma processing apparatus includes a radio-frequency power supply that outputs modulated radio-frequency power which is generated such that a power level during a first period is higher than a power level during a second period that alternates with the first period. The plasma processing apparatus also includes a matching device that sets a load side impedance of the radio-frequency power supply during a monitoring period within the first period to an impedance that differs from an output impedance of the radio-frequency power supply. The monitoring period starts after a predetermined time length elapses from a start point of the first period. The radio-frequency power supply adjusts the power level of the modulated radio-frequency power such that a load power level, which is a difference between a power level of a traveling wave and a power level of a reflected wave, becomes a designated power level.Type: ApplicationFiled: April 12, 2019Publication date: October 17, 2019Applicant: TOKYO ELECTRON LIMITEDInventors: Naoyuki UMEHARA, Masaki NISHIKAWA
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Publication number: 20190318915Abstract: In a method of an embodiment, radio-frequency power is supplied to an electrode via a matching device from a radio-frequency power supply in order to generate plasma within a chamber. During the supply of the radio-frequency power, it is determined whether or not plasma is generated within the chamber from one or more parameters reflecting plasma generation within the chamber. When it is determined that plasma is not generated, a frequency of the radio-frequency power output from the radio-frequency power supply is adjusted to set the load side reactance of the radio-frequency power supply to zero or to bring the load side reactance close to zero.Type: ApplicationFiled: April 12, 2019Publication date: October 17, 2019Applicant: TOKYO ELECTRON LIMITEDInventors: Koichi NAGAMI, Kazunobu FUJIWARA, Tadashi GONDAI, Norikazu YAMADA, Naoyuki UMEHARA
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Patent number: 10264662Abstract: Provided is a capacitively coupled plasma processing apparatus which improves a controllability of the RF bias function and reliably prevents unwanted resonance from being generated on a RF transmission line between a counter electrode and ground potential to enhance reliability of the plasma process. In the capacitive coupled type plasma processing apparatus, three kinds of RF powers from a first, second and third RF power supplies (35, 36, 38) are superimposed and applied to susceptor (lower electrode) (16). In such a three-frequency superimposing and applying application scheme, the frequency-impedance characteristic around upper electrode (48) is considered to prevent a serial resonance from occurring on an RF transmission line around upper electrode (48) in consideration of all the low order frequencies of the IMD relevant to and affecting the plasma process.Type: GrantFiled: January 9, 2013Date of Patent: April 16, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Manabu Iwata, Naoyuki Umehara, Hiroki Endo
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Patent number: 9736921Abstract: An output of a modulated high frequency power is started from a high frequency power supply of a plasma processing apparatus. Here, a first period and a second period are repeated alternately. A moving average value of a load impedance of the high frequency power supply in a first sub-period in the past first period and a moving average value of a load impedance of the high frequency power supply in a second sub-period in the past first period are acquired. A frequency of the modulated high frequency power in the first sub-period and a frequency of the modulated high frequency power in the second sub-period are set according to the moving average values such that the load impedance of the high frequency power supply in the first sub-period and the load impedance of the high frequency power supply in the second sub-period approximate to a matching point.Type: GrantFiled: October 4, 2016Date of Patent: August 15, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Koichi Nagami, Naoyuki Umehara, Norikazu Yamada
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Patent number: 9640368Abstract: In a plasma processing apparatus, first to third RF power monitors 94, 94 and 98 are configured to monitor high frequency powers (progressive wave powers), which propagate on first to third high frequency power supply lines 88, 90 and 92 from first to third high frequency power supplies 36, 38 and 40 toward a load side, respectively, and high frequency powers (reflection wave powers), which propagate on the first high frequency power supply lines 88, 90 and 92 from the load side toward the first to third high frequency power supplies 36, 38 and 40, respectively, at the same time. A main controller 82 is configured to control the high frequency power supplies 36, 38 and 40 and matching devices 42, 44 and 46 based on monitoring information sent from RF power monitors 94, 96 and 98.Type: GrantFiled: December 13, 2012Date of Patent: May 2, 2017Assignees: TOKYO ELECTRON LIMITED, DAIHEN CORPORATIONInventors: Naoyuki Umehara, Ryuji Ohtani, Shunichi Ito, Kazutaka Sei, Tomomasa Nishida
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Publication number: 20170099723Abstract: An output of a modulated high frequency power, which is set such that a power of the modulated high frequency power in a second period is smaller than a power of the modulated high frequency power in a first period, is started from the high frequency power supply of a plasma processing apparatus. Here, the first period and the second period are repeated alternately. A moving average value of a load impedance of the high frequency power supply in a first sub-period in the past first period and a moving average value of a load impedance of the high frequency power supply in a second sub-period in the past first period are acquired. A frequency of the modulated high frequency power in the first sub-period and a frequency of the modulated high frequency power in the second sub-period are set according to the moving average values.Type: ApplicationFiled: October 4, 2016Publication date: April 6, 2017Inventors: Koichi Nagami, Naoyuki Umehara, Norikazu Yamada
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Publication number: 20140345802Abstract: In a plasma processing apparatus, first to third RF power monitors 94, 94 and 98 are configured to monitor high frequency powers (progressive wave powers), which propagate on first to third high frequency power supply lines 88, 90 and 92 from first to third high frequency power supplies 36, 38 and 40 toward a load side, respectively, and high frequency powers (reflection wave powers), which propagate on the first high frequency power supply lines 88, 90 and 92 from the load side toward the first to third high frequency power supplies 36, 38 and 40, respectively, at the same time. A main controller 82 is configured to control the high frequency power supplies 36, 38 and 40 and matching devices 42, 44 and 46 based on monitoring information sent from RF power monitors 94, 96 and 98.Type: ApplicationFiled: December 13, 2012Publication date: November 27, 2014Inventors: Naoyuki Umehara, Ryuji Ohtani, Shunichi Ito, Kazutaka Sei, Tomomasa Nishida
