Patents by Inventor Nathan Ip
Nathan Ip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250029847Abstract: Aspects of the present disclosure provide a wafer bonding system, which, for example, can include a wafer bonding tool configured to bond a first wafer and a second wafer to each other in accordance with a first wafer bonding recipe to produce a first post-bond wafer, a metrology tool integrated with the wafer bonding tool, and a tool controller coupled to the wafer bonding tool and the metrology tool. The metrology tool can be configured to measure a physical parameter of the first wafer. The physical parameter of the first wafer representing information relates to topographical features of the first wafer. The tool controller can have a model of a wafer bonding process. The model can include an input indicative of the physical parameter of the first wafer and configured to generate the first wafer bonding recipe based, at least in part, on the physical parameter of the first wafer.Type: ApplicationFiled: July 19, 2023Publication date: January 23, 2025Applicant: Tokyo Electron LimitedInventor: Nathan IP
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Publication number: 20240250059Abstract: An apparatus for handling a semiconductor wafer includes an upper wafer holder that has a front surface, and a compliant ring that is mounted around the upper wafer holder and has a front surface. The front surface of the compliant ring is flush with the front surface of the upper wafer holder and extends from the front surface of the upper wafer holder in a radial direction without extending beyond the front surface of the wafer holder in an axial direction. A method includes providing a first wafer with a bonding surface and back surface, the back surface of the wafer in contact with the front surfaces of the wafer holder and the compliant ring. The first wafer contacts a second wafer so a bond forms between the wafers in a radial direction, the compliant ring flexibly restricting the movement of the first wafer relative to the second wafer.Type: ApplicationFiled: December 5, 2023Publication date: July 25, 2024Inventors: Christopher NETZBAND, Nathan IP
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Publication number: 20240063022Abstract: An embodiment method includes determining an upper vacuum condition, a lower vacuum condition, a bonding gap distance, and a striker pressure condition based on measuring residual distortions from a previously bonded wafer. The method includes applying the upper vacuum condition to an upper wafer using an upper wafer holder, the upper vacuum condition applied to a backside of the upper wafer, and the upper wafer having a front side being opposite of the backside. The method includes applying the lower vacuum condition to a lower wafer using a lower wafer holder. The method includes positioning the front side of the upper wafer over the front side of the lower wafer to create the bonding gap distance between the upper wafer and the lower wafer and striking the backside of the upper wafer with a striker using the striker pressure condition to bond the front side of the upper wafer and the front side of the lower wafer together.Type: ApplicationFiled: August 15, 2023Publication date: February 22, 2024Inventors: Christopher Michael Netzband, Nathan Ip
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Patent number: 11868119Abstract: Sensitivity calculations are provided of a process model through the rate of change of a model fingerprint with respect to process variables and defects. A fingerprint sensitivity table is generated, where process variables are associated with a set of fingerprint sensitivities. The fingerprint of incoming substrates is monitored through a production process by applying the same fingerprint method that is used in the process model. Calculations are made of the difference between the incoming substrate fingerprint and the process model predicted fingerprint. This difference fingerprint is compared against the table of fingerprint sensitivities to find the process variable most likely to be responsible for the difference. Spatial relationships between process variables and actual measurements on the substrate may be obtained. Correlation through fingerprint sensitivity improves the ability to pinpoint faulty process tools. The difference fingerprint may also identify the formation of defects on a substrate.Type: GrantFiled: September 24, 2021Date of Patent: January 9, 2024Assignee: Tokyo Electron LimitedInventors: Nathan Ip, Megan Wooley
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Publication number: 20230234188Abstract: A wafer bonding apparatus including: a first chuck in a processing chamber, the first chuck being configured to hold a first wafer, the first chuck including: a chuck body, and a tunable stiffness layer including a plurality of actuators, the plurality of actuators including a tunable stiffness material, the tunable stiffness layer being disposed below the chuck body; a controller configured to send control signals to one or more of the plurality of actuators; and a vacuum line on the chuck body configured to apply a vacuum pressure from a vacuum pump to the first wafer; and a second chuck in the processing chamber, the second chuck being configured to hold a second wafer to be bonded with the first wafer; and where a stiffness of the plurality of actuators is configured to change based on the control signals from the controller.Type: ApplicationFiled: April 22, 2022Publication date: July 27, 2023Inventors: Nathan Ip, Nima Nejadsadeghi
