Patents by Inventor Nathan Kreutter

Nathan Kreutter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070246158
    Abstract: The present invention provides a wiring board capable of realizing electrical connectivity even with connection leads having a fine pitch of 100 ?m or less. The present invention relates to a wiring board with adhesive film comprising: a wiring board, in which the surface of a connection terminal portion on the end of a connection lead on the wiring board has a non-flat shape formed by a plating method; and, an adhesive film that covers the surface of the connection terminal portion and contains either a thermoplastic resin or a thermoplastic, thermosetting resin.
    Type: Application
    Filed: April 21, 2006
    Publication date: October 25, 2007
    Inventors: Hideo Yamazaki, Yoshiyuki Ohkura, Nathan Kreutter, Shoji Takeuchi
  • Publication number: 20060234042
    Abstract: An etched dielectric film having an adhered etch stop layer for use in microfluidic devices. Channels, recesses, and other features can be etched into the films to make them suitable for use in microfluidic devices.
    Type: Application
    Filed: December 27, 2005
    Publication date: October 19, 2006
    Inventors: Rui Yang, Nathan Kreutter, Nanyakkara Somasiri
  • Publication number: 20060118830
    Abstract: Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.
    Type: Application
    Filed: January 5, 2006
    Publication date: June 8, 2006
    Inventors: Dennis Brunner, David Buster, Michael Graff, Daniel Luebbert, Nathan Kreutter, Rui Yang
  • Publication number: 20050167829
    Abstract: Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.
    Type: Application
    Filed: March 3, 2004
    Publication date: August 4, 2005
    Inventors: Dennis Brunner, David Buster, Michael Graff, Daniel Luebbert, Nathan Kreutter, Rui Yang, Guoping Mao