Abstract: A method for forming an electrodeposition coating film, comprises a step of subjecting a steric metal article to be coated to electrodeposition coating, and a step of selectively heating/drying the resultant coating film by a plurality of induction heating devices.

Abstract: A method for forming an electrodeposition coating film, comprises a step of subjecting a steric metal article to be coated to electrodeposition coating, and a step of selectively heating/drying the resultant coating film by a plurality of induction heating devices.

Abstract: A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxy-phenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound.

Abstract: A photosensitive composition which comprises, as essential components:(A) a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxy group(s) and (A") a polymer having hydroxyphenyl group(s),(B) a compound having at least two vinyl ether groups in the molecule, and(C) a compound which generates an acid when irradiated with am actinic ray, and which is useful as a positive type photoresist having high resolution and excellent formability of fine image pattern, a material for printing, etc.; and a process for pattern formation using said composition.

Abstract: A positive type anionic electrodeposition photoresist composition comprising, as a main component, a dispersion obtained by neutralizing, with a base, a mixture comprising:(A) an acrylic resin containing carboxyl group(s) and hydroxyl group(s),(B) a vinylphenol resin containing a hydroxystyrene unit in an amount of at least 25% by weight based on the resin, and(C) an ester between a polyhydroxybenzophenone and 1,2-naphthoquinone diazide sulfonic acid or benzoquinone diazide sulfonic acid, and dispersing the resulting neutralization product in water.This composition is superior in running stability during electrodeposition and is useful for formation of highly reliable resist pattern or conductor pattern.

Abstract: A photopolymerizable composition suitable as a solder resist and capable of forming a resist film having characteristics in no way inferior to those of the conventional heat-curable type or organic solvent developed type solder resist, with the use of water or a dilute aqueous solution which is completely innocuous and higher in safety than the aqueous alkaline solution, and a method for producing a cured coated film pattern using the photopolymerizable composition.

Abstract: The present invention provides a process for producing a high-density printed wiring board with plated throughholes, at high productivity and reliability by a direct drawing method.

Abstract: A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxyphenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound.

Abstract: A positive-type photosensitive electrodeposition coating composition comprising a water-soluble or water-dispersible resin having an ionic group and containing at least one modified quinonediazidesulfone unit represented by the following formula (I) or (II) ##STR1## wherein R.sub.1 represents ##STR2## R.sub.2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group, andR.sub.3 represents an alkylene group, a cycloalkylene group, an alkylene ether group, a phenylene group which may optionally be substituted with an alkyl group having 1 to 20 carbon atoms, or an alkylene, cycloalkylene or alkylene ether group containing in its chain a phenylene group which may optionally be substituted with an alkyl group having 1 to 20 carbon atoms, in the molecule.

Abstract: A photosensitive composition which comprises, as essential components:(A) a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxyl group(s) and (A") a polymer having hydroxyphenyl group(s),(B) a compound having at least two vinyl ether groups in the molecule, and(C) a compound which generates an acid when irradiated with an actinic ray, and which is useful as a positive type photoresist having high resolution and excellent formability of fine image pattern, a material for printing, etc.; and a process for pattern formation using said composition.

Abstract: A resin composition comprising a) a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 3,000 to 200,000; b) a silane compound having an average of 1 or more alkoxysilane, silanol and acyloxysilane groups per molecule and having a number average molecular weight of 104 to 200,000; and c) a metal chelate compound, is curable at a relatively low temperature to yield a film having excellent resistance to weathering.

Abstract: An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic wave reflecting material layer, if needed, (B) a supporting layer, (C) a resin layer, if needed, (D) a supporting layer, and (E) a metallic pattern layer prepared by arranging at least one of a pattern unit comprising a geometrical pattern formed by use of a continuous metallic band, or comprising a multi-figured structure formed by combining a plurality of band-shaped metallic figures so as not to contact with each other; and an electromagnetic wave reflection-preventing method by use of the electromagnetic wave reflection-preventing material.

