Abstract: A method and system for synchronizing a laser marking device with a lead scanner is disclosed. The laser marking device includes an unloader coupled to the lead scanner and is for marking each of a plurality of semiconductor packages including a plurality of leads. The lead scanner performs a test on the plurality of leads for the plurality of semiconductor packages. The unloader is for containing a portion of the plurality of semiconductor packages that passed the test. The method and system include providing an input receiving circuit, a reset circuit and an output relay. The input receiving circuit is coupled with the unloader and is for receiving an indication of a particular number of the plurality of semiconductor packages received by the unloader.

Abstract: Systems and methods are disclosed for testing semiconductor devices, using a tester providing tested semiconductor devices to a device output track, which feeds the semiconductor devices into a storage tube. The tester selectively removes the storage tube from the output track when the tube is filled and when no device is in the output track proximate the semiconductor storage tube. In addition, the tester refrains from removing the storage tube from the output track when a semiconductor device is in the device output track proximate the storage tube, so as to prevent or reduce damage to semiconductor devices during removal of the storage tube from the output track.

Abstract: Aspects for package orientation checking in a laser marking machine are provided. In a system aspect, the system includes a handler, the handler including a unit loader. A laser mark chamber receives units from the handler for laser marking. A package orientation checking mechanism is positioned between the unit loader and the laser mark chamber for detecting an orientation of each unit passing to the laser mark chamber based on a chamfer side of each unit.