Patents by Inventor Narendra N.

Narendra N. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10846824
    Abstract: Systems and methods for reconstructing super-resolution images under total aliasing based upon translation values. Traditional systems and methods provide for extracting super-resolution (SR) image/s from low-resolution (LR) image/s but include aliasing as a background noise which degrades the performance or include aliasing into an image model which leads to an enormously high computational complexity. Embodiments of the present disclosure provide for reconstructing super-resolution images based upon translation values by taking aliasing in consideration by capturing a set of LR images, estimating, using a Fast Fourier Transformation, a set of translation values based upon the set of LR images, obtaining, using a multi-signal classification technique, one or more optimized frequency spectrums based upon the set of translation values and reconstructing one or more SR images based upon the set of translation values.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: November 24, 2020
    Assignee: Tata Consultancy Services Limited
    Inventors: Achanna Anil Kumar, Narendra N, Girish M. Chandra, Balamuralidhar Purushothaman
  • Patent number: 10650505
    Abstract: This disclosure relates generally to image processing, and more particularly to generate a high resolution image from multiple low resolution images. In an embodiment, the system collects a plurality of low resolution images as input, processes the collected images, and generates a high resolution image as output. During this process, the system pre-processes the collected low resolution images, and during this process, at least one characteristic of each of the low resolution image is changed with respect to a reference image. After the pre-processing stage, the images are then enhanced based on a plurality of final enhancement factors that are dynamically determined. Further, the enhanced images are fused to generate the high resolution image.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: May 12, 2020
    Assignee: Tata Consultancy Services Limited
    Inventors: Achanna Anil Kumar, Narendra N, M Girish Chandra, Balamuralidhar P
  • Publication number: 20190180414
    Abstract: Systems and methods for reconstructing super-resolution images under total aliasing based upon translation values. Traditional systems and methods provide for extracting super-resolution (SR) image/s from low-resolution (LR) image/s but include aliasing as a background noise which degrades the performance or include aliasing into an image model which leads to an enormously high computational complexity. Embodiments of the present disclosure provide for reconstructing super-resolution images based upon translation values by taking aliasing in consideration by capturing a set of LR images, estimating, using a Fast Fourier Transformation, a set of translation values based upon the set of LR images, obtaining, using a multi-signal classification technique, one or more optimized frequency spectrums based upon the set of translation values and reconstructing one or more SR images based upon the set of translation values.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 13, 2019
    Applicant: Tata Consultancy Services Limited
    Inventors: Achanna Anil KUMAR, Narendra N, Girish M. CHANDRA, Balamuralidhar PURUSHOTHAMAN
  • Publication number: 20190019279
    Abstract: This disclosure relates generally to image processing, and more particularly to generate a high resolution image from multiple low resolution images. In an embodiment, the system collects a plurality of low resolution images as input, processes the collected images, and generates a high resolution image as output. During this process, the system pre-processes the collected low resolution images, and during this process, at least one characteristic of each of the low resolution image is changed with respect to a reference image. After the pre-processing stage, the images are then enhanced based on a plurality of final enhancement factors that are dynamically determined. Further, the enhanced images are fused to generate the high resolution image.
    Type: Application
    Filed: March 23, 2018
    Publication date: January 17, 2019
    Applicant: Tata Consultancy Services Limited
    Inventors: Achanna Anil KUMAR, Narendra N., M. Girish CHANDRA, Balamuralidhar P.
  • Publication number: 20120137235
    Abstract: A user interface of an application is identified as designated for presentation to a particular end user of the application, the user interface rendered based at least in part on a user interface template, the user interface template including a plurality of placeholders, and the user interface adapted to receive user inputs. At least one attribute of the particular end user is identified. A first set of user interface (UI) building blocks is selected from a plurality UI building blocks, the first set of UI building blocks including at least one configurable UI building block dynamically selected based on the identified attribute of the particular end user. At least one placeholder of the user interface template is populated with the first set of UI building blocks to render the user interface for presentation to the particular end user. The user interface is presented to a user of the application.
    Type: Application
    Filed: November 29, 2010
    Publication date: May 31, 2012
    Inventors: Sabarish T S, Sagar Joshi, Ganesh Kudva, Suresh Honnappanavar, Varun V S, Narendra N. Shukla
  • Publication number: 20100297116
    Abstract: The present invention describes a method for reducing reperfusion injury and/or infarction by using an inhibitor of platelet GPVI. This method may be used to treat patients during or after a heart attack or elective cardiac surgery.