Abstract: An electromagnetic wave reflection-preventing material having a structure formed by successively laminating (A) an electromagnetic have reflecting metallic material layer, if needed, (B) a substrate layer, (C) a resin layer containing a powder of at least one selected from ferrite, carbon, metal powder and an electrically conductive metallic oxide, and, if needed, a good dielectric material, if needed, (D) a supporting film layer, and (E) a pattern coating layer prepared in the form of a geometrical pattern, containing a metal powder and having a volume resistivity of 10.sup.-3 to 10.sup.10 .OMEGA..multidot.

Abstract: An electromagnetic wave reflection-preventing material having a structure formed by a process which comprises successively laminating (A) a pattern layer formed in the form of a geometrical pattern having a volume resistivity of 10.sup.3 .OMEGA. .

Abstract: A positive-type photosensitive electrodeposition coating composition comprising a water-soluble or water-dispersible resin having an ionic group and containing at least one modified quinonediazidesulfone unit represented by the following formula (I) or (II) ##STR1## wherein R.sub.1 represents ##STR2## R.sub.2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group, andR.sub.3 represents an alkylene group, a cycloalkylene group, an alkylene ether group,a phenylene group which may optionally be substituted with an alkyl group having 1 to 20 carbon atoms, or an alkylene, cycloalkylene or alkylene ether group containing in its chain a phenylene group which may optionally be substituted with an alkyl group having 1 to 20 carbon atoms, in the molecule.

Abstract: A positive-type photosensitive electrodeposition coating composition comprising (A) a photosensitive compound having a molecular weight of not more than 6,000 and containing at least one modified quinonediazidesulfone units represented by the following formula (I) ##STR1## wherein R.sub.1 represents ##STR2## R.sub.2 represents a hydrogen atom, an alkyl group, a cycloalkyl group or an alkyl ether group,R.sub.3 represents an alkylene group, a cycloalkylene group or an alkylene ether group, andA represents a carboxylic acid ester linkage, in a molecule and; or a photosensitive compound obtained by reacting a polyfunctional amino compound with o-benzoquinonediazidesulfonic acid chloride or o-naphthoquinonediazidesulfonic acid chloride, and (B) a water-soluble or water-dispersible resin having a salt-forming group.

Abstract: A resin composition comprising a high molecular weight compound containing an average of 2 or more hydroxyl groups and an average of 1 or more functional groups selected from the class consisting of alkoxysilane, silanol and acyloxysilane groups per molecule and having a number average molecular weight of 3,000 to 200,000; a low molecular weight compound containing an average of 2 or more epoxy groups per molecule and having a number average molecular weight of 240 to 5,000; and, as a curing catalyst, a metal chelate compound, is curable at a relatively low temperature to yield a film having excellent resistance to weathering.

Abstract: A photopolymerizable composition comprising:(a) an aromatic epoxy resin derivative containing, per kilogram of the resin, 0.3 to 10 mole equivalents of a polymerizable unsaturated group and 0.1 to 3 mole equivalents of a specific aprotic onium salt-containing group,(b) a polysiloxane having a specific polysiloxane chain in a molecule, and containing 0.01 to 5 mole equivalents, per kilogram of the polysiloxane, of the aprotic onium salt-containing group, and(c) a photopolymerization initiator.Said photopolymerizable composition can form a resist film excellent in adhesion to a substrate, heat resistance, chemical resistance, impact resistance and solder plating property, and is suitable as a solder resist in particular.

Abstract: A positive-type photosensitive electrodeposition coating composition comprising(A) a resin component containing in a molecule at least one unit selected from the group consisting of an ortho-benzoquinonediazidesulfone unit represented by the general formula ##STR1## an ortho-naphthoquinonediazidesulfone unit represented by the general formula ##STR2## as a photosensitive group, and an anion-forming group; and (B) at least one of the specified particular nitrogen-containing compounds. The composition is useful for the production of a circuit plate.

Abstract: A resin composition comprising two different compounds, A and B, with a number average molecular weight of 3,000 to 200,000 and a chelate compound. Compound A has two or more hydroxyl groups. Compound B has two or more epoxy groups and one or more of the following silane groups silanol, alkoxy silane and acyloxy silane.