Abstract: In a flip shop mounting method by no-flow underfill in which resin 54 is pre-coated on a substrate 52, and a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, the substrate 52 is placed on an upper surface of a base 11 of a reflow jig 10, the resin 54 highly filled with filler 55 is applied onto the substrate 52, the semiconductor 50 with bump is mounted at a predetermined position over the substrate 52, a press plate 21 is placed on an upper portion of the semiconductor 50, a spacer 13 is interposed between a lower surface of the press plate 21 and an upper surface of the base 11 to regulate an amount of press force of the press plate 21, and horizontal movement of the press plate 21 is regulated by positioning guide pins 15 on the upper surface of the base 11.

Abstract: In a flip shop mounting method by a no-flow underfill in which resin is pre-coated on a substrate 52, and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, a resin 54a highly filed with the filler 55 is applied to a region except for the pad electrode 53 on the substrate 52, a resin 54b being free from the filler is applied to a pad electrode 53 portion on the substrate 52, and, thereafter, the semiconductor 50 with bump is mounted at a predetermined position on the substrate 52.

Abstract: Problem In a flip chip mounting method by a no-flow underfill, when a resin highly filled with the filler is pre-coated on a substrate, a bump is brought into reliable contact with a pad electrode without sandwich the filler between the bump of a semiconductor and the pad electrode on the substrate to make it possible to reliably perform reflow soldering. Solving Means In a flip chip mounting method by a no-flow underfill in which resin is pre-coated on a substrate 52, and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, a resin 54a highly filled with the filler 55 is applied to a region except for the pad electrode 53 on the substrate 52, a resin 54b being free from the filler is applied to a pad electrode 53 portion on the substrate 52, and, thereafter, the semiconductor 50 with bump is mounted at a predetermined position on the substrate 52.

Abstract: Problem In a flip chip mounting method by a no-flow underfill, when a resin highly filled with the filler is pre-coated on a substrate to mount a semiconductor, a bump is brought into reliable contact with a pad electrode of a substrate to make it possible to reliably perform reflow soldering.