Patents by Inventor Nathan BAYS

Nathan BAYS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SPECTRAL ENCODING OF TISSUE BEHAVIOR
    Publication number: 20260193587
    Abstract: Systems, methods, and non-transitory computer readable medium are disclosed for encoding tissue behavior. A bioreactor may be implemented, where the bioreactor comprises a device configured for growing tissue and a sensor assembly configured to detect functional response(s) of a tissue within the device. The systems and methods may also include a control unit communicatively coupled to the bioreactor and configured to obtain, from the bioreactor, waveform(s) comprising functional response(s) of the tissue within the device over a time frame. The control unit may also be configured to transform the one or more waveforms to spectral representation(s) that provide frequency-based characterizations of the functional response(s) of the tissue during the time frame thereby encoding a behavior of the tissue.
    Type: Application
    Filed: November 27, 2023
    Publication date: July 9, 2026
    Inventors: Nathan Bays, Brian Schriver
  • AUTOMATED OVERLAY REMOVAL DURING WAFER SINGULATION
    Publication number: 20260130153
    Abstract: In some examples, a device comprises a wafer chuck, a member having a surface facing the wafer chuck, a blade supported by the surface, a first vacuum nozzle extending through the member and having a first vacuum orifice facing a same direction as the surface, and a second vacuum nozzle extending through the member and having a second vacuum orifice facing the same direction as the surface. The first and second vacuum orifices are on opposing sides of the blade.
    Type: Application
    Filed: December 18, 2025
    Publication date: May 7, 2026
    Inventors: Andrew NELSON, John C. EHMKE, Daryl R. KOEHL, Nathan BAYS
  • Automated overlay removal during wafer singulation
    Patent number: 12525444
    Abstract: In some examples, a device comprises a wafer chuck, a member having a surface facing the wafer chuck, a blade supported by the surface, a first vacuum nozzle extending through the member and having a first vacuum orifice facing a same direction as the surface, and a second vacuum nozzle extending through the member and having a second vacuum orifice facing the same direction as the surface. The first and second vacuum orifices are on opposing sides of the blade.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: January 13, 2026
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Andrew Nelson, John C. Ehmke, Daryl R. Koehl, Nathan Bays
  • AUTOMATED OVERLAY REMOVAL DURING WAFER SINGULATION
    Publication number: 20230238234
    Abstract: In some examples, a device comprises a wafer chuck, a member having a surface facing the wafer chuck, a blade supported by the surface, a first vacuum nozzle extending through the member and having a first vacuum orifice facing a same direction as the surface, and a second vacuum nozzle extending through the member and having a second vacuum orifice facing the same direction as the surface. The first and second vacuum orifices are on opposing sides of the blade.
    Type: Application
    Filed: July 29, 2022
    Publication date: July 27, 2023
    Inventors: Andrew NELSON, John C. EHMKE, Daryl R. KOEHL, Nathan BAYS