Patents by Inventor Naoyuki YOMODA

Naoyuki YOMODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with backmetal and related methods
    Patent number: 11114402
    Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: September 7, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Michael J. Seddon, Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda, Yusheng Lin
  • SEMICONDUCTOR DEVICE WITH BACKMETAL AND RELATED METHODS
    Publication number: 20210272920
    Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.
    Type: Application
    Filed: May 14, 2021
    Publication date: September 2, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Michael J. SEDDON, Takashi NOMA, Kazuo OKADA, Hideaki YOSHIMI, Naoyuki YOMODA, Yusheng LIN
  • SEMICONDUCTOR DEVICE WITH BACKMETAL AND RELATED METHODS
    Publication number: 20190267344
    Abstract: Implementations of semiconductor devices may include a die having a first side and a second side, a contact pad coupled to the first side of the die, and a metal layer coupled to the second side of the die. A thickness of the die may be no more than four times a thickness of the metal layer.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 29, 2019
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Michael J. SEDDON, Takashi NOMA, Kazuo OKADA, Hideaki YOSHIMI, Naoyuki YOMODA, Yusheng LIN