Patents by Inventor Naresh C. Patel

Naresh C. Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7156561
    Abstract: An optical fiber connector plug includes a housing through which extends a cable containing at least one optical fiber. A ferrule, which is supported by the housing, is provided for receiving the optical fiber. The ferrule has a mating facet and an opposing rear facet located in the housing. The ferrule has at least one guide pin thru-hole and at least one optical fiber thru-hole extending between the mating facet and the opposing rear facet. The guide pin thru-hole has an opening portion extending inward from the mating facet. The opening portion is tapered outward to meet the mating facet in an oblique manner such that the opening portion has a diameter in the plane of the mating facet that is greater than a diameter of a remainder of the guide pin thru-hole.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: January 2, 2007
    Assignee: Meriton Networks US Inc.
    Inventors: Naresh C. Patel, Glenn Gerard Wilder, Gerald Nykolak, Lars Erik Eskildsen
  • Patent number: 7048447
    Abstract: An optical fiber connector plug includes a housing through which extends a cable containing at least one optical fiber. A ferrule, which is supported by the housing, is provided for receiving the optical fiber. The ferrule has a mating facet and an opposing rear facet located in the housing. The ferrule has at least one guide pin thru-hole and at least one optical fiber thru-hole extending between the mating facet and the opposing rear facet. The guide pin thru-hole has an opening portion extending inward from the mating facet. The opening portion is tapered outward to meet the mating facet in an oblique manner such that the opening portion has a diameter in the plane of the mating facet that is greater than a diameter of a remainder of the guide pin thru-hole.
    Type: Grant
    Filed: March 21, 2003
    Date of Patent: May 23, 2006
    Assignee: Photuris, Inc.
    Inventors: Naresh C. Patel, Glenn Gerard Wilder, Gerald Nykolak, Lars Erik Eskildsen
  • Patent number: 6761554
    Abstract: A rotary tableting press includes a turret with upper and lower carousels in which upper and lower punch assemblies are removably supported. The upper and lower punch assemblies include punch casings having a central opening and a punch slidably received in the central opening of the casing. The upper and lower punches are normally biased away from one another. Rollers are positioned on the tablet press and adapted to engage the punches to direct the upper and lower punches toward one another to compress material placed between the punches to form a tablet.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: July 13, 2004
    Assignee: Leraj, Inc.
    Inventor: Naresh C. Patel
  • Publication number: 20020197347
    Abstract: A rotary tableting press includes a turret with upper and lower carousels in which upper and lower punch assemblies are removably supported. The upper and lower punch assemblies include punch casings having a central opening and a punch slidably received in the central opening of the casing. The upper and lower punches are normally biased away from one another. Rollers are positioned on the tablet press and adapted to engage the punches to direct the upper and lower punches toward one another to compress material placed between the punches to form a tablet.
    Type: Application
    Filed: June 25, 2001
    Publication date: December 26, 2002
    Inventor: Naresh C. Patel
  • Patent number: 6317325
    Abstract: An apparatus for dissipating heat generated by components housed within modules on a circuit pack includes a first cover member having a deflectable cantilevered region that is defined by a U-shaped slot. A conductive post is mounted or otherwise formed on the underside of the cantilevered region so that the post extends downwardly into the module when the first cover member is secured to the module housing. The conductive post cooperates with a top surface of a component in the module so that heat generated from the component is transferred from the component through the conductive post and distributed along the first cover member. To further reduce interference caused by electromagnetic radiation passing through the U-shaped slot, a second cover member, which includes an opening that is sized for receiving and passing through the conductive post, is disposed between the module housing and the first cover member.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: November 13, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: Naresh C. Patel, Gregory Simeon Sysak
  • Patent number: 6309295
    Abstract: A circuit pack blank occupies an unequipped position in an electronic equipment shelf that is cooled by forced-air convection. The blank incorporates two diffuser blades that protrude into a cooling space in the shelf adjacent to the blank. When air is forced through the cooling space at a constant velocity, a backpressure is generated that is equivalent to backpressures generated at cooling spaces adjacent to equipped positions. In addition, the blank has a faceplate that incorporates one or more cable trays used to retain cables at the unequipped position for future use.
    Type: Grant
    Filed: February 12, 1999
    Date of Patent: October 30, 2001
    Assignee: Lucent Technologies Inc.
    Inventors: John Edward Clarke, Naresh C. Patel
  • Patent number: 5999411
    Abstract: A protection assembly for connectors is included on a circuit pack to prevent damage caused when a connector is removed while signal power is still being supplied to the circuit pack. More specifically, the protection assembly is disposed on the front side of the circuit pack to prevent access to the connector until signal power is automatically cut off from the circuit pack. In one embodiment, the circuit pack is the type having a lever arrangement capable of causing the circuit pack to engage and disengage the backplane of an equipment frame. When the circuit pack is engaged in the backplane, signal power is supplied through the connector that is accessible, for example, on the face plate of the circuit pack. The protection assembly includes a first shield member mounted on the face plate of the circuit pack in a location adjacent to the connector. The protection assembly further includes a second shield member mounted or otherwise formed on the lever arrangement.
    Type: Grant
    Filed: July 31, 1998
    Date of Patent: December 7, 1999
    Assignee: Lucent Technologies Inc.
    Inventor: Naresh C. Patel
  • Patent number: 5757621
    Abstract: A heat sink may be shared among a plurality of electronic devices attached to a printed circuit board by attaching the heat sink to the printed circuit board using a plurality of standoff/spring combinations. In this way, the level of compression imposed by the springs on the heat sink allows the heat sink to make the appropriate level of thermal contact with the electronic devices.
    Type: Grant
    Filed: June 6, 1996
    Date of Patent: May 26, 1998
    Assignee: Lucent Technologies Inc.
    Inventor: Naresh C. Patel