Abstract: During an annotation technique, an electronic device may receive an optical image associated with an object and other sensor information associated with the object, where the optical image and the other sensor information have associated timestamps that are concurrent or in close temporal proximity. Then, the electronic device may identify the object based at least in part on the optical image and/or the other sensor information. Moreover, the electronic device may extract a signature associated with the object from the other sensor information. The signature may include: a range to the object, a first angle to the object along a first axis, Doppler information associated with the object and/or a second angle to the object along a second axis. Next, the electronic device may store annotation information associated with the identified object and the extracted signature in a data structure in memory.

Abstract: According to one aspect, an apparatus includes an actuator, a first portion, and the second portion is arranged to be coupled to a device. The second portion has a second conductive connector portion, wherein power is not provided to the actuator when the first conductive connector portion and the second conductive connector portion are in physical contact, and wherein the power is provided to the actuator when the first conductive connector portion and the second conductive connector portion are not in physical contact.

Abstract: An embodiment of a semiconductor package apparatus may include technology to associate an asset to a fixture with a device positioned proximate to the fixture, and determine a location of the fixture based on a location of the device. Other embodiments are disclosed and claimed. Non-limiting example applications may include shipping, logistics, warehouse asset tracking, retail, etc.

Abstract: According to one aspect, an apparatus includes an actuator, a first portion, and the second portion is arranged to be coupled to a device. The second portion has a second conductive connector portion, wherein power is not provided to the actuator when the first conductive connector portion and the second conductive connector portion are in physical contact, and wherein the power is provided to the actuator when the first conductive connector portion and the second conductive connector portion are not in physical contact.

Abstract: Certain aspects of the present disclosure relate to methods and apparatus for reporting signal quality in overlapping Multimedia Broadcast Single Frequency Networks (MBSFN) areas. A UE may determine a signal quality estimate for each of two or more overlapping MBSFN areas based on Signal to Noise Ratio (SNR) information and Modulation and Coding Scheme (MCS) information for the MBSFN area. The UE may then determine a combined signal quality based on the signal quality estimates of the MBSFN areas.

Abstract: A magnetic field sensor, such as a Hall effect sensor, and a corresponding magnetic field producing unit, such as a magnet, can be both positioned near a hinge of a hinged device, such that the magnet, in one part of the device, rotates around the Hall effect sensor, in another part of the device. Three positions can, thereby be detected: (1) when the device is closed and the magnet is “above” the sensor, (2) when the device is partially open and the magnet is “to the side” of the sensor, and (3) when the device is fully open and the magnet is “below” the sensor. The hinged device can have the hinge offset slightly to enable the magnet to rotate around the sensor as described. Alternatively, the locations of the magnet and sensor can be reversed.

Abstract: A method, an apparatus, and a computer program product for wireless communication are provided. The apparatus receives a user service description (USD) message. When a frequency indicated in the USD message is not a current frequency, the apparatus determines that a system information message is received, determines that the frequency indicated in the USD message is included in the system information message, determines that the frequency is a neighboring cell frequency, sets a priority of the frequency to a highest priority, and measures a signal strength of the frequency when the frequency is included in the system information message, performs a cell reselection determination procedure based on the signal strength of the frequency, performs cell reselection to the neighboring cell based on a result of the cell reselection determination procedure, and acquires the multicast service in the neighboring cell on the frequency.

Abstract: A method for inter-frequency cell reselection by a wireless communication device is described. The wireless communication device camps on a serving cell. An evolved multimedia broadcast multicast service (eMBMS) service provided by a neighbor cell is discovered. Inter-frequency parameters of the neighbor cell are measured. It is determined whether to perform an inter-frequency cell reselection based on one or more inter-frequency cell reselection factors. An inter-frequency cell reselection to the neighbor cell is performed.

Abstract: Certain aspects of the present disclosure relate to methods and apparatus for reporting signal quality in overlapping Multimedia Broadcast Single Frequency Networks (MBSFN) areas. A UE may determine a signal quality estimate for each of two or more overlapping MBSFN areas based on Signal to Noise Ratio (SNR) information and Modulation and Coding Scheme (MCS) information for the MBSFN area. The UE may then determine a combined signal quality based on the signal quality estimates of the MBSFN areas.

Abstract: A compressor component having an airfoil with a profile in accordance with Table 1 is disclosed. The compressor component, such as a compressor blade, has an increased thickness over a portion of the airfoil span in order to increase stiffness. Furthermore, the airfoil has been restacked so as to induce a compressive stress in the blade root/attachment area. The increased stiffness and restacked airfoil combine to improve high-cycle fatigue capability of the compressor component.

