Patents by Inventor Narumasa Domae

Narumasa Domae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8633276
    Abstract: A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: January 21, 2014
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Narumasa Domae, Tomoko Kato, Kazumi Nakayoshi
  • Publication number: 20110188213
    Abstract: A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.
    Type: Application
    Filed: May 12, 2009
    Publication date: August 4, 2011
    Inventors: Narumasa Domae, Tomoko Kato, Kazumi Nakayoshi