Patents by Inventor Narasimha Acharya
Narasimha Acharya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11152953Abstract: Methods, systems, and devices for wireless communications are described. In some systems, a first device may transmit a signal to a second device including a number of error detection bits interleaved with a number of information bits. The second device may use the error detection bits to determine if the signal was received correctly, where each error detection bit may be associated with a set of information bits. The second device may progressively decode the signal and continuously perform an error detection calculation based on a first set of information bits associated with a first error detection bit. Based on the error detection calculation, the second device may calculate an expected error detection bit corresponding to the first error detection bit. The second device may compare the first error detection bit to the expected error detection bit. Other aspects and features are also claimed and described.Type: GrantFiled: February 28, 2020Date of Patent: October 19, 2021Assignee: QUALCOMM INCORPORATEDInventors: Afshin Haftbaradaran, Ming Ta Lin, Shravan Kumar Reddy Garlapati, Alessandro Risso, Alexandre Pierrot, Harsha Narasimha Acharya, Subramanya Rao, Li Zhang
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Publication number: 20210273651Abstract: Methods, systems, and devices for wireless communications are described. In some systems, a first device may transmit a signal to a second device including a number of error detection bits interleaved with a number of information bits. The second device may use the error detection bits to determine if the signal was received correctly, where each error detection bit may be associated with a set of information bits. The second device may progressively decode the signal and continuously perform an error detection calculation based on a first set of information bits associated with a first error detection bit. Based on the error detection calculation, the second device may calculate an expected error detection bit corresponding to the first error detection bit. The second device may compare the first error detection bit to the expected error detection bit. Other aspects and features are also claimed and described.Type: ApplicationFiled: February 28, 2020Publication date: September 2, 2021Inventors: Afshin Haftbaradaran, Ming Ta Lin, Shravan Kumar Reddy Garlapati, Alessandro Risso, Alexandre Pierrot, Harsha Narasimha Acharya, Subramanya Rao, Li Zhang
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Patent number: 8837923Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: GrantFiled: June 13, 2011Date of Patent: September 16, 2014Assignee: Mattson Technology, Inc.Inventors: Paul J. Timans, Narasimha Acharya
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Publication number: 20110236844Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: ApplicationFiled: June 13, 2011Publication date: September 29, 2011Inventors: Paul J. Timans, Narasimha Acharya
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Patent number: 8000587Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: GrantFiled: November 20, 2007Date of Patent: August 16, 2011Assignee: Mattson Technology, Inc.Inventors: Paul J. Timans, Narasimha Acharya
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Publication number: 20080069550Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: ApplicationFiled: November 20, 2007Publication date: March 20, 2008Inventors: Paul Timans, Narasimha Acharya
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Patent number: 7317870Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: GrantFiled: May 25, 2005Date of Patent: January 8, 2008Assignee: Mattson Technology, Inc.Inventors: Paul J. Timans, Narasimha Acharya
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Publication number: 20080001316Abstract: Disclosed herein are embossing lines and methods for their use. In one embodiment an embossing line comprises: an embossing belt disposed about a heating roll and a chill roll, a joining roll disposed between the heating roll and the chill roll, and a pre-embossing heater disposed between the joining roll and the heating roll such that the substrate film can be heated by the pre-embossing heater prior to the embossing belt contacting the heating roll. In another embodiment, a film making process is disclosed.Type: ApplicationFiled: June 29, 2006Publication date: January 3, 2008Inventors: Sanjog Shyam Jain, Narasimha Acharya, Shailendra Pramod Joshi, Ashwit Dias, Nitin Vaish
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Publication number: 20070001333Abstract: An apparatus and method for forming a textured polymeric film are disclosed. The apparatus includes a first roller and a second roller, wherein the first roller and the second roller may be configured to cooperatively form the textured polymeric film. In one embodiment, a limited portion of at least the first roller is heated, passively, actively, or by a combination of active and passive techniques.Type: ApplicationFiled: June 30, 2005Publication date: January 4, 2007Inventors: Ashwit Dias, Hari Harikumar, Narasimha Acharya, Sanjog Jain, Mahendra Patil, Shailendra Joshi, Robert Tatterson
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Patent number: 7037797Abstract: The present invention is directed to an apparatus and process for locally heating and/or cooling of semiconductor wafers in thermal processing chambers. In particular, the apparatus of the present invention includes a device for heating or cooling localized regions of a wafer to control the temperature of such regions during one or more stages of a heat cycle. In one embodiment, gas nozzles eject gas towards the bottom of the wafer to provide localized temperature control. In another embodiment, a transparent gas pipe containing a variety of gas outlets distributes gas onto the top surface of the wafer to provide localized temperature control.Type: GrantFiled: March 17, 2000Date of Patent: May 2, 2006Assignee: Mattson Technology, Inc.Inventors: Sohaila Shooshtarian, Narasimha Acharya, Mike Elbert, Andreas Tillmann, Dieter Zernickel
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Patent number: 6951996Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: GrantFiled: December 29, 2003Date of Patent: October 4, 2005Assignee: Mattson Technology, Inc.Inventors: Paul J. Timans, Narasimha Acharya
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Patent number: 6849831Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: GrantFiled: July 30, 2002Date of Patent: February 1, 2005Assignee: Mattson Technology, Inc.Inventors: Paul J. Timans, Narasimha Acharya
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Publication number: 20040149715Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: ApplicationFiled: December 29, 2003Publication date: August 5, 2004Inventors: Paul J. Timans, Narasimha Acharya
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Publication number: 20030183612Abstract: Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.Type: ApplicationFiled: July 30, 2002Publication date: October 2, 2003Inventors: Paul J. Timans, Narasimha Acharya