Patents by Inventor Naresh C. Saha

Naresh C. Saha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a contact
    Patent number: 6248664
    Abstract: A dielectric layer (27) is formed between a semiconductor surface (24) and an electrical contact (26) to promote adhesion of the contact (26). The dielectric layer (27) is formed by cleaning operation followed by a chemical oxidation.
    Type: Grant
    Filed: May 19, 1997
    Date of Patent: June 19, 2001
    Assignee: Semiconductor Components Industries LLC
    Inventors: Naresh C. Saha, Alan J. Magnus
  • Method of forming an electrically conductive polymer bump over an aluminum electrode
    Patent number: 5674780
    Abstract: A method of forming an electrically conductive polymer bump (22) over an aluminum electrode (21) produces low contact resistance for an interconnect structure (24). Aluminum oxide is first removed from the aluminum electrode (21). Tiron and palladium are subsequently bonded to the fresh surface of the aluminum electrode (21). Finally, the electrically conductive polymer bump (22) is formed over the aluminum electrode (21). The Tiron and palladium improve the electrical contact between the conductive polymer bump (22) and the aluminum electrode (21) thereby reducing the contact resistance. The Tiron also inhibits corrosion of the aluminum electrode (21) and enhances the conductivity by catalytically shrinking the cyanate ester conductive bump.
    Type: Grant
    Filed: July 24, 1995
    Date of Patent: October 7, 1997
    Assignee: Motorola, Inc.
    Inventors: William H. Lytle, Treliant Fang, Jong-Kai Lin, Ravinder K. Sharma, Naresh C. Saha