Abstract: Provided is a thermally conductive silicone composition whose cured product exhibits no cracks and voids, and has a favorable thermal conductivity. The thermally conductive silicone composition contains: (A) an organopolysiloxane having at least two silicon atom-bonded aliphatic unsaturated hydrocarbon groups per each molecule, and having a kinetic viscosity of 10 to 1,000,000 mm2/s at 25° C.; (B) an organohydrogenpolysiloxane; (C) gallium and/or a gallium alloy that have a melting point of ?20 to 70° C.; (D) a thermally conductive filler having an average particle size of 0.1 to 100 pin; (E) a platinum group metal catalyst; (F) a palladium powder; and (G-1) an organopolysiloxane represented by the following general formula (1): wherein R1 independently represents an aliphatic unsaturated bond-free substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; R2 independently represents an alkyl group, an alkenyl group or an acyl group.

Abstract: The purpose of the present invention is to provide a highly thermally conductive silicone composition that exhibits excellent displacement resistance and coatability by forming a silicone composition that contains: an organopolysiloxane that is a product of a reaction between (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom (a Si—H group) at quantities whereby the (Si—H/Si-Vi) ratio is more than 8.0 and not more than 20.0; (C) an inorganic filler having an average particle diameter of 3 ?m or less which is selected from among metal oxides and metal nitrides; and (D) a thermally conductive inorganic filler having an average particle diameter of 5 ?m or more.