Patents by Inventor Narsmoul KARAYA, JR.

Narsmoul KARAYA, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140008234
    Abstract: A metal underlayer is selectively plated on semiconductor wafers immediately followed by plating copper on the metal underlayer using a low internal stress copper plating bath. Additional metallization may be done to build up the metal layers using conventional metal plating baths and methods to form current tracks. Formation of metal silicides is avoided. Good adhesion of the metals to the semiconductors is achieved. The metalized semiconductors may be used in the manufacture of photovoltaic devices.
    Type: Application
    Filed: July 9, 2012
    Publication date: January 9, 2014
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Lingyun WEI, Gary HAMM, Narsmoul KARAYA, JR.