Patents by Inventor Narinder Singh Bains

Narinder Singh Bains has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating catalysts and electronic packaging substrates plated therewith
    Patent number: 6680273
    Abstract: Disclosed are new catalysts for electroless metallization deposition, particularly catalysts that can be selectively activated and may be free of palladium and/or tin. Catalysts of the invention are preferably employed for electroless copper deposition.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: January 20, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Martin T. Goosey, Narinder Singh Bains
  • Plating catalysts and electronic packaging substrates plated therewith
    Publication number: 20020069788
    Abstract: Disclosed are new catalysts for electroless metallization deposition, particularly catalysts that can be selectively activated and may be free of palladium and/or tin. Catalysts of the invention are preferably employed for electroless copper deposition.
    Type: Application
    Filed: October 24, 2001
    Publication date: June 13, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Martin T. Goosey, Narinder Singh Bains