Abstract: A method, an apparatus, and a computer program product for wireless communication are provided. The apparatus receives a user service description (USD) message. When a frequency indicated in the USD message is not a current frequency, the apparatus determines that a system information message is received, determines that the frequency indicated in the USD message is included in the system information message, determines that the frequency is a neighboring cell frequency, sets a priority of the frequency to a highest priority, and measures a signal strength of the frequency when the frequency is included in the system information message, performs a cell reselection determination procedure based on the signal strength of the frequency, performs cell reselection to the neighboring cell based on a result of the cell reselection determination procedure, and acquires the multicast service in the neighboring cell on the frequency.

Abstract: A compressor component having an airfoil with a profile in accordance with Table 1 is disclosed. The compressor component, such as a compressor blade, has an increased thickness over a portion of the airfoil span in order to increase stiffness. Furthermore, the airfoil has been restacked so as to induce a compressive stress in the blade root/attachment area. The increased stiffness and restacked airfoil combine to improve high-cycle fatigue capability of the compressor component.

Abstract: A credit card, debit card, or other similar financial instrument is disclosed with the temporary assignment of a dynamic CVV for increased card security. The dynamic CVV is read, changed, and rewritten to the card with each transaction. To facilitate online purchases, a static CVV may also be provided for manual entry. Alternatively, the static CVV may be a reminder enabling a user to remember an unmarked static CVV, such as reading the digits in an order selected by a user, much like a PIN number.

Abstract: A system and method for customer-oriented searching and purchasing of goods and services relies on a database having records corresponding to purveyors, products and services, and purchasers and maintained by a third party independent from all the foregoing. Searches may obtain information with or without cooperation of purveyors (vendors). Filtering before presentation to a user, according to specific needs or requirements eliminates inapplicable vendors, products, or services. Particularly, if quality rating, features, or actual availability is lacking, the system does not waste a user's time to evaluate. Deal-killer parameters and values punish vendors lacking disclosure. Rather than publish what the seller wants to advertise, the system retrieves for a user the information on items that meet criteria of, and according to their importance to, a user, especially deal-killer parameters.

Abstract: A magnetic field sensor, such as a Hall effect sensor, and a corresponding magnetic field producing unit, such as a magnet, can be both positioned near a hinge of a hinged device, such that the magnet, in one part of the device, rotates around the Hall effect sensor, in another part of the device. Three positions can, thereby be detected: (1) when the device is closed and the magnet is “above” the sensor, (2) when the device is partially open and the magnet is “to the side” of the sensor, and (3) when the device is fully open and the magnet is “below” the sensor. The hinged device can have the hinge offset slightly to enable the magnet to rotate around the sensor as described. Alternatively, the locations of the magnet and sensor can be reversed.

Abstract: A method and semiconductor wafer is provided for measurement and recordation of hydrophilic elements in semiconductor insulators by depositing a moisture barrier layer over a previously deposited insulating layer of a semiconductor wafer. The semiconductor wafers become pilot or calibration wafers which may be placed immediately in an infrared radiation instrument to allow measurement of the concentration of hydrophilic elements in the insulating layer or stored for recordation purposes and measured later.

Abstract: A cleaning handle is used to clean semiconductor processing equipment to reduce particles. A relatively thin handle is formed for insertion into difficult to reach areas and, in one end, includes slots for affixing a cleaning wipe. A method for using the cleaning handle to clean semiconductor processing equipment includes affixing a cleaning wipe to the slots, wrapping the cleaning wipe around the end with the slots, and then wiping the semiconductor processing equipment with the cleaning handle. The cleaning wipe can be moistened with a cleaning agent, such as isopropyl alcohol, to improve its effectiveness.

Abstract: A cleaning handle is used to clean semiconductor processing equipment to reduce particles. A relatively thin handle is formed for insertion into difficult to reach areas and includes slots for affixing a cleaning wipe. The wipe is fed through the slots and wrapped around the handle to secure the wipe for cleaning the equipment, while preventing damage to the equipment. The wipe may be moistened with a cleaning agent to further enhance the cleaning ability of the handle.

Abstract: A method for monitoring the temperature of a product wafer during thermal processing of the product wafer in an emissivity independent thermal processing system includes processing a test wafer in the emissivity independent thermal processing system that thermally processes the product wafer. The test wafer is pretreated before being thus placed in the thermal processing system. The test wafer is thermally processed following a substantially same thermal processing recipe as that used for thermal processing of the product wafers. After the thermal processing of the test wafer, a sheet resistance of the test wafer is measured. This sheet resistance is correlated to a wafer temperature at the test wafer that was achieved during the thermal processing of the test wafer.

Abstract: A method for monitoring the temperature of a product wafer during thermal processing of the product wafer in an emissivity independent thermal processing system includes processing a test wafer in the emissivity independent thermal processing system that thermally processes the product wafer. The test wafer is pretreated before being thus placed in the thermal processing system. The test wafer is thermally processed following a substantially same thermal processing recipe as that used for thermal processing of the product wafers. After the thermal processing of the test wafer, a sheet resistance of the test wafer is measured. This sheet resistance is correlated to a wafer temperature at the test wafer that was achieved during the thermal processing of the test wafer.