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Publication number: 20120009829Abstract: In a plasma processing apparatus, a member for propagating high frequency from a high frequency power supply and/or to which the high frequency is applied. A power feed rod is electromagnetically shielded between a matching unit and a bottom plate of a chamber by a coaxial cylindrical conductor connected to a ground potential. A surface potential system disposed in an appropriate distance from the power feed rod in radius direction is installed in the cylindrical conductor, and measures in a non-contact state the electrostatic surface potential of the power feed rod through electrostatic capacitance and provides a controller with a surface potential detection signal including surface potential measurement value information. The controller performs a required signal processing or operation processing on the basis of the surface potential detection signal from the surface potential system, thereby obtaining the measurement value of the DC potential on the power feed rod.Type: ApplicationFiled: September 20, 2011Publication date: January 12, 2012Applicant: TOKYO ELECTRON LIMITEDInventors: Satoshi MAEBASHI, Toshihiro Hayami, Naoyuki Umehara
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Patent number: 8038833Abstract: In a plasma processing apparatus, a member for propagating high frequency from a high frequency power supply and/or to which the high frequency is applied. A power feed rod is electromagnetically shielded between a matching unit and a bottom plate of a chamber by a coaxial cylindrical conductor connected to a ground potential. A surface potential system disposed in an appropriate distance from the power feed rod in radius direction is installed in the cylindrical conductor, and measures in a non-contact state the electrostatic surface potential of the power feed rod through electrostatic capacitance and provides a controller with a surface potential detection signal including surface potential measurement value information. The controller performs a required signal processing or operation processing on the basis of the surface potential detection signal from the surface potential system, thereby obtaining the measurement value of the DC potential on the power feed rod.Type: GrantFiled: July 21, 2009Date of Patent: October 18, 2011Assignee: Tokyo Electron LimitedInventors: Satoshi Maebashi, Toshihiro Hayami, Naoyuki Umehara
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Publication number: 20090277585Abstract: In a plasma processing apparatus, a member for propagating high frequency from a high frequency power supply and/or to which the high frequency is applied. A power feed rod is electromagnetically shielded between a matching unit and a bottom plate of a chamber by a coaxial cylindrical conductor connected to a ground potential. A surface potential system disposed in an appropriate distance from the power feed rod in radius direction is installed in the cylindrical conductor, and measures in a non-contact state the electrostatic surface potential of the power feed rod through electrostatic capacitance and provides a controller with a surface potential detection signal including surface potential measurement value information. The controller performs a required signal processing or operation processing on the basis of the surface potential detection signal from the surface potential system, thereby obtaining the measurement value of the DC potential on the power feed rod.Type: ApplicationFiled: July 21, 2009Publication date: November 12, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Satoshi MAEBASHI, Toshihiro HAYAMI, Naoyuki UMEHARA
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Patent number: 7008275Abstract: An electrical joint forming member is held between adjacent conductive members included in a semiconductor device fabricating apparatus to reduce electrical resistance between those conductive members. The electrical joint forming member includes an elastic member made of a titanium sheet (75 ?m thick, 2 mm wide) and having a surface covered with an aluminum layer (7 ?m thick), the aluminum layer being formed by joining an aluminum sheet to the surface of the titanium sheet by cold-roll bonding.Type: GrantFiled: September 29, 2004Date of Patent: March 7, 2006Assignees: Tokyo Electron Limited, Neomax Materials Co., Ltd.Inventors: Toshihiro Hayami, Naoyuki Umehara, Tsuyoshi Hasegawa
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Publication number: 20050095732Abstract: In a plasma processing apparatus, a member for propagating high frequency from a high frequency power supply and/or to which the high frequency is applied. A power feed rod is electromagnetically shielded between a matching unit and a bottom plate of a chamber by a coaxial cylindrical conductor connected to a ground potential. A surface potential system disposed in an appropriate distance from the power feed rod in radius direction is installed in the cylindrical conductor, and measures in a non-contact state the electrostatic surface potential of the power feed rod through electrostatic capacitance and provides a controller with a surface potential detection signal including surface potential measurement value information. The controller performs a required signal processing or operation processing on the basis of the surface potential detection signal from the surface potential system, thereby obtaining the measurement value of the DC potential on the power feed rod.Type: ApplicationFiled: September 3, 2004Publication date: May 5, 2005Applicant: TOKYO ELECTRON LIMITEDInventors: Satoshi Maebashi, Toshihiro Hayami, Naoyuki Umehara
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Publication number: 20050070174Abstract: An electrical joint forming member is held between adjacent conductive members included in a semiconductor device fabricating apparatus to reduce electrical resistance between those conductive members. The electrical joint forming member includes an elastic member made of a titanium sheet (75 ?m thick, 2 mm wide) and having a surface covered with an aluminum layer (7 ?m thick), the aluminum layer being formed by joining an aluminum sheet to the surface of the titanium sheet by cold-roll bonding.Type: ApplicationFiled: September 29, 2004Publication date: March 31, 2005Inventors: Toshihiro Hayami, Naoyuki Umehara, Tsuyoshi Hasegawa