Patents by Inventor Narutoshi Murasugi
Narutoshi Murasugi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9492867Abstract: A forming die assembly for microcomponents includes a forming die and a punch. The forming die is formed with a cavity, a punch hole connected to the cavity, and a supply path for supplying a raw material with a metal powder and a binder having plasticity. The supply path is connected to the cavity so as to have a gate therebetween and is used for supplying the raw material into the cavity. The punch is slidably inserted into the punch hole, and it opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.Type: GrantFiled: October 24, 2011Date of Patent: November 15, 2016Assignee: HITACHI POWDERED METALS CO., LTD.Inventors: Narutoshi Murasugi, Kazunori Maekawa, Zenzo Ishijima
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Patent number: 8851872Abstract: A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with a cavity, a storage portion for storing a raw material with a metal powder and a binder having plasticity, and a punch hole that connects the cavity and the storage portion so as to form a gate therebetween. The plunger is formed so as to be slidably inserted into the storage portion and to fill the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger in the sliding direction of the plunger and opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.Type: GrantFiled: October 24, 2011Date of Patent: October 7, 2014Assignee: Hitachi Powdered Metals Co., Ltd.Inventors: Narutoshi Murasugi, Kazunori Maekawa, Zenzo Ishijima
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Patent number: 8850494Abstract: A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with an outer die, an inner die, a storage portion formed at the inner die, and a punch hole formed at the inner die. The inner die slidably inserted into the outer die forms a part of a cavity between the inner die and the outer die. The storage portion stores a raw material with a metal powder and a binder having plasticity. The punch hole connects the cavity and the storage portion and forms a gate therebetween. The plunger slidably inserted into the storage portion fills the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger, and it closes the gate and compresses the raw material in the cavity.Type: GrantFiled: October 24, 2011Date of Patent: September 30, 2014Assignee: Hitachi Powdered Metals Co., LtdInventors: Narutoshi Murasugi, Kazunori Maekawa, Zenzo Ishijima
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Publication number: 20120107444Abstract: A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with an outer die, an inner die, a storage portion formed at the inner die, and a punch hole formed at the inner die. The inner die slidably inserted into the outer die forms a part of a cavity between the inner die and the outer die. The storage portion stores a raw material with a metal powder and a binder having plasticity. The punch hole connects the cavity and the storage portion and forms a gate therebetween. The plunger slidably inserted into the storage portion fills the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger, and it closes the gate and compresses the raw material in the cavity.Type: ApplicationFiled: October 24, 2011Publication date: May 3, 2012Applicant: HITACHI POWDERED METALS CO., LTD.Inventors: Narutoshi MURASUGI, Kazunori MAEKAWA, Zenzo ISHIJIMA
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Publication number: 20120107445Abstract: A forming die assembly for microcomponents includes a forming die, a plunger, and a punch. The forming die is formed with a cavity, a storage portion for storing a raw material with a metal powder and a binder having plasticity, and a punch hole that connects the cavity and the storage portion so as to form a gate therebetween. The plunger is formed so as to be slidably inserted into the storage portion and to fill the raw material stored in the storage portion into the cavity through the punch hole. The punch is slidably inserted into the plunger in the sliding direction of the plunger and opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.Type: ApplicationFiled: October 24, 2011Publication date: May 3, 2012Applicant: HITACHI POWDERED METALS CO., LTD.Inventors: Narutoshi MURASUGI, Kazunori MAEKAWA, Zenzo ISHIJIMA
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Publication number: 20120107434Abstract: A forming die assembly for microcomponents includes a forming die and a punch. The forming die is formed with a cavity, a punch hole connected to the cavity, and a supply path for supplying a raw material with a metal powder and a binder having plasticity. The supply path is connected to the cavity so as to have a gate therebetween and is used for supplying the raw material into the cavity. The punch is slidably inserted into the punch hole, and it opens and closes the gate by reciprocatory sliding. The punch closes the gate and compresses the raw material in the cavity into a green compact by sliding in the direction of the cavity.Type: ApplicationFiled: October 24, 2011Publication date: May 3, 2012Applicant: HITACHI POWDERED METALS CO., LTD.Inventors: Narutoshi MURASUGI, Kazunori MAEKAWA, Zenzo ISHIJIMA
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Patent number: 7666348Abstract: A production method includes: preparing a metal powder composed of one of Mo and W, and a binder composed of a thermoplastic resin and a wax; mixing the metal powder and 40 to 60 volume % of the binder with respect to the metal powder into a mixed powder; and heating and kneading the mixed powder into a raw material. The production method further includes: supplying a predetermined of the raw material in a hole of a die; and compacting the raw material into a cup-shaped green compact by pressing the raw material by a punch, the cup-shaped green compact having a cylindrical portion, a bottom formed at one end portion thereof, and an opening formed at another end portion thereof. The production method further includes: ejecting the cup-shaped green compact from the hole of the die; removing the binder from the ejected cup-shaped green compact by heating; and sintering the cup-shaped green compact by heating the green compact and diffusion-bonding particles of the green compact.Type: GrantFiled: May 8, 2006Date of Patent: February 23, 2010Assignee: Hitachi Powdered Metals Co., Ltd.Inventors: Zenzo Ishijima, Masahiro Okahara, Narutoshi Murasugi
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Publication number: 20060257279Abstract: A production method includes: preparing a metal powder composed of one of Mo and W, and a binder composed of a thermoplastic resin and a wax; mixing the metal powder and 40 to 60 volume % of the binder with respect to the metal powder into a mixed powder; and heating and kneading the mixed powder into a raw material. The production method further includes: supplying a predetermined of the raw material in a hole of a die; and compacting the raw material into a cup-shaped green compact by pressing the raw material by a punch, the cup-shaped green compact having a cylindrical portion, a bottom formed at one end portion thereof, and an opening formed at another end portion thereof. The production method further includes: ejecting the cup-shaped green compact from the hole of the die; removing the binder from the ejected cup-shaped green compact by heating; and sintering the cup-shaped green compact by heating the green compact and diffusion-bonding particles of the green compact.Type: ApplicationFiled: May 8, 2006Publication date: November 16, 2006Applicant: Hitachi Powdered Metals Co., Ltd.Inventors: Zenzo Ishijima, Masahiro Okahara, Narutoshi Murasugi