Patents by Inventor Nathan Bohannon

Nathan Bohannon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selection of polishing parameters to generate removal or pressure profile
    Patent number: 10493590
    Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
    Type: Grant
    Filed: December 14, 2015
    Date of Patent: December 3, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
  • Selection of Polishing Parameters to Generate Removal or Pressure Profile
    Publication number: 20160096251
    Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
    Type: Application
    Filed: December 14, 2015
    Publication date: April 7, 2016
    Applicant: Applied Materials, Inc.
    Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
  • Selection of polishing parameters to generate removal or pressure profile
    Patent number: 9213340
    Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: December 15, 2015
    Assignee: Applied Materials, Inc.
    Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
  • Selection of Polishing Parameters to Generate Removal or Pressure Profile
    Publication number: 20140277670
    Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
    Type: Application
    Filed: June 2, 2014
    Publication date: September 18, 2014
    Applicant: Applied Materials, Inc.
    Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
  • Selection of polishing parameters to generate removal profile
    Patent number: 8774958
    Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: July 8, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang
  • SELECTION OF POLISHING PARAMETERS TO GENERATE REMOVAL PROFILE
    Publication number: 20120277897
    Abstract: Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 1, 2012
    Inventors: Huanbo Zhang, Garrett Ho Yee Sin, King Yi Heung, Nathan Bohannon, Qing Zhang