Patents by Inventor Narasimha Reddy Emmareddy

Narasimha Reddy Emmareddy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT SINK FOR OPTICAL MODULE
    Publication number: 20230258891
    Abstract: In one embodiment, an apparatus includes an optical module, and a heat sink for attachment to an optical module cage configured for receiving the optical module, the heat sink having a surface in which recesses are formed. The optical module includes a thermal interface material attached to a surface of the optical module for thermal contact with the heat sink, and lifting elements extending from the surface. The lifting elements are configured to create a gap between the thermal interface material and the heat sink during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, and are positioned for insertion into aligned recesses in the heat sink when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the heat sink and the thermal interface material.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 17, 2023
    Inventors: Rohit Dev Gupta, Narasimha Reddy Emmareddy, Giovanni Giobbio
  • Heat sink for optical module
    Patent number: 11678466
    Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: June 13, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Rohit Dev Gupta, Narasimha Reddy Emmareddy, Manjunatha Reddy Shivashankara, Suresh Kumar Vadivazhagan, Giovanni Giobbio
  • HEAT SINK FOR OPTICAL MODULE
    Publication number: 20220141990
    Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.
    Type: Application
    Filed: May 24, 2021
    Publication date: May 5, 2022
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Rohit Dev Gupta, Narasimha Reddy Emmareddy, Manjunatha Reddy Shivashankara, Suresh Kumar Vadivazhagan, Giovanni Giobbio