Patents by Inventor Narutaka MAKINO

Narutaka MAKINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for manufacturing filament three-dimensional bonded member and method for manufacturing filament three-dimensional bonded member
    Patent number: 10889071
    Abstract: In a device for manufacturing a filament three-dimensional bonded member includes: a molten filament supply device which supplies a plurality of molten filaments; a three-dimensional structure formation device which receives and then cools and solidifies the molten filaments so as to form a filament three-dimensional bonded member; and a controller which controls the molten filament supply device and the three-dimensional structure formation device, a hardness index measurement device is provided which measures the hardness index of the filament three-dimensional bonded member that is brought into a cooled state by the three-dimensional structure formation device, and the controller uses the information of the measurement of the hardness index measurement device that is fed back and thereby performs feedback control on at least one of the molten filament supply device and the three-dimensional structure formation device so as to reduce a variation in the hardness of the formed filament three-dimensional bonde
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: January 12, 2021
    Assignee: airweave inc.
    Inventors: Masakazu Kojima, Masashi Fuchigami, Narutaka Makino, Akira Mizuno
  • DEVICE FOR MANUFACTURING FILAMENT THREE-DIMENSIONAL BONDED MEMBER AND METHOD FOR MANUFACTURING FILAMENT THREE-DIMENSIONAL BONDED MEMBER
    Publication number: 20180147792
    Abstract: In a device for manufacturing a filament three-dimensional bonded member includes: a molten filament supply device which supplies a plurality of molten filaments; a three-dimensional structure formation device which receives and then cools and solidifies the molten filaments so as to form a filament three-dimensional bonded member; and a controller which controls the molten filament supply device and the three-dimensional structure formation device, a hardness index measurement device is provided which measures the hardness index of the filament three-dimensional bonded member that is brought into a cooled state by the three-dimensional structure formation device, and the controller uses the information of the measurement of the hardness index measurement device that is fed back and thereby performs feedback control on at least one of the molten filament supply device and the three-dimensional structure formation device so as to reduce a variation in the hardness of the formed filament three-dimensional bonde
    Type: Application
    Filed: September 14, 2016
    Publication date: May 31, 2018
    Applicant: airweave inc.
    Inventors: Masakazu KOJIMA, Masashi FUCHIGAMI, Narutaka MAKINO, Akira MIZUNO