Abstract: Disclosed embodiments include compliant sensors having a signal electrode layer of an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to at least one sensor, and a perimeter electrode region. The compliant sensors also include a dielectric layer including an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region and a top electrode layer including an elastomeric material with conducting material integrated within and in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region. In some embodiments, the top electrode layer includes a portion of electrically conducting material configured in a hatched pattern.

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.

Abstract: Disclosed embodiments include compliant sensors having a signal electrode layer of an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor, and a perimeter electrode region. The compliant sensors also include a dielectric layer including an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region and a top electrode layer including an elastomeric material with conducting material integrated within and in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region. In some embodiments, the top electrode layer includes a portion of electrically conducting material configured in a hatched pattern.

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.

Abstract: Disclosed embodiments include systems and methods for additively manufacturing (e.g., by “printing” or the like) a bend sensor as a 2D structure that can then be configured into a 3D or stacked structure. Further disclosed embodiments include bend sensors with foldable sensing regions configurable into a 3D or stacked structure. A differential strain in a sensing region is linearly proportional to the displacement as measured from the endpoints of the sensing region. The differential strain is measurable as a differential change in the capacitance of the sensing regions.

Abstract: Disclosed embodiments include compliant sensors having a signal electrode layer of an elastomeric material with conducting material confined to at least one sensor region, at least one trace connected to the at least one sensor, and a perimeter electrode region. The compliant sensors also include a dielectric layer including an elastomeric material having a first side in contact with the signal electrode layer and configured to allow electrical contact to the perimeter electrode region and a top electrode layer including an elastomeric material with conducting material integrated within and in contact with a second side of the dielectric layer and in electrical contact with the perimeter electrode region. In some embodiments, the top electrode layer includes a portion of electrically conducting material configured in a hatched pattern.