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Publication number: 20230102438Abstract: Sensitivity calculations are provided of a process model through the rate of change of a model fingerprint with respect to process variables and defects. A fingerprint sensitivity table is generated, where process variables are associated with a set of fingerprint sensitivities. The fingerprint of incoming substrates is monitored through a production process by applying the same fingerprint method that is used in the process model. Calculations are made of the difference between the incoming substrate fingerprint and the process model predicted fingerprint. This difference fingerprint is compared against the table of fingerprint sensitivities to find the process variable most likely to be responsible for the difference. Spatial relationships between process variables and actual measurements on the substrate may be obtained. Correlation through fingerprint sensitivity improves the ability to pinpoint faulty process tools. The difference fingerprint may also identify the formation of defects on a substrate.Type: ApplicationFiled: September 24, 2021Publication date: March 30, 2023Inventors: Nathan Ip, Megan Wooley
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Patent number: 11594431Abstract: Various embodiments of wafer bonding apparatuses and methods are described herein for reducing distortion in a post-bonded wafer pair. More specifically, the present disclosure provides embodiments of wafer bonding apparatuses and methods to reduce post-bond wafer distortion that occurs primarily within the center and/or the edge of the post-bonded wafer pair. In the present disclosure, post-bonded wafer distortion is reduced by correcting for variations in the pre-bond wafer shapes. Variations in pre-bond wafer shape are corrected, or compensated for, by making hardware modifications to the wafer chuck. Such modifications may include, but are not limited to, modifications to the surface height and/or the temperature of the wafer chuck.Type: GrantFiled: April 21, 2021Date of Patent: February 28, 2023Assignee: Tokyo Electron LimitedInventor: Nathan Ip
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Patent number: 11574808Abstract: A plasma processing method that is executed by a plasma processing apparatus including a processing container containing a target substrate, a plurality of plasma sources, and a gas supply apparatus for supplying gas includes: supplying the gas from the gas supply apparatus into the processing container; individually controlling intensity of power introduced from each of the plurality of plasma sources into the processing container; and generating plasma of the gas by the intensity of the power introduced from each of the plurality of plasma sources and depositing a desired film on a second surface of the target substrate that is an opposite surface of a first surface of the target substrate so as to apply desired film stress to a film on the first surface.Type: GrantFiled: February 16, 2021Date of Patent: February 7, 2023Assignee: Tokyo Electron LimitedInventors: Satoshi Itoh, Norifumi Kohama, Soudai Emori, Nathan Ip
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Publication number: 20220344179Abstract: Various embodiments of wafer bonding apparatuses and methods are described herein for reducing distortion in a post-bonded wafer pair. More specifically, the present disclosure provides embodiments of wafer bonding apparatuses and methods to reduce post-bond wafer distortion that occurs primarily within the center and/or the edge of the post-bonded wafer pair. In the present disclosure, post-bonded wafer distortion is reduced by correcting for variations in the pre-bond wafer shapes. Variations in pre-bond wafer shape are corrected, or compensated for, by making hardware modifications to the wafer chuck. Such modifications may include, but are not limited to, modifications to the surface height and/or the temperature of the wafer chuck.Type: ApplicationFiled: April 21, 2021Publication date: October 27, 2022Inventor: Nathan Ip
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Patent number: 11435393Abstract: Described herein are techniques related to a semiconductor fabrication process that facilitates the enhancement of systemic conformities of patterns of the fabricated semiconductor wafer. A semiconductor wafer with maximized systemic conformities of patterns will maximize the electrical properties and/or functionality of the electronic devices formed as part of the fabricated semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: GrantFiled: November 2, 2018Date of Patent: September 6, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Carlos A. Fonseca, Nathan Ip, Joel Estrella
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Publication number: 20220262631Abstract: A plasma processing method that is executed by a plasma processing apparatus including a processing container containing a target substrate, a plurality of plasma sources, and a gas supply apparatus for supplying gas includes: supplying the gas from the gas supply apparatus into the processing container; individually controlling intensity of power introduced from each of the plurality of plasma sources into the processing container; and generating plasma of the gas by the intensity of the power introduced from each of the plurality of plasma sources and depositing a desired film on a second surface of the target substrate that is an opposite surface of a first surface of the target substrate so as to apply desired film stress to a film on the first surface.Type: ApplicationFiled: February 16, 2021Publication date: August 18, 2022Inventors: Satoshi ITOH, Norifumi KOHAMA, Soudai EMORI, Nathan IP
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Patent number: 11346882Abstract: Described herein are techniques related to a semiconductor fabrication process that facilitates the enhancement of systemic conformities of patterns of the fabricated semiconductor wafer. A semiconductor wafer with maximized systemic conformities of patterns will maximize the electrical properties and/or functionality of the electronic devices formed as part of the fabricated semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: GrantFiled: November 2, 2018Date of Patent: May 31, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Carlos A. Fonseca, Nathan Ip, Joel Estrella
