Patents by Inventor Nathan Fritz

Nathan Fritz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230348074
    Abstract: The present disclosure is generally directed to methods and systems for heating the exterior surface of a bulk medium such as an aircraft. An exemplary system includes a series of individual heating elements, a sensor, and a control system. The heating elements are arranged on a skin of the an aircraft. The sensor is positioned on the skin in a location that corresponds with a region of relatively low temperature within a heating pattern produced by the heating elements. The control system is connected to the heating elements and the sensor. The control system configured to control power supplied to the heating elements responsive to output from the sensor.
    Type: Application
    Filed: July 28, 2021
    Publication date: November 2, 2023
    Inventors: Alexandru Bratianu-Badea, Ruben Toubiana, Christopher Buenrostro, Nathan Fritz, Curtis Serrano
  • Patent number: 10186465
    Abstract: Embodiments of the invention include package substrates that include microchannels and methods of making such package substrates. In an embodiment, the package substrate may include a first package layer. In some embodiments, a bottom channel wall may be formed over the first package layer. Embodiments may also include a channel sidewall that is formed in contact with the bottom channel wall. An organic dielectric layer may be formed over the first package layer. However, embodiments include a package substrate where the dielectric layer is not present within a perimeter of the channel sidewall. Additionally, a top channel wall may be supported by the channel sidewall. According to an embodiment, the top channel wall, the channel sidewall, and the bottom channel wall define a microchannel.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: January 22, 2019
    Assignee: Intel Corporation
    Inventors: Feras Eid, Adel A. Elsherbini, Henning Braunisch, Yidnekachew S. Mekonnen, Krishna Bharath, Mathew J. Manusharow, Aleksandar Aleksov, Nathan Fritz
  • Publication number: 20180226310
    Abstract: Embodiments of the invention include package substrates that include microchannels and methods of making such package substrates. In an embodiment, the package substrate may include a first package layer. In some embodiments, a bottom channel wall may be formed over the first package layer. Embodiments may also include a channel sidewall that is formed in contact with the bottom channel wall. An organic dielectric layer may be formed over the first package layer. However, embodiments include a package substrate where the dielectric layer is not present within a perimeter of the channel sidewall. Additionally, a top channel wall may be supported by the channel sidewall. According to an embodiment, the top channel wall, the channel sidewall, and the bottom channel wall define a microchannel.
    Type: Application
    Filed: September 25, 2015
    Publication date: August 9, 2018
    Inventors: Feras EID, Adel A. ELSHERBINI, Henning BRAUNISCH, Yidnekachew MEKONNEN, Krishna BHARATH, Mathew J. MANUSHAROW, Aleksandar ALEKSOV, Nathan FRITZ
  • Patent number: 8765512
    Abstract: This invention discloses and claims a cost-effective, wafer-level package process for microelectromechanical devices (MEMS). Specifically, the movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. An overcoat polymer, such as, epoxycyclohexyl polyhedral oligomeric silsesquioxanes (EPOSS) has been used as a mask material to pattern the sacrificial polymer as well as overcoat the air-cavity. The resulting air-cavities are clean, debris-free, and robust. The cavities have substantial strength to withstand molding pressures during lead-frame packaging of the MEMS devices. A wide range of cavities from 20 ?m×400 ?m to 300 ?m×400 ?m have been fabricated and shown to be mechanically stable. These could potentially house MEMS devices over a wide range of sizes. The strength of the cavities has been investigated using nano-indentation and modeled using analytical and finite element techniques.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: July 1, 2014
    Assignee: Georgia Tech Research Corporation
    Inventors: Paul A Kohl, Rajarshi Saha, Nathan Fritz
  • Publication number: 20120219793
    Abstract: Embodiments of the present disclosure include functionalized polyhedral oligomeric silsesquioxane compositions or mixtures, methods of using functionalized polyhedral oligomeric silsesquioxane compositions, structures including functionalized polyhedral oligomeric silsesquioxane, and the like.
    Type: Application
    Filed: November 9, 2010
    Publication date: August 30, 2012
    Inventors: Nathan Fritz, Paul Kohl, Rajarshi Saha