Patents by Inventor Nate Baxter

Nate Baxter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low k ILD layer with a hydrophilic portion
    Patent number: 7241706
    Abstract: Embodiments of the invention provide a relatively hydrophilic layer in a low k dielectric layer. The hydrophilic layer may be formed by exposing the dielectric layer to light having enough energy to break Si—C and C—C bonds but not enough to break Si—O bonds.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: July 10, 2007
    Assignee: Intel Corporation
    Inventors: Steven W. Johnston, Nate Baxter
  • Low k ILD layer with a hydrophilic portion
    Publication number: 20060057838
    Abstract: Embodiments of the invention provide a relatively hydrophilic layer in a low k dielectric layer. The hydrophilic layer may be formed by exposing the dielectric layer to light having enough energy to break Si—C and C—C bonds but not enough to break Si—O bonds.
    Type: Application
    Filed: September 16, 2004
    Publication date: March 16, 2006
    Inventors: Steven Johnston, Nate Baxter
  • Electroplating bath composition and method of using
    Patent number: 6893550
    Abstract: The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: May 17, 2005
    Assignee: Intel Corporation
    Inventors: Valery Dubin, Kimin Hong, Nate Baxter
  • Electroplating bath composition and method of using
    Publication number: 20050014014
    Abstract: The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.
    Type: Application
    Filed: August 12, 2004
    Publication date: January 20, 2005
    Inventors: Valery Dubin, Kimin Hong, Nate Baxter
  • Electroplating bath composition
    Patent number: 6491806
    Abstract: The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: December 10, 2002
    Assignee: Intel Corporation
    Inventors: Valery Dubin, Kimin Hong, Nate Baxter
  • Electroplating bath composition and method of using
    Publication number: 20020036145
    Abstract: The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced.
    Type: Application
    Filed: October 3, 2001
    Publication date: March 28, 2002
    Inventors: Valery Dubin, Kimin Hong, Nate Baxter