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Patent number: 11335607Abstract: A method includes having a first wafer bonding recipe and a model of a wafer bonding process, the model comprising an input indicative of a physical parameter of a first wafer to be bonded to a second wafer and configured to output a wafer bonding recipe based on the physical parameter of the first wafer; obtaining measurements of the first wafer to obtain the physical parameter of the first wafer; generating, by the model, the first wafer bonding recipe based on the physical parameter of the first wafer; and bonding the first wafer to the second wafer in accordance with the first wafer bonding recipe to produce a first post-bond wafer.Type: GrantFiled: July 9, 2020Date of Patent: May 17, 2022Assignee: Tokyo Electron LimitedInventor: Nathan Ip
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Patent number: 11244873Abstract: In one embodiment, a method includes obtaining wafer measurements of a characteristic of a semiconductor wafer at each of a plurality of process steps during a semiconductor wafer fabrication process, where each of the wafer measurements is associated with a spatial location on the semiconductor wafer from which the measurement is obtained. The method may further include creating a process step fingerprint from the obtained wafer measurements for each process step. The method may further include correlating the process step fingerprint of one of the plurality of process steps to the process step fingerprint of another one of the plurality of process steps to produce a transfer function.Type: GrantFiled: October 28, 2019Date of Patent: February 8, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Carlos A. Fonseca, Nathan Ip
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Publication number: 20220013416Abstract: A method includes having a first wafer bonding recipe and a model of a wafer bonding process, the model comprising an input indicative of a physical parameter of a first wafer to be bonded to a second wafer and configured to output a wafer bonding recipe based on the physical parameter of the first wafer; obtaining measurements of the first wafer to obtain the physical parameter of the first wafer; generating, by the model, the first wafer bonding recipe based on the physical parameter of the first wafer; and bonding the first wafer to the second wafer in accordance with the first wafer bonding recipe to produce a first post-bond wafer.Type: ApplicationFiled: July 9, 2020Publication date: January 13, 2022Inventor: Nathan Ip
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Publication number: 20200135592Abstract: In one embodiment, a method includes obtaining wafer measurements of a characteristic of a semiconductor wafer at each of a plurality of process steps during a semiconductor wafer fabrication process, where each of the wafer measurements is associated with a spatial location on the semiconductor wafer from which the measurement is obtained. The method may further include creating a process step fingerprint from the obtained wafer measurements for each process step. The method may further include correlating the process step fingerprint of one of the plurality of process steps to the process step fingerprint of another one of the plurality of process steps to produce a transfer function.Type: ApplicationFiled: October 28, 2019Publication date: April 30, 2020Inventors: Carlos A. Fonseca, Nathan Ip
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Patent number: 10622233Abstract: Disclosed herein is a technology related to the amelioration (e.g., correction) of global wafer distortion based on a determination of localized distortions of a semiconductor wafer. Herein, a distortion is either an out-of-plane distortion (OPD) or in-plane distortion (IPD). The reference plane for this distortion is based on the plane shared by the surface of a presumptively flat semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: GrantFiled: August 3, 2018Date of Patent: April 14, 2020Assignee: Tokyo Electron LimitedInventors: Joshua Hooge, Nathan Ip, Joel Estrella, Anton Devilliers
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Publication number: 20190137565Abstract: Described herein are techniques related to a semiconductor fabrication process that facilitates the enhancement of systemic conformities of patterns of the fabricated semiconductor wafer. A semiconductor wafer with maximized systemic conformities of patterns will maximize the electrical properties and/or functionality of the electronic devices formed as part of the fabricated semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: November 2, 2018Publication date: May 9, 2019Inventors: Carlos A. Fonseca, Nathan Ip, Joel Estrella
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Publication number: 20190139798Abstract: Described herein are techniques related to a semiconductor fabrication process that facilitates the enhancement of systemic conformities of patterns of the fabricated semiconductor wafer. A semiconductor wafer with maximized systemic conformities of patterns will maximize the electrical properties and/or functionality of the electronic devices formed as part of the fabricated semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: November 2, 2018Publication date: May 9, 2019Inventors: Carlos A. Fonseca, Nathan Ip, Joel Estrella
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Publication number: 20180342410Abstract: Disclosed herein is a technology related to the amelioration (e.g., correction) of global wafer distortion based on a determination of localized distortions of a semiconductor wafer. Herein, a distortion is either an out-of-plane distortion (OPD) or in-plane distortion (IPD). The reference plane for this distortion is based on the plane shared by the surface of a presumptively flat semiconductor wafer. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: August 3, 2018Publication date: November 29, 2018Inventors: Joshua Hooge, Nathan Ip, Joel Estrella, Anton deVilliers