    Type: Application
    Filed: October 29, 2008
    Publication date: November 25, 2010
    Inventors: Yongge Liu, Narendra N. Tandon, Hisao Takizawa, Junichi Kambayashi
  • Publication number: 20090294342
    Abstract: The present invention relates to a household water purification device, comprising electrically driven water purification means, an inlet for contaminated water, which inlet is in fluid communication with the water purification means and is connected to the water supply system when the device is operational, an outlet for dispensing purified water, which outlet is in fluid communication with the water purification means, water flowing from the inlet to the outlet via the water purification means in operational conditions, wherein said device further comprises a closing unit for interrupting the flow of water, a sensor that senses the availability water supply, and control means that controls the closing unit and the water purification means.
    Type: Application
    Filed: April 26, 2007
    Publication date: December 3, 2009
    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Wilhelmus H.M. Bruggink, Narendra N. Pawar
  • Publication number: 20040019595
    Abstract: A mechanism is provided for externalization, publication, and tracking of knowledge entries in a knowledge database. When a knowledge entry document is created, it is routed to a reviewer's work queue. If the reviewer approves the knowledge entry, it is automatically published to the knowledge base. If the reviewer rejects the knowledge entry, it is sent back to the author. The author may then make changes and resubmit the knowledge entry document or delete the knowledge entry from the system. When a knowledge entry document is published to the knowledge base, it is time stamped with an expiration date. When the knowledge entry expires, it is routed to the original author's revalidation queue. If the author accepts the knowledge entry, the expiration date is reset and the knowledge entry document is returned to the knowledge base. If the author rejects the knowledge entry, it is routed to the author's work queue.
    Type: Application
    Filed: July 25, 2002
    Publication date: January 29, 2004
    Applicant: International Business Machines Corporation
    Inventors: Kulvir Singh Bhogal, David J. Carew, Hung The Dinh, Teng S. Hu, Mansoor A. Lakhdhir, Narendra N. Reddy, Mandeep Singh Sidhu
  • Patent number: 6243810
    Abstract: A method and apparatus for communicating a configuration operation throughout an integrated circuit chip is disclosed. The present invention receives a configuration operation having a configuration word. The configuration word is stored in a defer register until the configuration word can be communicated to one or more target local configuration registers, which are the registers in which the configuration word is to be stored and/or used. During the time period during which the configuration word is stored in the defer register, subsequent operations including operations having configuration data associated with the configuration word are delayed. In one embodiment, operations are caused to retry if a configuration word is stored in the defer register. The configuration data associated with the configuration word is received after the defer register has been cleared. After the configuration data has been received, subsequent operations are blocked for a predetermined period of time.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: June 5, 2001
    Assignee: Intel Corporation
    Inventors: Narendra N. Khandekar, Steven Clohset
  • Patent number: 5281849
    Abstract: An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which have planes (22) attached to at least some of the associated individual leads (28). Segmentation of the lead frame (14) allows for the use of planes in inexpensive plastic and ceramic packages. Segmentation further allows the use of inexpensive aluminized stripes (42) to aluminize portions of individual leads (28) even in quad package configurations. An alternate equally preferred segmented lead frame (514) is provided for those applications wherein asymmetrical lead frames are required. Segmentation of the alternate segmented lead frame (514) permits the use of planes (522) and (552), while also limiting the cost of producing the alternate lead frame (514) especially when the etching method of production is required.
    Type: Grant
    Filed: May 7, 1991
    Date of Patent: January 25, 1994
    Inventors: Narendra N. Singh Deo, Alexander H. C. Chang
  • Patent number: 5263242
    Abstract: An improved semiconductor package (10) having a segmented lead frame (14) and (514) is disclosed. The preferred segmented lead frame (14) is divided into essentially identical segments (27) which have planes (22) attached to at least some of the associated individual leads (28). Segmentation of the lead frame (14) allows for the use of planes in inexpensive plastic and ceramic packages. Segmentation further allows the use of inexpensive aluminized stripes (42) to aluminize portions of individual leads (28) even in quad package configurations. An alternate equally preferred segmented lead frame (514) is provided for those applications wherein asymmetrical lead frames are required. Segmentation of the alternate segmented lead frame (514) permits the use of planes (522) and (552), while also limiting the cost of producing the alternate lead frame (514) especially when the etching method of production is required.
