Patents by Inventor Naozo Sugimoto

Naozo Sugimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9863897
    Abstract: There is provided an X-ray nondestructive testing device which irradiates X-rays to an article, the article including a substrate having a predetermined X-ray absorption coefficient and a measurement target object disposed therein and having another X-ray absorption coefficient differing from that of the substrate, the device including: an X-ray source configured to irradiate the X-rays to the article; a detector configured to detect the transmission amounts of the X-rays passed through the article at at least paired different locations; a detection position specifying designator configured to specify the paired different locations as a set of paired locations based on a pre-stored design information; a driving mechanism configured to move the detector to the set of paired locations; and an operation calculator configured to calculate the thickness of the measurement target object based on the transmission amounts of the X-rays detected by the detector.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: January 9, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Naozo Sugimoto, Toshihiko Nishizaki, Masahiro Inoue, Masuo Amma, Masaru Nakamura
  • Publication number: 20150377801
    Abstract: There is provided an X-ray nondestructive testing device which irradiates X-rays to an article, the article including a substrate having a predetermined X-ray absorption coefficient and a measurement target object disposed therein and having another X-ray absorption coefficient differing from that of the substrate, the device including: an X-ray source configured to irradiate the X-rays to the article; a detector configured to detect the transmission amounts of the X-rays passed through the article at at least paired different locations; a detection position specifying designator configured to specify the paired different locations as a set of paired locations based on a pre-stored design information; a driving mechanism configured to move the detector to the set of paired locations; and an operation calculator configured to calculate the thickness of the measurement target object based on the transmission amounts of the X-rays detected by the detector.
    Type: Application
    Filed: September 3, 2015
    Publication date: December 31, 2015
    Inventors: Naozo SUGIMOTO, Toshihiko NISHIZAKI, Masahiro INOUE, Masuo YASUMA, Yu NAKAMURA
  • Patent number: 8378269
    Abstract: A wafer thermometer includes a wafer, a plurality of temperature sensors, a converter, a wafer data transmitter, and a photoelectric conversion element. The wafer has an upper surface divided to a plurality of regions. The plurality of temperature sensors are arranged at the plurality of regions, respectively. The converter is provided on the wafer and configured to convert signals output from the plurality of temperature sensors to temperature data. The wafer data transmitter is provided on the wafer and configured to transmit the temperature data converted by the converter. The photoelectric conversion element is provided on the wafer and configured to supply a current to the converter and the wafer data transmitter in response to light with which the photoelectric conversion element is irradiated.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: February 19, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Toshiyuki Matsumoto, Naozo Sugimoto
  • Publication number: 20090242545
    Abstract: A wafer thermometer includes a wafer, a plurality of temperature sensors, a converter, a wafer data transmitter, and a photoelectric conversion element. The wafer has an upper surface divided to a plurality of regions. The plurality of temperature sensors are arranged at the plurality of regions, respectively. The converter is provided on the wafer and configured to convert signals output from the plurality of temperature sensors to temperature data. The wafer data transmitter is provided on the wafer and configured to transmit the temperature data converted by the converter. The photoelectric conversion element is provided on the wafer and configured to supply a current to the converter and the wafer data transmitter in response to light with which the photoelectric conversion element is irradiated.
    Type: Application
    Filed: March 19, 2009
    Publication date: October 1, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Toshiyuki Matsumoto, Naozo Sugimoto