Patents by Inventor Narumi Une

Narumi Une has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive thermoplastic resin compositions and related applications
    Patent number: 9090751
    Abstract: Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: July 28, 2015
    Assignee: Ticona LLC
    Inventors: Yuji Saga, Narumi Une
  • THERMALLY CONDUCTIVE THERMOPLASTIC RESIN COMPOSITIONS AND RELATED APPLICATIONS
    Publication number: 20130003416
    Abstract: Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.
    Type: Application
    Filed: July 21, 2010
    Publication date: January 3, 2013
    Inventors: Yuji Saga, Narumi Une
  • Method for integrating heat transfer members, and an LED device
    Patent number: 8127445
    Abstract: Disclosed is a method for integrating at least two heat transfer members to provide an integrated composite member, the method comprising: a) disposing the at least two heat transfer members in a mold cavity, such that said heat transfer members each have at least one exposed surface forming a surface of a resin injection cavity; and b) injecting a thermally conductive resin into the resin injection cavity to contact the exposed surfaces of the at least two heat transfer members, to form the integrated composite member; wherein the thermally conductive resin has a thermal conductivity of at least 0.7 W/mK or higher.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: March 6, 2012
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Yuji Saga, Narumi Une, Yoshinobu Uchida
  • METHOD FOR INTEGRATING HEAT TRANSFER MEMBERS,AND AN LED DEVICE
    Publication number: 20090251864
    Abstract: Disclosed is a method for integrating at least two heat transfer members to provide an integrated composite member, the method comprising: a) disposing the at least two heat transfer members in a mold cavity, such that said heat transfer members each have at least one exposed surface forming a surface of a resin injection cavity; and b) injecting a thermally conductive resin into the resin injection cavity to contact the exposed surfaces of the at least two heat transfer members, to form the integrated composite member; wherein the thermally conductive resin has a thermal conductivity of at least 0.7 W/mK or higher.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 8, 2009
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Yuji Saga, Narumi Une, Yoshinobu Uchida
  • Polyamide composition for molding
    Publication number: 20040214948
    Abstract: A polyamide composition for molded products having thin-wall parts and for connectors for use in automobiles, containing:
    Type: Application
    Filed: May 20, 2004
    Publication date: October 28, 2004
    Inventors: Ryuichi Hayashi, Reiko Koshida, Narumi Une, Shiego Ishizuka, Tomoo Tanaka
  • Polyamide composition for molding
    Publication number: 20030134980
    Abstract: A polyamide composition for molded products having thin-wall parts and for connectors for use in automobiles, containing:
    Type: Application
    Filed: December 3, 2002
    Publication date: July 17, 2003
    Inventors: Ryuichi Hayashi, Reiko Koshida, Narumi Une, Shiego Ishizuka, Tomoo Tanaka