Abstract: A liquid crystal polymer film that includes a liquid crystal polymer having an endothermic peak temperature that exceeds 330° C., the endothermic peak temperature being a temperature resulting from when the liquid crystal polymer is heated to 400° C. in an inert atmosphere, then cooled to room temperature at a temperature decreasing rate of 40° C./min or more, and measured using a differential scanning calorimeter while being heated again at a temperature increasing rate of 40° C./min.

Abstract: An electronic component includes a multilayer body including a first insulator and a second insulator having a higher resistivity than the first insulator, metal conductors each positioned between the first insulator and the second insulator and including a predetermined end surface positioned at least near an end surface of the multilayer body, plating films each provided on the predetermined end surface of the metal conductor in a state extending out in a direction covering an end surface of the first insulator by a larger distance than in a direction covering an end surface of the second insulator, and an outer conductor provided on the outer sides of the plating films and electrically connected to the metal conductor through the plating films.

Abstract: An electronic component includes a multilayer body including a first insulator and a second insulator having a higher resistivity than the first insulator, metal conductors each positioned between the first insulator and the second insulator and including a predetermined end surface positioned at least near an end surface of the multilayer body, plating films each provided on the predetermined end surface of the metal conductor in a state extending out in a direction covering an end surface of the first insulator by a larger distance than in a direction covering an end surface of the second insulator, and an outer conductor provided on the outer sides of the plating films and electrically connected to the metal conductor through the plating films.

Abstract: A ferrite substrate includes first and second magnetic material layers and first and second nonmagnetic material layers sandwiching the magnetic material layers therebetween. A surface of the first nonmagnetic material layer on an opposite side to the second magnetic material layer is a second main surface of the ferrite substrate. The first nonmagnetic material layer includes a first recess, a second recess, and a wiring conductor. The first recess is open to the second main surface and a first side, and includes a non-linear inner wall surface in a plan view. The wiring conductor is exposed to the inner wall surface of the first recess. An outer surface conductor on the inner wall surface of the first recess is connected to the wiring conductor.