    Type: Grant
    Filed: January 4, 1993
    Date of Patent: November 23, 1993
    Assignee: CN Industries Ltd.
    Inventors: Narendra N. Singh Deo, Alexander H. C. Chang
  • Patent number: 5024883
    Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
    Type: Grant
    Filed: September 14, 1989
    Date of Patent: June 18, 1991
    Assignee: Olin Corporation
    Inventors: Narendra N. SinghDeo, Deepak Mahulikar, Sheldon H. Butt
  • Patent number: 4929516
    Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.
    Type: Grant
    Filed: February 10, 1986
    Date of Patent: May 29, 1990
    Assignee: Olin Corporation
    Inventors: Michael J. Pryor, Julius C. Fister, Narendra N. Singhdeo, Deepak Mahulikar, Satyam C. Cherukuri
  • Patent number: 4883778
    Abstract: The present invention is directed to an engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having good improved thermal conductivity.
    Type: Grant
    Filed: October 30, 1986
    Date of Patent: November 28, 1989
    Assignee: Olin Corporation
    Inventors: Narendra N. SinghDeo, Deepak Mahulikar, Sheldon H. Butt
  • Patent number: 4882212
    Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
    Type: Grant
    Filed: October 30, 1986
    Date of Patent: November 21, 1989
    Assignee: Olin Corporation
    Inventors: Narendra N. SinghDeo, Deepak Mahulikar, Sheldon H. Butt
  • Patent number: 4821151
    Abstract: A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having at least one cavity adapted for receiving a semiconductor die is sealed to the multi-layer circuit device. Electrical leads are connected to the semiconductor device and extend outward from the package for connection to the conductive circuit pattern within the multi-layer circuit.
    Type: Grant
    Filed: December 20, 1985
    Date of Patent: April 11, 1989
    Assignee: Olin Corporation
    Inventors: Michael J. Pryor, Narendra N. Singhdeo, Deepak Mahulikar
  • Patent number: 4756754
    Abstract: The present invention relates to a composite formed of a mixture of ceramic particles and at least two metallic components adhered together with a glassy phase. A first of the metallic components, in particle form, enhances the flow characteristics of the mixture where the second metallic component and the glass are in the molten condition. The final composite is a continuous phase of the second metallic component having particles of the first metallic component and glass coated ceramic particles distributed therein.
    Type: Grant
    Filed: March 6, 1987
    Date of Patent: July 12, 1988
    Assignee: Olin Corporation
    Inventor: Narendra N. SinghDeo
  • Patent number: 4748136
    Abstract: The present invention is directed to a composite and process of forming the composite comprising metallic particles for enhancing the flow characteristics of said composite, a glass for adhering the composite together and the balance essentially ceramic particles. The composite has a matrix comprising the glass with the ceramic and metallic particles dispersed therein. The metallic particles are preferably present in the composite at a volume percentage so as to be discontinuously dispersed throughout.
    Type: Grant
    Filed: October 30, 1986
    Date of Patent: May 31, 1988
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Narendra N. SinghDeo
  • Patent number: 4739443
    Abstract: A thermally conductive module is adapted for mounting a plurality of electronic components. A ceramic substrate has a first layer of foil glass bonded thereto and adapted for mounting a plurality of electronic components thereon. A second layer of foil is glass bonded to a second surface of the ceramic substrate and is adapted to conduct heat from the module.
    Type: Grant
    Filed: July 20, 1987
    Date of Patent: April 19, 1988
    Assignee: Olin Corporation
    Inventor: Narendra N. Singhdeo
  • Patent number: 4687540
    Abstract: This invention relates to a laminated glass capacitor and method of making the capacitor. The capacitor is constructed of a plurality of internal electrodes stacked and having glass layers therebetween to give electrostatic capacity. External electrodes are connected to associated internal electrodes for taking out the electrostatic capacity. The glass layers are selected from a substantially pore free glass and the internal electrodes are formed of a metal foil selected from the group consisting of deoxidized copper alloy and oxygen free copper alloy.
    Type: Grant
    Filed: July 23, 1986
    Date of Patent: August 18, 1987
    Assignee: Olin Corporation
    Inventors: Narendra N. Singhdeo, Michael J. Pryor, Charles J. Leedecke, Norman G. Masse