Abstract: An ultraviolet-curable resin composition comprising a phosphorus atom-containing photopolymerizable compound and a carboxyl group-containing photopolymerizable compound and exhibiting surface tension at 25° C. in the range of 30 to 50 mN/m. Preferably the composition comprises (a) a compound having one or more (meth)acryloyl groups in its molecule and a phosphorus atom, (b) a compound having at least one carboxyl group and one (meth)acryloyl group in its molecule, (c) a compound having one or more (meth)acryloyl groups in its molecule, (d) a leveling agent, and (e) a photoinitiator. The ultraviolet-curable resin composition is useful as a protective material for etching, particularly as a back-coating material in the production of a shadow mask.

Abstract: An ultraviolet-curable resin composition comprises a phosphorus atom-containing photopolymerizable compound and a carboxyl group-containing photopolymerizable compound and exhibits the surface tension at 25° C. in the range of 30 to 50 mN/m. Preferably the composition comprises (a) a compound having one or more (meth)acryloyl groups in its molecule and a phosphorus atom, (b) a compound having at least one carboxyl group and one (meth)acryloyl group in its molecule, (c) a compound having one or more (meth)acryloyl groups in its molecule, (d) a leveling agent, and (e) a photoinitiator. The ultraviolet-curable resin composition is useful as a protective material for etching, particularly as a back-coating material in the production of a shadow mask.

Abstract: A photocurable and thermosetting matte liquid resist composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photopolymerization initiator, (C) a diluent, (D) an epoxy compound having at least two epoxy groups in the molecular unit thereof, and further (E) a finely pulverized aluminum silicate matting agent in combination with (F) a filler precipitation preventing agent capable of effective thixotropic adjustment in the composition. The composition may further comprise (G) an epoxy resin curing agent. The composition can be advantageously used for the formation of a solder resist on a printed circuit board.